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    • 3. 发明授权
    • High density pattern template: materials and processes for the
application of conductive pastes
    • 高密度图案模板:应用导电浆料的材料和工艺
    • US5460921A
    • 1995-10-24
    • US118010
    • 1993-09-08
    • Douglas A. CywarCharles R. DavisThomas P. DuffyFrank D. EgittoPaul J. HartGerald W. JonesEdward McLeskey
    • Douglas A. CywarCharles R. DavisThomas P. DuffyFrank D. EgittoPaul J. HartGerald W. JonesEdward McLeskey
    • G03F7/00H05K1/09H05K3/00H05K3/10H05K3/12H05K3/40H05K3/46G03C5/00
    • G03F7/00H05K3/0032H05K3/1258H05K3/4069H05K1/095H05K2201/015H05K2201/0209H05K2203/0191H05K2203/0568H05K2203/0769H05K2203/0783H05K2203/1383H05K3/0035H05K3/107H05K3/4664Y10S428/901Y10S430/146Y10T428/24917
    • The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured. The remaining polymer coating is removed by solvent stripping with non-halogenated solvents. The present invention further includes patterning electronic structures comprising multilayer circuitry using the above method. An excimer laser is used to form vias or through holes in the electronic structure while simultaneously patterning the polymer coating. This results in perfect alignment between the pattern formed in the polymer coating and the vias or through holes. High resolution circuitry is thus attainable when the electronic structure is subsequently metallized with a conductive metal paste.
    • 本发明提供了一种烧蚀光分解和形成金属图案的方法,其获得高分辨率,方便并采用非卤化溶剂。 本发明涉及一种用于形成金属图案的方法,优选在有机基板上,优选在电路板或其组件上进行电路化,该方法包括用可剥离涂层涂覆基材,该涂层包含聚合物树脂,优选丙烯酸酯聚合物树脂 优选紫外线吸收剂。 通过用足够量的紫外线照射至少一部分聚合物涂层,形成对应于所需金属图案的聚合物涂层中的图案,从而消除聚合物涂层的照射部分。 接下来,用导电金属膏涂覆图案化衬底以限定金属图案,并且导电金属膏被固化。 通过用非卤化溶剂的溶剂汽提除去剩余的聚合物涂层。 本发明还包括使用上述方法图案化包括多层电路的电子结构。 准分子激光器用于在电子结构中形成通孔或通孔,同时构图聚合物涂层。 这导致在聚合物涂层中形成的图案与通孔或通孔之间完美对准。 因此,当电子结构随后用导电金属膏进行金属化时,可实现高分辨率电路。