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    • 3. 发明申请
    • BREAK-OPEN PACKAGE WITH SHAPED DIE CUT FOR STORING AND DISPENSING SUBSTRATES
    • 具有用于存储和分配基板的形状切割的断开的包装
    • US20100155284A1
    • 2010-06-24
    • US12337777
    • 2008-12-18
    • Matthew Edward GerstleEdward John Foley
    • Matthew Edward GerstleEdward John Foley
    • B65D75/32
    • B65D75/585B65D75/5827
    • A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.
    • 公开了一种通过沿包装表面切割的模具使包装变形或弯曲而打开的包装。 包装将在模切时断裂或断裂,在包装中提供开口以进入内部的内容物。 该包装形成有半刚性层,该半刚性层固定到形成内腔的柔性背衬层。 模切从至少邻近半刚性层的一个边缘的区域延伸到邻近半刚性层的另一边缘的至少一个区域,以提供用于包装破裂的断裂点。 模切的至少一部分沿着半刚性层的横向宽度和纵向宽度延伸,以允许基板的较大表面积可接近。 因此,对于用户来说,分配衬底更容易。
    • 5. 发明授权
    • Break-open package with shaped die cut for storing and dispensing substrates
    • 具有成形模切的开式包装,用于存储和分配基材
    • US08028837B2
    • 2011-10-04
    • US12337777
    • 2008-12-18
    • Matthew Edward GerstleEdward John Foley
    • Matthew Edward GerstleEdward John Foley
    • B65D73/00A47K10/24
    • B65D75/585B65D75/5827
    • A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.
    • 公开了一种通过沿包装表面切割的模具使包装变形或弯曲而打开的包装。 包装将在模切时断裂或断裂,在包装中提供开口以进入内部的内容物。 该包装形成有半刚性层,该半刚性层固定到形成内腔的柔性背衬层。 模切从至少邻近半刚性层的一个边缘的区域延伸到邻近半刚性层的另一边缘的至少一个区域,以提供用于包装破裂的断裂点。 模切的至少一部分沿着半刚性层的横向宽度和纵向宽度延伸,以允许基板的较大表面积可接近。 因此,对于用户来说,分配衬底更容易。