专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20140124942A1 Reducing Loadline Impedance in a System 审中-公开
标题翻译：减少系统中的负载线阻抗
公开(公告)号：US20140124942A1
公开(公告)日：2014-05-08
申请号：US14154291
申请日：2014-01-14
申请人： Damion T. Searls , Edward P. Osburn
发明人： Damion T. Searls , Edward P. Osburn
IPC分类号： H01L23/498
CPC分类号： H01L23/49844 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/13091 , H01L2924/1531 , H01L2924/19106 , H05K1/023 , H05K1/0231 , H05K1/0262 , H05K1/181 , H05K2201/1006 , H05K2201/10166 , H05K2201/10325 , H05K2201/10515 , H05K2201/10545 , H05K2201/10704 , Y10T29/4913 , Y10T29/49147 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： In one embodiment, the present invention includes a method of mounting a semiconductor device to a first side of a circuit board; and mounting at least one voltage regulator device to a second side of the circuit board, the second side opposite to the first side. The voltage regulator devices may be output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.
摘要翻译：在一个实施例中，本发明包括将半导体器件安装到电路板的第一侧的方法; 以及将至少一个电压调节器装置安装到所述电路板的第二侧，所述第二侧与所述第一侧相对。电压调节器装置可以是输出滤波器，电感器，电容器等。在某些实施例中，器件可以位于半导体器件的正下方。

2. 发明授权

US07732260B2 Semiconductor device power interconnect striping 失效
标题翻译：半导体器件电源互连条纹
公开(公告)号：US07732260B2
公开(公告)日：2010-06-08
申请号：US11942658
申请日：2007-11-19
申请人： Edward P. Osburn
发明人： Edward P. Osburn
IPC分类号： H01L21/44
CPC分类号： H05K1/0262 , H01L23/49838 , H01L23/50 , H01L2924/0002 , H05K1/0219 , H05K1/0231 , H05K1/0263 , H05K1/112 , H05K3/429 , H05K2201/093 , H05K2201/1003 , H05K2201/10515 , H05K2201/10545 , H05K2201/10704 , H05K2201/10734 , H01L2924/00
摘要： A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.
摘要翻译：公开了一种用于改进对半导体器件的功率的传递和滤波的方法和装置，其通过组织用于以条形配置携带功率的互连（引脚，球，焊盘或其他互连），其缩短了功率之间所需的导电路径源极和半导体器件，并且降低该导电路径的电阻。

3. 发明申请

US20090195228A1 Microprocessor die with integrated voltage regulation control circuit 有权
标题翻译：具有集成稳压控制电路的微处理器管芯
公开(公告)号：US20090195228A1
公开(公告)日：2009-08-06
申请号：US12384829
申请日：2009-04-09
申请人： Jeffrey A. Carlson , Edward P. Osburn
发明人： Jeffrey A. Carlson , Edward P. Osburn
IPC分类号： G05F1/44
CPC分类号： G06F1/26
摘要： An integrated circuit die includes a microprocessor and a control circuit to control elements of a voltage regulator to supply power to the microprocessor.
摘要翻译：集成电路管芯包括微处理器和控制电路，用于控制电压调节器的元件以向微处理器供电。

4. 发明授权

US07319269B2 Semiconductor device power interconnect striping 有权
标题翻译：半导体器件电源互连条纹
公开(公告)号：US07319269B2
公开(公告)日：2008-01-15
申请号：US11089914
申请日：2005-03-24
申请人： Edward P. Osburn
发明人： Edward P. Osburn
IPC分类号： H01L23/48
CPC分类号： H05K1/0262 , H01L23/49838 , H01L23/50 , H01L2924/0002 , H05K1/0219 , H05K1/0231 , H05K1/0263 , H05K1/112 , H05K3/429 , H05K2201/093 , H05K2201/1003 , H05K2201/10515 , H05K2201/10545 , H05K2201/10704 , H05K2201/10734 , H01L2924/00
摘要： A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.
摘要翻译：公开了一种用于改进对半导体器件的功率的传递和滤波的方法和装置，其通过组织用于以条形配置携带功率的互连（引脚，球，焊盘或其他互连），其缩短了功率之间所需的导电路径源极和半导体器件，并且降低该导电路径的电阻。

5. 发明授权

US07242172B2 Microprocessor die with integrated voltage regulation control circuit 有权
标题翻译：具有集成稳压控制电路的微处理器管芯
公开(公告)号：US07242172B2
公开(公告)日：2007-07-10
申请号：US10795527
申请日：2004-03-08
申请人： Jeffrey A. Carlson , Edward P. Osburn
发明人： Jeffrey A. Carlson , Edward P. Osburn
IPC分类号： G05F1/44
CPC分类号： G06F1/26
摘要： An integrated circuit die includes a microprocessor and a control circuit to control elements of a voltage regulator to supply power to the microprocessor.
摘要翻译：集成电路管芯包括微处理器和控制电路，用于控制电压调节器的元件以向微处理器供电。

6. 发明授权

US07005736B2 Semiconductor device power interconnect striping 有权
标题翻译：半导体器件电源互连条纹
公开(公告)号：US07005736B2
公开(公告)日：2006-02-28
申请号：US10335368
申请日：2002-12-30
申请人： Edward P. Osburn
发明人： Edward P. Osburn
IPC分类号： H01L23/48
CPC分类号： H05K1/0262 , H01L23/49838 , H01L23/50 , H01L2924/0002 , H05K1/0219 , H05K1/0231 , H05K1/0263 , H05K1/112 , H05K3/429 , H05K2201/093 , H05K2201/1003 , H05K2201/10515 , H05K2201/10545 , H05K2201/10704 , H05K2201/10734 , H01L2924/00
摘要： A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.
摘要翻译：公开了一种用于改进对半导体器件的功率的传递和滤波的方法和装置，其通过组织用于以条形配置携带功率的互连（引脚，球，焊盘或其他互连），其缩短了功率之间所需的导电路径源极和半导体器件，并且降低该导电路径的电阻。

7. 发明授权

US06874083B2 Method and apparatus to ensure proper voltage and frequency configuration signals are defined before applying power to processor 失效
标题翻译：在对处理器施加电力之前，确定了确定正确的电压和频率配置信号的方法和装置
公开(公告)号：US06874083B2
公开(公告)日：2005-03-29
申请号：US09746168
申请日：2000-12-22
申请人： Ananda Sarangi , Rachael Jade Parker , Edward P. Osburn , Gregory F. Taylor
发明人： Ananda Sarangi , Rachael Jade Parker , Edward P. Osburn , Gregory F. Taylor
IPC分类号： G06F1/24 , G06F1/32
CPC分类号： G06F1/24
摘要： A dynamic processor configuration and power-up programs a processor's fuse block with configuration signals during processor manufacturing. The processor configuration signals include a core voltage identifier and a system bus frequency identifier. When power is applied to the platform, a control signal is used to prevent power-up of the platform's processor related circuitry. While the platform awaits full power-up, the fuse block is powered up. When the fuse block is powered up, the control signal is used to allow the configuration signals to be read from the fuse block. The processor is configured with core voltage and system bus frequency based on the values read from the fuse block. The platform then performs its boot-up sequence.
摘要翻译：在处理器制造过程中，动态处理器配置和上电将处理器的熔丝块与配置信号进行编程。处理器配置信号包括核心电压标识符和系统总线频率标识符。当对平台施加电力时，使用控制信号来防止平台处理器相关电路的上电。当平台等待完全上电时，保险丝盒通电。当保险丝盒通电时，控制信号用于允许从保险丝盒读取配置信号。基于从保险丝盒读取的值，处理器配置有核心电压和系统总线频率。然后平台执行其启动顺序。

8. 发明授权

US06430043B1 Heat sink grounding unit 失效
标题翻译：散热器接地装置
公开(公告)号：US06430043B1
公开(公告)日：2002-08-06
申请号：US09699861
申请日：2000-10-30
申请人： Edward P. Osburn
发明人： Edward P. Osburn
IPC分类号： H05K500
CPC分类号： G06F1/20 , H01L23/36 , H01L23/552 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A electromagnetic interference (EMI) grounding unit provides an electrical connection between a heat sink and a ground formed on a substrate. A tab mechanically and electrically continuous with an electrically conductive generally planar member makes electrical contact with the heat sink. The electrically conductive generally planar member is connected to one or more conductive posts. And the one or more conductive posts are connected to the ground. An electrical charge on the heat sink is discharged along a path that includes the tab, the electrically conductive generally planar member, and the one or more posts. Discharging accumulated charge on the heat sink to ground reduces EMI generated by re-radiation of electromagnetic energy from the heat sink.
摘要翻译：电磁干扰（EMI）接地单元提供散热器和形成在基板上的接地之间的电气连接。与导电的大体上平坦的构件机械地和电连续的突片与散热器电接触。导电的大体上平坦的构件连接到一个或多个导电柱。并且一个或多个导电柱连接到地面。散热器上的电荷沿着包括突片，导电的大体上平坦的构件和一个或多个柱的路径排出。将散热片上的累积电荷放电到地面可减少由散热片重新辐射电磁能所产生的EMI。

9. 发明授权

US08183841B2 Multi-phase power supply controller and method therefor 有权
标题翻译：多相电源控制器及其方法
公开(公告)号：US08183841B2
公开(公告)日：2012-05-22
申请号：US11970326
申请日：2008-01-07
申请人： Edward P. Osburn
发明人： Edward P. Osburn
IPC分类号： G05F1/613
CPC分类号： H02M3/156 , H02M3/158
摘要： In one embodiment, a multi-phase power supply controller is configured to an operating status signal and responsively inhibit the PWM controller from forming at least one PWM drive signal of a plurality of PWM drive signals.
摘要翻译：在一个实施例中，多相电源控制器被配置为操作状态信号，并且响应地禁止PWM控制器形成多个PWM驱动信号的至少一个PWM驱动信号。

10. 发明申请

US20110133824A1 MICROPROCESSOR DIE WITH INTEGRATED VOLTAGE REGULATION CONTROL CIRCUIT 有权
标题翻译：具有集成电压调节控制电路的微处理器
公开(公告)号：US20110133824A1
公开(公告)日：2011-06-09
申请号：US13022959
申请日：2011-02-08
申请人： Jeffrey A. Carlson , Edward P. Osburn
发明人： Jeffrey A. Carlson , Edward P. Osburn
IPC分类号： G05F1/613
CPC分类号： G06F1/26
摘要： An integrated circuit die includes a microprocessor and a control circuit to control elements of a voltage regulator to supply power to the microprocessor.
摘要翻译：集成电路管芯包括微处理器和控制电路，用于控制电压调节器的元件以向微处理器供电。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式