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1. 发明授权

US07117587B2 Method for fabricating a substrate, including a plurality of chip package substrates 有权
标题翻译：一种制造衬底的方法，包括多个芯片封装衬底
公开(公告)号：US07117587B2
公开(公告)日：2006-10-10
申请号：US10655223
申请日：2003-09-05
申请人： Huei-Jen Chen , Evan Liu , Yvon Chen
发明人： Huei-Jen Chen , Evan Liu , Yvon Chen
IPC分类号： H01R43/00
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H05K1/183 , H05K1/189 , H05K3/0052 , H05K3/42 , H05K3/4691 , H05K2201/09036 , H05K2201/0949 , H05K2203/049 , Y10T29/49117 , Y10T29/49121 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-layer rigid PCB. A portion of the multi-layer rigid PCB between the grooves is milled to expose a corresponding portion of the soft PCB to define an exposed area. The combined PCB is drilled through along two opposite sides of the grooves and the corresponding exposed area of the soft PCB. Breakable parts are formed at a center of the corresponding portion of the soft PCB and two opposite outside edges of the grooves.
摘要翻译：一种制造衬底的方法，其包括多个芯片封装衬底。一个组合PCB包括多层刚性PCB和软PCB。多层刚性PCB固定在软PCB上。在多层刚性PCB的上表面上形成至少一个凹槽或一对。在凹槽之间的多层刚性PCB的一部分被铣削以暴露软PCB的相应部分以限定暴露区域。组合的PCB通过沟槽的两个相对侧和软PCB的相应的暴露区域钻穿。可破坏部分形成在软PCB的对应部分的中心和凹槽的两个相对的外边缘。

2. 发明授权

US07075176B2 Chip package substrate having soft circuit board and method for fabricating the same 失效
标题翻译：具有软电路板的芯片封装基板及其制造方法
公开(公告)号：US07075176B2
公开(公告)日：2006-07-11
申请号：US11188653
申请日：2005-07-26
申请人： Huei-Jen Chen , Evan Liu , Yvon Chen
发明人： Huei-Jen Chen , Evan Liu , Yvon Chen
IPC分类号： H02L23/02
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H05K1/183 , H05K1/189 , H05K3/0052 , H05K3/42 , H05K3/4691 , H05K2201/09036 , H05K2201/0949 , H05K2203/049 , Y10T29/49117 , Y10T29/49121 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.
摘要翻译：具有软电路板的芯片封装基板是多层软硬复合PCB，多个导电部件和多个导电孔。导电孔形成在多层软硬复合PCB中。导电部件电镀在多层软硬复合PCB上的导电孔的内边缘上。因此，图像感测芯片可以用作为外部信号连接线的软电路板封装在芯片封装基板上，从而节省制造成本并提高其产量。

3. 发明申请

US20060006487A1 Chip package substrate having soft circuit board and method for fabricating the same 失效
公开(公告)号：US20060006487A1
公开(公告)日：2006-01-12
申请号：US11188653
申请日：2005-07-26
申请人： Huei-Jen Chen , Evan Liu , Yvon Chen
发明人： Huei-Jen Chen , Evan Liu , Yvon Chen
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H05K1/183 , H05K1/189 , H05K3/0052 , H05K3/42 , H05K3/4691 , H05K2201/09036 , H05K2201/0949 , H05K2203/049 , Y10T29/49117 , Y10T29/49121 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.

4. 发明申请

US20130243207A1 ANALYSIS SYSTEM AND METHOD FOR AUDIO DATA 审中-公开
标题翻译：音频数据分析系统和方法
公开(公告)号：US20130243207A1
公开(公告)日：2013-09-19
申请号：US13989385
申请日：2010-11-25
申请人： Evan Liu , Qiang Li , Olof Lundstrom , Tandy Mai
发明人： Evan Liu , Qiang Li , Olof Lundstrom , Tandy Mai
IPC分类号： H04R29/00
CPC分类号： H04R29/00 , G10L15/02
摘要： An analysis system and method for audio data related to a user is provided, so that the user can be classified as one of multiple classes with an assumed probability based on the analysis result. The analysis system comprises an audio transformer (110) adapted to transform the audio data related to the user into spectra data; a pattern recognizer (120) adapted to decompose the spectra data to predetermined eigenvectors to get the decomposition pattern of the spectra data; a scorer (130) adapted to calculate the assumed scores of the multiple classes related to the user based on the decomposition pattern of the spectra data and the attributes of the user using a trained model.
摘要翻译：提供了一种与用户相关的音频数据的分析系统和方法，从而可以基于分析结果将用户分类为具有假设概率的多个类别之一。分析系统包括：音频变压器（110），适于将与用户相关的音频数据变换为频谱数据; 模式识别器（120），适于将光谱数据分解成预定的特征向量以获得光谱数据的分解模式; 适合于基于频谱数据的分解模式和使用训练模型的用户的属性来计算与用户相关的多个类别的假定分数的得分器（130）。

5. 发明申请

US20050001278A1 Chip package substrate having soft circuit board and method for fabricating the same 有权
标题翻译：具有软电路板的芯片封装基板及其制造方法
公开(公告)号：US20050001278A1
公开(公告)日：2005-01-06
申请号：US10655223
申请日：2003-09-05
申请人： Huei-Jen Chen , Evan Liu , Yvon Chen
发明人： Huei-Jen Chen , Evan Liu , Yvon Chen
IPC分类号： H01L23/12 , H01L21/00 , H01L27/146 , H01L31/0203 , H05K1/18 , H05K3/00 , H05K3/42
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H05K1/183 , H05K1/189 , H05K3/0052 , H05K3/42 , H05K3/4691 , H05K2201/09036 , H05K2201/0949 , H05K2203/049 , Y10T29/49117 , Y10T29/49121 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.
摘要翻译：具有软电路板的芯片封装基板是多层软硬复合PCB，多个导电部件和多个导电孔。导电孔形成在多层软硬复合PCB中。导电部件电镀在多层软硬复合PCB上的导电孔的内边缘上。因此，图像感测芯片可以用作为外部信号连接线的软电路板封装在芯片封装基板上，从而节省制造成本并提高其产量。

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