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1. 发明公开

US20230217586A1 LIGHT BOARD, METHOD FOR MANUFACTURING THE SAME, AND LED BACKLIGHT MODULE AND LED BACKLIGHT DEVICE 审中-公开
公开(公告)号：US20230217586A1
公开(公告)日：2023-07-06
申请号：US18091539
申请日：2022-12-30
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
发明人： Xinghan HE , Danlei GONG , Zhonghai YAN , Hua FAN , Fabo LIU , Youwei ZHAN , Weineng CHEN , Taotao SONG
IPC分类号： H05K1/02 , F21V19/00 , F21V29/70 , H05K3/40 , H05K3/30
CPC分类号： H05K1/0271 , F21V19/0025 , F21V29/70 , H05K1/0203 , H05K3/306 , H05K3/4038 , F21Y2105/10
摘要： Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.

2. 发明公开

US20230217580A1 POWER MODULE AND HEAT SINK SYSTEM 审中-公开
公开(公告)号：US20230217580A1
公开(公告)日：2023-07-06
申请号：US17867774
申请日：2022-07-19
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
发明人： Nianbin Cheng , Cheng Li , Lifang Liang , Yikai Yuan , Honggui Zhan , Xiangxuan Tan
IPC分类号： H05K1/02 , H05K3/28
CPC分类号： H05K1/021 , H05K3/284
摘要： Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.

3. 发明公开

US20230155092A1 LED DISPLAY UNIT GROUP AND DISPLAY PANEL 审中-公开
公开(公告)号：US20230155092A1
公开(公告)日：2023-05-18
申请号：US17910295
申请日：2021-03-25
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
发明人： Kuai Qin , Shaojia Xie , Feng Gu , Bin Cai , Kailiang Fan , Zhuang Peng
IPC分类号： H01L33/62 , H01L27/15 , H01L25/075 , H01L33/38
CPC分类号： H01L33/62 , H01L27/156 , H01L25/0753 , H01L33/38
摘要： Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.

4. 发明申请

US20230095880A1 LIGHT SOURCE MODULE AND BACKLIGHT DISPLAY MODULE 有权
公开(公告)号：US20230095880A1
公开(公告)日：2023-03-30
申请号：US17940512
申请日：2022-09-08
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
发明人： Weineng Chen , Danlei Gong , Hua Fan , Zhonghai Yan , Zihao Chen , Xiang Chen , Yushan Lin , Ke Yang , Fabo Liu
IPC分类号： G02F1/13357
摘要： Provided are a light source module and a backlight display module. The light source module includes a flexible printed circuit board and a plurality of side-emitting LEDs. The flexible printed circuit board extends along a central axis. The plurality of side-emitting LEDs are sequentially arranged along the central axis and bonded to the flexible printed circuit board, and a light-emitting surface of one side-emitting LED of the plurality of side-emitting LEDs is perpendicular to a bonding surface of the flexible printed circuit board.

5. 发明授权

US11016340B2 LED device, backlight module and display device 有权
公开(公告)号：US11016340B2
公开(公告)日：2021-05-25
申请号：US16908772
申请日：2020-06-23
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
发明人： Junhua Chen , Fabo Liu , Danlei Gong , Zhonghai Yan , Xiang Chen , Yao Weng
IPC分类号： G02F1/13357 , H01L33/56 , H01L33/60
摘要： The disclosure provides a LED device, a backlight module and a display device. The LED device includes: a bracket structure and a chip, the bracket structure having a cup cavity and the chip being mounted in the cup cavity; a packaging structure, the packaging structure being provided on the bracket structure in a covering manner to seal the cup cavity and an upper surface, far away from the cup cavity, of the packaging structure forming an emergent surface; and a reflective shielding layer, the reflective shielding layer being provided on the packaging structure and the reflective shielding layer being at a central position of the emergent surface and covering part of the emergent surface. According to the disclosure, the problem in the related art that it is impossible to consider both a good color saturation and brightness contrast of a display of a display device is solved.

6. 发明申请

US20210013386A1 Light-Emitting Diode Device, LED Lamp and Method for Machining Conductive Wire of LED Device 有权
公开(公告)号：US20210013386A1
公开(公告)日：2021-01-14
申请号：US16766716
申请日：2018-08-28
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
发明人： Ziheng ZENG , Zhiguo XIE , Fuhai LI , Libing PAN
IPC分类号： H01L33/62 , H01L33/48 , H01L33/54 , H01L25/075
摘要： Some embodiments of the disclosure provide an LED device, an LED lamp and a method for machining a conductive wire of an LED device. The Light-Emitting Diode (LED) device includes at least one LED chip, a bracket and at least one conductive wire. Each of the at least one conductive wire is of a three-dimensional structure and includes a vertical section, first stress cushioning section inclined obliquely upwards, second stress cushioning section inclined obliquely downwards and third stress cushioning section inclined obliquely downwards that are sequentially arranged. A first transition bending section, a second transition bending section and a third transition bending section are sequentially formed between the vertical section, the first stress cushioning section, the second stress cushioning section and the third stress cushioning section, the first transition bending section, the second transition bending section and the third transition bending section are sequentially arranged along a length direction of the conductive wire, and bending directions of the second transition bending section and the third transition bending section are opposite. One end of the conductive wire is configured to connect the LED chip, and the other end is configured to connect the bracket or another LED chip. The present invention also discloses an LED lamp and a method for machining a conductive wire of an LED device. The reliability of the LED device of the present invention is improved to a certain extent.

7. 发明授权

US11600606B2 LED display unit group with common A-electrode pads and display panel 有权
公开(公告)号：US11600606B2
公开(公告)日：2023-03-07
申请号：US17218389
申请日：2021-03-31
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
发明人： Junyong Wang , Qiang Zhao , Kuai Qin , Heng Guo , Feng Gu , Danwei Li , Bin Zhao , Hongwen Chen
IPC分类号： H01L25/075 , H01L33/62
摘要： Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N≥2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m≥2, n≥2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.

8. 发明申请

US20230029972A1 INTEGRATED CHIP AND MANUFACTURING METHOD THEREFOR, AND FULL-COLOR INTEGRATED CHIP AND DISPLAY PANEL 有权
公开(公告)号：US20230029972A1
公开(公告)日：2023-02-02
申请号：US17788151
申请日：2020-12-18
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
发明人： Kuai Qin , Heng Guo , Kailiang Fan , Caineng Huo , Zhuang Peng
IPC分类号： H01L33/62 , H01L25/075 , H01L23/544 , H01L33/32 , H01L33/44 , H01L33/46 , H01L33/50
摘要： A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step S1 and step S2. In step S1, a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S2, conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.

9. 发明申请

US20220376147A1 Full-color Light Emitting Device and Display Module 有权
公开(公告)号：US20220376147A1
公开(公告)日：2022-11-24
申请号：US17623268
申请日：2020-04-21
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
发明人： Yunyuan ZHANG , Jinhui ZHANG , Yikai YUAN , Cheng LI
IPC分类号： H01L33/50 , H01L25/075 , H01L33/60
摘要： The disclosure provides a full-color light emitting device and a display module. A light emitting layer, a refractive layer, a spacer layer and a light processing layer are included. The refractive layer is disposed above the light emitting layer, the spacer layer is disposed above the refractive layer, and the light processing layer is disposed above the spacer layer. The light emitting layer includes a first light emitting part, a second light emitting part and a third light emitting part. The light processing layer includes a first light processing part, a second light processing part, and a third light processing part, and a baffle wall is disposed between any two adjacent light processing parts in the first light processing part, the second light processing part and the third light processing part. A light refractive index of the refractive layer is greater than a light refractive index of the spacer layer.

10. 发明申请

US20220231206A1 Light-Emitting Device and Displayer 有权
公开(公告)号：US20220231206A1
公开(公告)日：2022-07-21
申请号：US17574586
申请日：2022-01-13
申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
发明人： Kuai QIN , Heng GUO , Xiaobo OUYANG , Hongwen CHEN , Qiang ZHAO , Bin CAI , Nianpu LI , Junyong WANG
IPC分类号： H01L33/56 , H01L25/075 , H01L23/00 , H01L33/62
摘要： The disclosure provides a light-emitting device and a displayer. Herein, the light-emitting device includes a substrate, a light-emitting chip, a first light-transmitting layer, a second light-transmitting layer and a nano coating. The light transmittance of the second light-transmitting layer is greater than the light transmittance of the first light-transmitting layer. A reference surface corresponding to the light-emitting chip is arranged above the substrate, and the reference surface is higher than the bottom surface of the light-emitting chip and not higher than the top surface of the light-emitting chip. The first light-transmitting layer covers the surface of the light-emitting chip below the reference surface, and the second light-transmitting layer covers the surface of the light-emitting chip above the reference surface. The nano coating covers the outer surface of the first light-transmitting layer, the outer surface of the second light-transmitting layer and the side surface of the substrate.

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