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    • 1. 发明授权
    • Method for manufacturing an antifuse memory cell
    • 反熔丝存储单元的制造方法
    • US08470645B2
    • 2013-06-25
    • US13038630
    • 2011-03-02
    • Philippe CandelierElise Le Roux
    • Philippe CandelierElise Le Roux
    • H01L21/8246
    • H01L27/112H01L27/11206
    • A method for forming a memory cell including a selection transistor and an antifuse transistor, in a technological process adapted to the manufacturing of a first and of a second types of MOS transistors of different gate thicknesses, this method including the steps of: forming the selection transistor according to the steps of manufacturing of the N-channel transistor of the second type; and forming the antifuse transistor essentially according the steps of manufacturing of the N-channel transistor of the first type, by modifying the following step: instead of performing a P-type implantation in the channel region at the same time as in the N-channel transistors of the first type, performing an N-type implantation in the channel region at the same time as in the P-channel transistors of the first type.
    • 一种用于形成包括选择晶体管和反熔丝晶体管的存储单元的方法,在适于制造不同栅极厚度的第一和第二类型的MOS晶体管的工艺中,该方法包括以下步骤:形成选择 晶体管,根据制造第二类型的N沟道晶体管的步骤; 以及基本上根据制造第一类型的N沟道晶体管的步骤形成反熔丝晶体管,通过修改以下步骤:代替在N沟道中同时在沟道区中进行P型注入 第一类型的晶体管,与第一类型的P沟道晶体管同时在沟道区中进行N型注入。
    • 3. 发明申请
    • METHOD FOR MANUFACTURING AN ANTIFUSE MEMORY CELL
    • 用于制造抗细胞记忆细胞的方法
    • US20110223723A1
    • 2011-09-15
    • US13038630
    • 2011-03-02
    • PHILIPPE CANDELIERElise Le Roux
    • PHILIPPE CANDELIERElise Le Roux
    • H01L21/8246
    • H01L27/112H01L27/11206
    • A method for forming a memory cell including a selection transistor and an antifuse transistor, in a technological process adapted to the manufacturing of a first and of a second types of MOS transistors of different gate thicknesses, this method including the steps of: forming the selection transistor according to the steps of manufacturing of the N-channel transistor of the second type; and forming the antifuse transistor essentially according the steps of manufacturing of the N-channel transistor of the first type, by modifying the following step: instead of performing a P-type implantation in the channel region at the same time as in the N-channel transistors of the first type, performing an N-type implantation in the channel region at the same time as in the P-channel transistors of the first type.
    • 一种用于形成包括选择晶体管和反熔丝晶体管的存储单元的方法,在适于制造不同栅极厚度的第一和第二类型的MOS晶体管的工艺中,该方法包括以下步骤:形成选择 晶体管,根据制造第二类型的N沟道晶体管的步骤; 以及基本上根据制造第一类型的N沟道晶体管的步骤形成反熔丝晶体管,通过修改以下步骤:代替在N沟道中同时在沟道区中进行P型注入 第一类型的晶体管,与第一类型的P沟道晶体管同时在沟道区中进行N型注入。