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1. 发明授权

US08233494B2 Hierarchical and incremental multivariate analysis for process control 有权
标题翻译：过程控制的分层和增量多变量分析
公开(公告)号：US08233494B2
公开(公告)日：2012-07-31
申请号：US12017757
申请日：2008-01-22
申请人： Lisa Amini , Edward Sumner Begle , Brian Douglas Pfeifer , Deepak S. Turaga , Olivier Verscheure , Justin Wai-chow Wong , Gerett Raybourn Yocum
发明人： Lisa Amini , Edward Sumner Begle , Brian Douglas Pfeifer , Deepak S. Turaga , Olivier Verscheure , Justin Wai-chow Wong , Gerett Raybourn Yocum
IPC分类号： H04L12/28
CPC分类号： G05B19/41875 , G05B2219/32201 , G05B2219/45031 , Y02P90/22
摘要： A technique for analyzing two or more data streams respectively generated from two or more components of a controllable process includes the following steps. In a first step, a statistical analysis is performed on each of the two or more data streams to generate first analysis results in the form of respective statistical results for the two or more data streams. In a second step, at least a portion of the statistical results from at least one of the two or more data streams is combined with at least a portion of the statistical results from at least another one of the two or more data streams to yield second analysis results. The controllable process is adjustable based on at least one of the first analysis results and the second analysis results.
摘要翻译：分析从可控过程的两个或多个组件分别产生的两个或更多个数据流的技术包括以下步骤。在第一步骤中，对两个或更多个数据流中的每一个进行统计分析，以生成用于两个或多个数据流的相应统计结果形式的第一分析结果。在第二步骤中，来自两个或多个数据流中的至少一个的统计结果的至少一部分与来自两个或更多数据流中的至少另一个的统计结果的至少一部分组合以产生第二分析结果。基于第一分析结果和第二分析结果中的至少一个，可控过程是可调节的。

2. 发明申请

US20090185493A1 Hierarchical and Incremental Multivariate Analysis for Process Control 有权
标题翻译：过程控制的分层和增量多变量分析
公开(公告)号：US20090185493A1
公开(公告)日：2009-07-23
申请号：US12017757
申请日：2008-01-22
申请人： Lisa Amini , Edward Sumner Begle , Brian Douglas Pfeifer , Deepak S. Turaga , Olivier Verscheure , Justin Wai-chow Wong , Gerett Raybourn Yocum
发明人： Lisa Amini , Edward Sumner Begle , Brian Douglas Pfeifer , Deepak S. Turaga , Olivier Verscheure , Justin Wai-chow Wong , Gerett Raybourn Yocum
IPC分类号： G06F11/00
CPC分类号： G05B19/41875 , G05B2219/32201 , G05B2219/45031 , Y02P90/22
摘要： A technique for analyzing two or more data streams respectively generated from two or more components of a controllable process includes the following steps. In a first step, a statistical analysis is performed on each of the two or more data streams to generate first analysis results in the form of respective statistical results for the two or more data streams. In a second step, at least a portion of the statistical results from at least one of the two or more data streams is combined with at least a portion of the statistical results from at least another one of the two or more data streams to yield second analysis results. The controllable process is adjustable based on at least one of the first analysis results and the second analysis results.
摘要翻译：分析从可控过程的两个或多个组件分别产生的两个或更多个数据流的技术包括以下步骤。在第一步骤中，对两个或更多个数据流中的每一个进行统计分析，以生成用于两个或多个数据流的相应统计结果形式的第一分析结果。在第二步骤中，来自两个或多个数据流中的至少一个的统计结果的至少一部分与来自两个或更多数据流中的至少另一个的统计结果的至少一部分组合以产生第二分析结果。基于第一分析结果和第二分析结果中的至少一个，可控过程是可调节的。

3. 发明授权

US06500751B2 Method of forming recessed thin film landing pad structure 有权
标题翻译：形成凹陷薄膜着陆垫结构的方法
公开(公告)号：US06500751B2
公开(公告)日：2002-12-31
申请号：US09772205
申请日：2001-01-29
申请人： Richard Philip Surprenant , Edward Sumner Begle , Nancy Wagner Hannon , Mathias Pierre Jeanneret
发明人： Richard Philip Surprenant , Edward Sumner Begle , Nancy Wagner Hannon , Mathias Pierre Jeanneret
IPC分类号： H01L214763
CPC分类号： H01L23/5226 , H01L21/76895 , H01L23/528 , H01L2924/0002 , H01L2924/00
摘要： A multilayer thin film via landing pad structure includes a thin film conductor structure with a recessed landing pad formed between an upper layer of polyimide dielectric and a lower layer of polyimide dielectric. A multilayer thin film via landing pad structure is formed on a lower layer of dielectric having a top surface. A depression is formed in the top surface of the lower layer of dielectric. The depression has a bottom within the lower layer. A recessed landing pad comprising a conductor is formed in the depression on the surface of the lower layer of dielectric. A conductor line is formed on the lower layer of dielectric in contact with the recessed landing pad. An upper layer of dielectric is formed over the lower layer of dielectric, the thin film conductor line and the recessed landing pad. A conductive via is formed extending through the upper layer of dielectric into contact with the recessed landing pad. Both the recess and the via are formed by laser ablation with the identical mask and laser ablation tool.
摘要翻译：多层薄膜通过着陆垫结构包括薄膜导体结构，其具有形成在聚酰亚胺电介质的上层和聚酰亚胺电介质的下层之间的凹陷的着陆垫。在具有顶表面的电介质的下层上形成多层薄膜通过着陆焊盘结构。凹陷形成在电介质下层的顶表面。凹陷在下层内有一个底部。在电介质的下层的表面的凹部中形成包括导体的凹陷的着陆板。在与凹陷的着陆垫接触的电介质的下层上形成导体线。电介质的上层形成在电介质的下层，薄膜导体线和凹陷的着陆垫上。导电通孔形成为延伸穿过电介质的上层与凹陷的着陆垫接触。通过使用相同的掩模和激光烧蚀工具的激光烧蚀来形成凹部和通孔。

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