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1. 发明授权

US06706201B1 Method for producing metallized substrate materials 失效
标题翻译：金属化基板材料的制造方法
公开(公告)号：US06706201B1
公开(公告)日：2004-03-16
申请号：US09673760
申请日：2000-12-21
申请人： Heinrich Meyer , Ralf Schulz , Roland Heinz , Eckart Klusmann
发明人： Heinrich Meyer , Ralf Schulz , Roland Heinz , Eckart Klusmann
IPC分类号： C23C402
CPC分类号： H05K3/388 , C23C16/0245 , C23C16/06 , H05K1/034 , H05K3/146
摘要： For manufacturing substrate materials which are needed for the manufacture of electrical circuit carriers, methods are known in which metal layers are applied to a dielectric substrate by means of a glow discharge process and thereafter additional metal layers are applied by means of electroplating processes. These methods however are not suitable for the manufacture of substrate materials which are suitable for high frequency applications in the gigahertz range. The invention starts from the previously-mentioned methods and solves the described problem through the use of fluoropolymers and through coating of these materials by means of a glow discharge process with nickel, since by this means even very smooth surfaces of the substrate can be securely coated. The metallised materials can be coated with additional metal layers from electroless or electrolytic deposition baths.
摘要翻译：为了制造制造电路载体所需的衬底材料，已知通过辉光放电工艺将金属层施加到电介质衬底的方法，此后通过电镀工艺施加额外的金属层。然而，这些方法不适用于适用于千兆赫兹范围的高频应用的基片材料的制造。本发明从先前提到的方法开始，通过使用含氟聚合物并通过利用镍的辉光放电法涂覆这些材料来解决所述的问题，因为通过这种方式，可以牢固地涂覆基材的非常光滑的表面。金属化材料可以从化学镀或电解沉积浴中涂覆附加的金属层。

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