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1. 发明授权

US08586450B2 Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias 有权
标题翻译：用于制造半导体器件的工艺和包括具有贯通孔的芯片的半导体器件
公开(公告)号：US08586450B2
公开(公告)日：2013-11-19
申请号：US13103191
申请日：2011-05-09
申请人： Eric Saugier
发明人： Eric Saugier
IPC分类号： H01L21/30
CPC分类号： H01L25/0657 , H01L21/56 , H01L21/563 , H01L21/568 , H01L23/481 , H01L23/5389 , H01L24/16 , H01L24/81 , H01L24/96 , H01L25/50 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13025 , H01L2224/16225 , H01L2224/16227 , H01L2224/2201 , H01L2224/221 , H01L2224/32225 , H01L2224/73204 , H01L2224/73209 , H01L2224/73259 , H01L2224/9202 , H01L2224/96 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/01033 , H01L2924/14 , H01L2224/81 , H01L2924/00
摘要： A semiconductor device includes a first wafer having at least one first integrated-circuit chip and a first support layer surrounding the first integrated circuit chip. A first electrical-connection layer is placed on a frontside of the first wafer and includes a first electrical-connection network. A second wafer is placed on a frontside of the first electrical-connection layer. The second wafer includes at least one second integrated-circuit chip and a second support layer surrounding the second integrate circuit chip. The second integrated circuit chip has an active side facing the first electrical-connection layer, and one or more through-holes filled with a conductor forming electrical-connection vias. A second electrical-connection layer is placed on the backside of the second wafer and includes a second electrical-connection network.
摘要翻译：半导体器件包括具有至少一个第一集成电路芯片的第一晶片和围绕第一集成电路芯片的第一支撑层。第一电连接层被放置在第一晶片的前侧并且包括第一电连接网络。第二晶片放置在第一电连接层的前侧。第二晶片包括至少一个第二集成电路芯片和围绕第二集成电路芯片的第二支撑层。第二集成电路芯片具有面向第一电连接层的有源侧和填充有形成电连接通孔的导体的一个或多个通孔。第二电连接层被放置在第二晶片的背面并且包括第二电连接网络。

2. 发明授权

US07880132B2 Cap including a housing and optically transparent member to protect a camera module lens 有权
标题翻译：盖包括壳体和光学透明构件以保护相机模块透镜
公开(公告)号：US07880132B2
公开(公告)日：2011-02-01
申请号：US11872226
申请日：2007-10-15
申请人： Stuart Brodie , Hazel McInnes , Kum Weng Loo , Mickael Miglietti , Eric Saugier
发明人： Stuart Brodie , Hazel McInnes , Kum Weng Loo , Mickael Miglietti , Eric Saugier
IPC分类号： H01J5/02 , H04N5/225 , G03B17/00 , G02B7/02
CPC分类号： G03B11/00 , H04N5/2257
摘要： A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.
摘要翻译：提供相机模块透镜盖，以保护相机模块暴露在的移动设备中的相机模块。相机模块透镜盖包括用于定位在相机镜头附近的光学透明构件和用于承载光学透明构件的壳体。壳体包括用于接合摄像机模块的基座的突出唇缘。

3. 发明授权

US07668449B2 Barrel of variable focal length lens 有权
标题翻译：可变焦距镜头筒
公开(公告)号：US07668449B2
公开(公告)日：2010-02-23
申请号：US11534141
申请日：2006-09-21
申请人： Eric Saugier , Jean-Luc Diot , Fabrice Mee
发明人： Eric Saugier , Jean-Luc Diot , Fabrice Mee
IPC分类号： G03B17/00
CPC分类号： G02B7/09 , G02B7/02
摘要： A barrel for an electrically-controllable variable focal length lens in a button-battery type housing includes a hollow isolating cylindrical tube with an inner diameter substantially equal to that of the lens housing, with one or bumps extending radially towards the inside of the tube and forming bearing surfaces for the lens periphery in a same radial plane. First metallizations extend on at least one of the bearing surfaces and therefrom into first channels formed in the internal wall of the tube towards at least one end of the tube, and second metallizations, each of which forms a contact area on the internal surface of the tube to bear against the lateral surface of the lens and extends towards at least one end of the cylinder.
摘要翻译：用于钮扣电池型壳体中的电控可变焦距透镜的镜筒包括具有与透镜壳体的内径基本相等的内径的中空隔离圆柱形管，其中一个或凸块径向朝向管的内部延伸，在相同的径向平面中形成用于透镜周边的支承表面。第一金属化在至少一个轴承表面上延伸并从而延伸到形成在管的内壁中的第一通道朝向管的至少一个端部，并且第二金属化部分形成在内表面上的接触区域管抵靠透镜的侧表面并朝向气缸的至少一端延伸。

4. 发明申请

US20090057544A1 CAMERA MODULE LENS CAP 有权
标题翻译：相机模块镜头盖
公开(公告)号：US20090057544A1
公开(公告)日：2009-03-05
申请号：US11872226
申请日：2007-10-15
申请人： Stuart Brodie , Hazel McInnes , Kum Weng Loo , Mickael Miglietti , Eric Saugier
发明人： Stuart Brodie , Hazel McInnes , Kum Weng Loo , Mickael Miglietti , Eric Saugier
IPC分类号： G03B17/02
CPC分类号： G03B11/00 , H04N5/2257
摘要： A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.
摘要翻译：提供相机模块透镜盖，以保护相机模块暴露在的移动设备中的相机模块。相机模块透镜盖包括用于定位在相机镜头附近的光学透明构件和用于承载光学透明构件的壳体。壳体包括用于接合摄像机模块的基座的突出唇缘。

5. 发明授权

US07393215B2 Assembly of a mobile objective above an optical sensor 有权
标题翻译：在光学传感器上方组装移动物镜
公开(公告)号：US07393215B2
公开(公告)日：2008-07-01
申请号：US11533316
申请日：2006-09-19
申请人： Eric Saugier
发明人： Eric Saugier
IPC分类号： H01R12/00
CPC分类号： H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An assembly structure of a mobile objective above an optical sensor assembled on a support board includes a cover assembled on the support board with an opening facing the sensor, this cover having a conical external surface with an axis orthogonal to the support board. The structure also includes a frame having first and second elements, shiftable with respect to each other under the action of an electric motor. The first frame element has a conical internal surface capable of mating with the conical external surface of the cover to ensure its positioning and to put resilient connection blades of a fixed portion of the motor in contact with pads formed on the support board, and the second frame element supports the objective and a shiftable portion of the motor.
摘要翻译：组装在支撑板上的光学传感器上方的移动物体的组装结构包括：组装在支撑板上的盖，其具有面向传感器的开口，该盖具有与支撑板正交的轴的圆锥形外表面。该结构还包括具有第一和第二元件的框架，在电动机的作用下可相对于彼此移动。第一框架元件具有能够与盖的锥形外表面配合的圆锥形内表面，以确保其定位并且将马达的固定部分的弹性连接叶片与形成在支撑板上的垫接触，并且第二框架元件框架元件支撑电机的目标和可移动部分。

6. 发明申请

US20110278733A1 PROCESS FOR FABRICATING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR DEVICE COMPRISING A CHIP WITH THROUGH-VIAS 有权
标题翻译：用于制造半导体器件的方法和包括通过VIAS的芯片的半导体器件
公开(公告)号：US20110278733A1
公开(公告)日：2011-11-17
申请号：US13103191
申请日：2011-05-09
申请人： Eric Saugier
发明人： Eric Saugier
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L25/0657 , H01L21/56 , H01L21/563 , H01L21/568 , H01L23/481 , H01L23/5389 , H01L24/16 , H01L24/81 , H01L24/96 , H01L25/50 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13025 , H01L2224/16225 , H01L2224/16227 , H01L2224/2201 , H01L2224/221 , H01L2224/32225 , H01L2224/73204 , H01L2224/73209 , H01L2224/73259 , H01L2224/9202 , H01L2224/96 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/01033 , H01L2924/14 , H01L2224/81 , H01L2924/00
摘要： A semiconductor device includes a first wafer having at least one first integrated-circuit chip and a first support layer surrounding the first integrated circuit chip. A first electrical-connection layer is placed on a frontside of the first wafer and includes a first electrical-connection network. A second wafer is placed on a frontside of the first electrical-connection layer. The second wafer includes at least one second integrated-circuit chip and a second support layer surrounding the second integrate circuit chip. The second integrated circuit chip has an active side facing the first electrical-connection layer, and one or more through-holes filled with a conductor forming electrical-connection vias. A second electrical-connection layer is placed on the backside of the second wafer and includes a second electrical-connection network.
摘要翻译：半导体器件包括具有至少一个第一集成电路芯片的第一晶片和围绕第一集成电路芯片的第一支撑层。第一电连接层被放置在第一晶片的前侧并且包括第一电连接网络。第二晶片放置在第一电连接层的前侧。第二晶片包括至少一个第二集成电路芯片和围绕第二集成电路芯片的第二支撑层。第二集成电路芯片具有面向第一电连接层的有源侧和填充有形成电连接通孔的导体的一个或多个通孔。第二电连接层被放置在第二晶片的背面并且包括第二电连接网络。

7. 发明申请

US20070072065A1 BARREL OF VARIABLE FOCAL LENGTH LENS 有权
标题翻译： BARREL可变焦距长度镜头
公开(公告)号：US20070072065A1
公开(公告)日：2007-03-29
申请号：US11534141
申请日：2006-09-21
申请人： Eric Saugier , Jean-Luc Diot , Fabrice Mee
发明人： Eric Saugier , Jean-Luc Diot , Fabrice Mee
IPC分类号： H01M2/10
CPC分类号： G02B7/09 , G02B7/02
摘要： A barrel for an electrically-controllable variable focal length lens in a button-battery type housing includes a hollow isolating cylindrical tube with an inner diameter substantially equal to that of the lens housing, with one or bumps extending radially towards the inside of the tube and forming bearing surfaces for the lens periphery in a same radial plane. First metallizations extend on at least one of the bearing surfaces and therefrom into first channels formed in the internal wall of the tube towards at least one end of the tube, and second metallizations, each of which forms a contact area on the internal surface of the tube to bear against the lateral surface of the lens and extends towards at least one end of the cylinder.
摘要翻译：用于钮扣电池型壳体中的电控可变焦距透镜的镜筒包括具有与透镜壳体的内径基本相等的内径的中空隔离圆柱形管，其中一个或凸块径向朝向管的内部延伸，在相同的径向平面中形成用于透镜周边的支承表面。第一金属化在至少一个轴承表面上延伸并从而延伸到形成在管的内壁中的第一通道朝向管的至少一个端部，并且第二金属化部分形成在内表面上的接触区域管抵靠透镜的侧表面并朝向气缸的至少一端延伸。

8. 发明申请

US20080170307A1 FOCUSSING APPARATUS 有权
标题翻译：聚焦装置
公开(公告)号：US20080170307A1
公开(公告)日：2008-07-17
申请号：US12013078
申请日：2008-01-11
申请人： Colin Campbell , Eric Saugier
发明人： Colin Campbell , Eric Saugier
IPC分类号： G02B7/02
CPC分类号： G02B7/08
摘要： A focussing device for a lens, including a frame, a lens carrier movable relative to the frame from a first position along an optical axis, a motor for driving the lens carrier along the optical axis, and at least one biasing member adapted to bias the lens carrier towards the first position. The biasing member may include one or more bending members.
摘要翻译：一种用于透镜的聚焦装置，包括框架，可沿着光轴从第一位置相对于框架移动的透镜支架，用于沿着光轴驱动透镜支架的电动机，以及至少一个偏压构件，透镜载体朝向第一位置。偏置构件可以包括一个或多个弯曲构件。

9. 发明申请

US20070066093A1 ASSEMBLY OF A MOBILE OBJECTIVE ABOVE AN OPTICAL SENSOR 有权
标题翻译：一个移动目标在光学传感器上的组装
公开(公告)号：US20070066093A1
公开(公告)日：2007-03-22
申请号：US11533316
申请日：2006-09-19
申请人： Eric Saugier
发明人： Eric Saugier
IPC分类号： H05K1/00
CPC分类号： H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An assembly structure of a mobile objective above an optical sensor assembled on a support board includes a cover assembled on the support board with an opening facing the sensor, this cover having a conical external surface with an axis orthogonal to the support board. The structure also includes a frame having first and second elements, shiftable with respect to each other under the action of an electric motor. The first frame element has a conical internal surface capable of mating with the conical external surface of the cover to ensure its positioning and to put resilient connection blades of a fixed portion of the motor in contact with pads formed on the support board, and the second frame element supports the objective and a shiftable portion of the motor.
摘要翻译：组装在支撑板上的光学传感器上方的移动物体的组装结构包括：组装在支撑板上的盖，其具有面向传感器的开口，该盖具有与支撑板正交的轴的圆锥形外表面。该结构还包括具有第一和第二元件的框架，在电动机的作用下可相对于彼此移动。第一框架元件具有能够与盖的锥形外表面配合的圆锥形内表面，以确保其定位并且将马达的固定部分的弹性连接叶片与形成在支撑板上的垫接触，并且第二框架元件框架元件支撑电机的目标和可移动部分。

10. 发明授权

US08928893B2 Proximity sensor 有权
标题翻译：接近传感器
公开(公告)号：US08928893B2
公开(公告)日：2015-01-06
申请号：US13242708
申请日：2011-09-23
申请人： Ewan Findlay , Colin Campbell , Gemma Ramsey , Eric Saugier
发明人： Ewan Findlay , Colin Campbell , Gemma Ramsey , Eric Saugier
IPC分类号： G01B11/14 , G02B27/00 , G01J1/44 , H04B10/00 , H04B10/08 , H01L31/173 , H01L31/12 , H03K17/94 , H01L25/16 , H03K17/945
CPC分类号： H03K17/941 , H01L25/167 , H01L31/125 , H01L31/173 , H01L2924/0002 , H03K2017/9455 , H03K2217/94108 , H01L2924/00
摘要： The internal propagation of radiation between a radiation source and radiation detector mounted within a sensor package is prevented by the use of an optical isolator. The optical isolator is formed by the combination of a baffle mounted between the source and detector and a groove formed in an upper surface of the sensor package between the source and detector. A bottom of the groove is positioned adjacent to an upper edge of the baffle.
摘要翻译：通过使用光隔离器来防止辐射源和安装在传感器封装内的辐射探测器之间的辐射的内部传播。光隔离器由安装在源和检测器之间的挡板和在源和检测器之间形成在传感器封装的上表面中的凹槽的组合形成。凹槽的底部邻近挡板的上边缘定位。

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