专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06462951B2 Securing heat sinks to electronic components 有权
标题翻译：将散热片固定在电子部件上
公开(公告)号：US06462951B2
公开(公告)日：2002-10-08
申请号：US09859591
申请日：2001-05-18
申请人： Fabien Letourneau
发明人： Fabien Letourneau
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A clip for holding a heat sink in heat conductive engagement with an integrated circuit mounted upon a substrate. The clip has a resilient beam for extending across the heat sink and two arms to extend down opposite edges of the heat sink and the substrate. The arms have free end extensions. When assembled, the heat sink and substrate sandwich between them the integrated circuit and a compression spring forming part of the clip, compresses the heat sink, integrated circuit and substrate together between the spring and the free end extensions. The compression spring is compressed in turn between the heat sink and the beam which is resiliently flexed away from the heat sink. The clip is devoid of screwthreaded attachments together with their disadvantages and the spring is the sole means of holding the assembly together. The beam of the clip may be spaced from a base of the heat sink so as not to extend across cooling air passages between heat transfer projections of the heat sink. The clip does not cause electrical shorting. Loosening of the clip cannot take place in the assembly. The clip is registered with the heat sink and with the substrate to accurately locate the heat sink relative to the integrated circuit. Cooling air is funnelled through a space defined by the beam, a base of the heat sink and the two arms so as to pass the air through air flow passages of the heat sink.
摘要翻译：用于保持与安装在基板上的集成电路导热接合的散热器的夹子。该夹子具有用于延伸穿过散热器的弹性梁和两个臂，以沿散热器和基板的相对边缘延伸。手臂有自由端延伸。组装时，散热器和基板夹在其间，集成电路和形成夹子部分的压缩弹簧将散热片，集成电路和基板压在弹簧与自由端延伸部之间。压缩弹簧依次被压缩在散热器和弹性弯曲远离散热器的梁之间。夹子没有螺纹连接件及其缺点，弹簧是将组件固定在一起的唯一手段。夹子的梁可以与散热器的基座间隔开，以便不延伸穿过散热器的传热突起之间的冷却空气通道。夹子不会导致电气短路。夹子松动不能在装配中发生。该夹子与散热器和基板一起登记，以相对于集成电路精确定位散热片。冷却空气通过由梁，散热器的底部和两个臂限定的空间漏斗，以便使空气通过散热器的空气流动通道。

2. 发明授权

US08534892B2 Controlled flaring light transmission device 有权
标题翻译：受控喇叭灯传输装置
公开(公告)号：US08534892B2
公开(公告)日：2013-09-17
申请号：US12847397
申请日：2010-07-30
申请人： Fabien Letourneau , Bevin G. Schmidt
发明人： Fabien Letourneau , Bevin G. Schmidt
IPC分类号： F21V7/04 , F21V11/00 , G02B5/02 , H01J5/16 , H01P5/00
CPC分类号： G02B27/0994 , G02B6/0008
摘要： Various exemplary embodiments relate to a light transmission device for transmitting light from at least one light source to an illuminated surface. The device may include at least one light entrance surface that allows entrance of light from the at least one light source; a light emitting surface with an area greater than the total area of the at least one light entrance surface; at least one light pipe portion extending from the at least one light entrance surface toward the illuminated surface wherein the light pipe portion internally reflects the light toward the illuminated surface; and a flared diffusion portion between the at least one light pipe portion and the light emitting surface wherein the diffusion portion internally reflects the light towards the light emitting surface. The device may be a solid piece of plastic. The light pipe portions may be curved to bend light toward the illuminated surface.
摘要翻译：各种示例性实施例涉及用于将光从至少一个光源传输到照明表面的光传输装置。所述装置可以包括至少一个光入射表面，其允许从所述至少一个光源入射光; 发光表面，其面积大于所述至少一个光入射表面的总面积; 至少一个光管部分，其从所述至少一个光入射表面延伸到所述照明表面，其中所述光管部分将所述光内部反射到所述被照射表面; 以及在所述至少一个光管部分和所述发光表面之间的扩张部分，其中所述扩散部分将所述光内部反射到所述发光表面。该装置可以是实心的塑料件。光管部分可以是弯曲的，以将光朝向被照射的表面弯曲。

3. 发明申请

US20100107397A1 METHOD OF INSTALLING VENTILATING FANS 有权
标题翻译：安装通风风机的方法
公开(公告)号：US20100107397A1
公开(公告)日：2010-05-06
申请号：US12266173
申请日：2008-11-06
申请人： Fabien Letourneau
发明人： Fabien Letourneau
IPC分类号： B23P11/02 , H05K7/20
CPC分类号： H05K7/20172 , H05K7/20581 , Y10T29/49876 , Y10T29/49899
摘要： An air-cooled electronic device includes a device housing having a bottom surface, and a motorized fan having a fan housing having a mounting hole, and having a hook projection secured to the bottom surface, the hook projection shaped and dimensioned to engage the mounting hole, and having an abutment, with the abutment, the hook and the mounting hole being arranged to secure the fan housing in a position without screws, rivets, or other hardware.
摘要翻译：一种风冷电子设备包括具有底面的设备壳体和具有安装孔的风扇壳体的机动风扇，并且具有固定到底表面的钩形突起，所述钩突起的形状和尺寸适于与安装孔接合并且具有邻接件，所述邻接件，所述钩和所述安装孔被布置成将所述风扇壳体固定在没有螺钉，铆钉或其它硬件的位置。

4. 发明申请

US20120026750A1 CONTROLLED FLARING LIGHT TRANSMISSION DEVICE 有权
标题翻译：控制光束传输装置
公开(公告)号：US20120026750A1
公开(公告)日：2012-02-02
申请号：US12847397
申请日：2010-07-30
申请人： Fabien Letourneau , Bevin G. Schmidt
发明人： Fabien Letourneau , Bevin G. Schmidt
IPC分类号： H01L33/02 , G02B5/02
CPC分类号： G02B27/0994 , G02B6/0008
摘要： Various exemplary embodiments relate to a light transmission device for transmitting light from at least one light source to an illuminated surface. The device may include at least one light entrance surface that allows entrance of light from the at least one light source; a light emitting surface with an area greater than the total area of the at least one light entrance surface; at least one light pipe portion extending from the at least one light entrance surface toward the illuminated surface wherein the light pipe portion internally reflects the light toward the illuminated surface; and a flared diffusion portion between the at least one light pipe portion and the light emitting surface wherein the diffusion portion internally reflects the light towards the light emitting surface. The device may be a solid piece of plastic. The light pipe portions may be curved to bend light toward the illuminated surface.
摘要翻译：各种示例性实施例涉及用于将光从至少一个光源传输到照明表面的光传输装置。所述装置可以包括至少一个光入射表面，其允许从所述至少一个光源入射光; 发光表面，其面积大于所述至少一个光入射表面的总面积; 至少一个光管部分，其从所述至少一个光入射表面延伸到所述照明表面，其中所述光管部分将所述光内部反射到所述照明表面; 以及在所述至少一个光管部分和所述发光表面之间的扩张部分，其中所述扩散部分将所述光内部反射到所述发光表面。该装置可以是实心的塑料件。光管部分可以是弯曲的，以将光朝向被照射的表面弯曲。

5. 发明申请

US20070264921A1 Ventilated housing and assembly 审中-公开
标题翻译：通风外壳和组装
公开(公告)号：US20070264921A1
公开(公告)日：2007-11-15
申请号：US11431364
申请日：2006-05-10
申请人： Fabien Letourneau , Bevin Schmidt , Nicholas Bundza
发明人： Fabien Letourneau , Bevin Schmidt , Nicholas Bundza
IPC分类号： E04F17/02
CPC分类号： H05K7/20009
摘要： A ventilated housing for accommodating one or more components comprises opposed first and second-spaced apart end portions. An air barrier extends at least partially between the first and second end portions for limiting movement of air inside the housing and defining an upper or lower surface of the housing. A first part of the air barrier proximate the first end portion is positioned at a level below the level of a second part of the air barrier proximate the second end portion. An inlet is defined for admitting air into the housing and an outlet is defined for discharging air from the housing. An ventilated housing assembly comprises first and second housings with an angled space between a lower air barrier of the first housing and an upper air barrier of the second housing.
摘要翻译：用于容纳一个或多个部件的通风外壳包括相对的第一和第二间隔开的端部。至少部分地在第一和第二端部之间延伸出一个空气屏障，以限制壳体内的空气的移动并限定外壳的上表面或下表面。靠近第一端部的空气阻挡件的第一部分被定位在靠近第二端部的空气阻挡件的第二部分的高度以下的水平。入口被限定为允许空气进入壳体，并且限定了用于从壳体排出空气的出口。通风的壳体组件包括第一和第二壳体，第一壳体和第二壳体在第一壳体的下部空气障壁和第二壳体的上部空气障壁之间具有倾斜的空间。

6. 发明授权

US07057904B2 Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates 失效
标题翻译：多部分电子电路组件，具有可拆卸的互连和锁定部件电路基板
公开(公告)号：US07057904B2
公开(公告)日：2006-06-06
申请号：US10896061
申请日：2004-07-22
申请人： Nicholas Bundza , Fabien Letourneau , Gregory William Cheshire
发明人： Nicholas Bundza , Fabien Letourneau , Gregory William Cheshire
IPC分类号： H05K7/14 , H05K7/18
CPC分类号： H04Q1/02 , H04Q1/023 , H04Q1/155 , H04Q2201/10 , H04Q2201/12
摘要： An assembly of releasably interconnected circuit substrates is provided. The assembly has a first and second circuit substrate. Each substrate provides an electrical connector for mating electrical engagement of the first and second substrates. The assembly also has a two-position lock that is operable between a first and second position. In the first position of the lock, the first and second circuit substrates are in locked interconnection with each other. In the second position of the lock, the first and second circuit substrates are separable from each other.
摘要翻译：提供可释放地互连的电路基板的组件。组件具有第一和第二电路基板。每个基板提供用于配合第一和第二基板的电接合的电连接器。组件还具有可在第一和第二位置之间操作的双位锁。在锁的第一位置，第一和第二电路基板彼此锁定互连。在锁的第二位置，第一和第二电路基板彼此分离。

7. 发明申请

US20090168348A1 HIGH DENSITY COMPONENT ASSEMBLY METHOD AND APPARATUS 有权
标题翻译：高密度组件组装方法和装置
公开(公告)号：US20090168348A1
公开(公告)日：2009-07-02
申请号：US11967756
申请日：2007-12-31
申请人： Fabien Letourneau , Stefano DeCecco , Peter Serjak
发明人： Fabien Letourneau , Stefano DeCecco , Peter Serjak
IPC分类号： H05K7/20 , H05K1/00
CPC分类号： H05K3/303 , H01L23/467 , H01L2924/0002 , H05K1/0272 , H05K3/301 , H05K2201/09072 , H05K2201/09127 , H05K2201/10522 , H05K2201/10598 , H05K2201/2018 , H05K2203/167 , Y02P70/613 , Y10T29/42 , Y10T29/435 , Y10T29/49126 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , H01L2924/00
摘要： Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.
摘要翻译：用于提供高密度组件组件的装置和方法，例如机电或电光组件。

8. 发明申请

US20090097212A1 Optimization of connector density and identification carrier for high density front plates 审中-公开
标题翻译：用于高密度前板的连接器密度和识别载体的优化
公开(公告)号：US20090097212A1
公开(公告)日：2009-04-16
申请号：US11907557
申请日：2007-10-15
申请人： Bevin Schmidt , Fabien Letourneau
发明人： Bevin Schmidt , Fabien Letourneau
IPC分类号： H05K1/00 , H01R12/14
CPC分类号： H04Q1/08 , H01R13/465 , H01R13/518 , H04Q1/136
摘要： A high connector density printed circuit board, and high connector density device containing the same, including one or more of the following: a face plate; a plurality of connector ports in the face plate; a tab integral with the face plate label and bent to extend away from the face plate; information printed on the tab; the tab forming a plane at an angle of ninety degrees with respect to the face plate; the tab fabricated from a material having a combination of a thickness and a stiffness minimally able to resist a deformation resulting from a force of gravity; a second tab that is integral with the face plate and bent to extend away from the face plate; and the tabs do not infringe on an adjacent space occupied by another high connector density printed circuit board.
摘要翻译：高连接器密度印刷电路板，以及包含以下的一个或多个的高连接器密度装置：面板; 面板中的多个连接器端口; 与面板标签一体形成的折片并弯曲以远离面板延伸; 标签上印有信息; 所述突片相对于所述面板形成90度角的平面; 由具有最小能够抵抗由重力引起的变形的厚度和刚度的组合的材料制成的突片; 与面板一体并弯曲以远离面板延伸的第二突片; 并且标签不会侵入由另一高连接器密度印刷电路板占据的相邻空间。

9. 发明申请

US20080013290A1 Printed circuit board thickness adaptors 有权
标题翻译：印刷电路板厚度适配器
公开(公告)号：US20080013290A1
公开(公告)日：2008-01-17
申请号：US11487506
申请日：2006-07-17
申请人： Simon Paul Creasy , Paul James Brown , Fabien Letourneau
发明人： Simon Paul Creasy , Paul James Brown , Fabien Letourneau
IPC分类号： H05K1/14
CPC分类号： H05K7/1418
摘要： A printed circuit board card comprising: a printed circuit board having a first thickness and having first and second edges for inserting into respective channels of card guides, the channels of the card guides for receiving printed circuit boards having a second thickness, the second thickness being greater than the first thickness; and, first and second thickness adaptors each having a third thickness applied at the first and second edges, respectively, a sum of the first and third thicknesses approximating the second thickness, to thereby align the printed circuit board in the channels of the card guides.
摘要翻译：一种印刷电路板卡，包括：印刷电路板，具有第一厚度并具有用于插入到卡导向器的相应通道中的第一和第二边缘，用于接收具有第二厚度的印刷电路板的卡引导件的通道，第二厚度大于第一厚度; 以及分别在第一和第二边缘处施加第三厚度的第一和第二厚度适配器，分别接近第二厚度的第一和第三厚度的总和，从而将印刷电路板对准卡引导件的通道。

10. 发明授权

US07663888B2 Printed circuit board thickness adaptors 有权
标题翻译：印刷电路板厚度适配器
公开(公告)号：US07663888B2
公开(公告)日：2010-02-16
申请号：US11487506
申请日：2006-07-17
申请人： Simon Paul Creasy , Paul James Brown , Fabien Letourneau
发明人： Simon Paul Creasy , Paul James Brown , Fabien Letourneau
IPC分类号： H05K1/14
CPC分类号： H05K7/1418
摘要： A printed circuit board card comprising: a printed circuit board having a first thickness and having first and second edges for inserting into respective channels of card guides, the channels of the card guides for receiving printed circuit boards having a second thickness, the second thickness being greater than the first thickness; and, first and second thickness adaptors each having a third thickness applied at the first and second edges, respectively, a sum of the first and third thicknesses approximating the second thickness, to thereby align the printed circuit board in the channels of the card guides.
摘要翻译：一种印刷电路板卡，包括：印刷电路板，具有第一厚度并具有用于插入到卡导向器的相应通道中的第一和第二边缘，用于接收具有第二厚度的印刷电路板的卡引导件的通道，第二厚度大于第一厚度; 以及分别在第一和第二边缘处施加第三厚度的第一和第二厚度适配器，分别接近第二厚度的第一和第三厚度的总和，从而将印刷电路板对准卡引导件的通道。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式