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1. 发明申请

US20060250049A1 Surface acoustic wave device package 审中-公开
标题翻译：声表面波器件封装
公开(公告)号：US20060250049A1
公开(公告)日：2006-11-09
申请号：US11259199
申请日：2005-10-27
申请人： Doo Park , Young Lee , Seung Lee , Joo Park , Sang Park , Nam Kim
发明人： Doo Park , Young Lee , Seung Lee , Joo Park , Sang Park , Nam Kim
IPC分类号： H01L41/053
CPC分类号： H03H9/1085 , H01L2224/16225 , H03H9/059
摘要： The present invention provides a SAW device package used in filters, duplexers, etc., in particular, which simplifies sealing process for protecting the active area of a SAW device. The SAW device package comprises a wiring substrate, as a package base having connection patterns, having bare chip attaching means. A bare chip is flip-bonded and attached to the attaching means on the wiring substrate while maintaining the airtight condition. A resin molding part covers the top of the bare chip to seal the device. The invention facilitates maintaining an airtight condition of the active area which affects the operational characteristics of the device, and simplifies the manufacturing processes. Furthermore, the improved structure of the wiring substrate blocks the external moisture permeation, thereby enabling the device to better withstand the external changes.
摘要翻译：本发明提供了一种特别用于滤波器，双工器等中的SAW器件封装，其简化了用于保护SAW器件的有源区域的密封工艺。 SAW器件封装包括布线衬底，作为具有连接图案的封装基座，具有裸芯片附接装置。在保持气密状态的同时，将裸芯片翻转接合并附接到布线基板上的附接装置。树脂成型部分覆盖裸芯片的顶部以密封装置。本发明有助于维持影响装置的操作特性的活性区域的气密状态，并且简化了制造过程。此外，布线基板的改进的结构阻止外部水分渗透，从而使得该装置能够更好地承受外部变化。

2. 发明申请

US20060249824A1 Stack type surface acoustic wave package, and method for manufacturing the same 有权
标题翻译：堆叠式表面声波封装及其制造方法
公开(公告)号：US20060249824A1
公开(公告)日：2006-11-09
申请号：US11217465
申请日：2005-09-02
申请人： Seung Lee , Doo Park , Joo Park , Young Lee , Sang Park , Nam Kim
发明人： Seung Lee , Doo Park , Joo Park , Young Lee , Sang Park , Nam Kim
IPC分类号： H01L23/02
CPC分类号： H03H9/1085 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H03H3/08 , H03H9/059 , H03H9/1078 , H01L2224/81 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.
摘要翻译：这里公开了一种堆叠型表面声波封装。表面声波封装包括具有形成在其上的多个电极的第一裸芯片，具有形成在其上的多个电极和通孔的第二裸芯片，将第一裸芯片电连接到第二裸芯片的上表面的连接部分裸芯片，使得第一裸芯片的电极面对第二裸芯片的电极;以及密封构件，设置在第一裸芯片和第二裸芯片上，以在第一和第二裸芯片之间的操作表面上形成气密空间。表面声波封装可以防止在包装过程中由于外界的热冲击而引起的变形，提高产品的可靠性，最小化产品尺寸，并通过减少部件数量和材料成本降低制造成本。

3. 发明申请

US20050110812A1 Plasma display panel and driver providing gray scale representation 审中-公开
标题翻译：等离子显示面板和驱动程序提供灰度表示
公开(公告)号：US20050110812A1
公开(公告)日：2005-05-26
申请号：US10990144
申请日：2004-11-15
申请人： Seung-Ho Park , Joon-Koo Kim , Jong-Doo Park , Yong-Seok Chi , Myoung-Kwan Kim , Jae-Seok Jeong
发明人： Seung-Ho Park , Joon-Koo Kim , Jong-Doo Park , Yong-Seok Chi , Myoung-Kwan Kim , Jae-Seok Jeong
IPC分类号： G09G3/28 , G09F9/313 , G09G3/20 , G09G3/288 , G09G5/02 , G09G5/10 , H01J17/49
CPC分类号： G09G3/294 , G09G3/2022 , G09G2320/0276
摘要： A plasma display panel (PDP) driver and PDP gray scale representation method for applying a sustain pulse based subfield arrangement and address light for representation of gray scales and improving representation performance of gray scales. Inverse gamma correction is performed on input image signals so as to represent inverse gamma correction gray scales corresponding to a number of sustain pulses and address light. The inverse gamma correction gray scale is inverted into a subfield based on the number of sustain pulses so as to represent the gray scale through address light and light caused by the number of sustain pulses.
摘要翻译：一种等离子体显示面板（PDP）驱动器和PDP灰度级表示方法，用于应用基于维持脉冲的子场布置和地址光以表示灰度级并提高灰度的表示性能。对输入图像信号进行反伽马校正，以表示对应于维持脉冲数量和地址光的反伽马校正灰度级。基于维持脉冲的数量将反伽马校正灰度级反转成子场，以便通过由维持脉冲数引起的地址光和光来表示灰度级。

4. 发明授权

US06270649B1 Electrochemical methods for generation of a biological proton motive force and pyridine nucleotide cofactor regeneration 有权
标题翻译：用于生成生物质子动力和吡啶核苷酸辅因子再生的电化学方法
公开(公告)号：US06270649B1
公开(公告)日：2001-08-07
申请号：US09350072
申请日：1999-07-08
申请人： Joseph G. Zeikus , Doo Park
发明人： Joseph G. Zeikus , Doo Park
IPC分类号： C25B300
CPC分类号： C12N13/00 , C12Q1/004 , H01M8/16 , Y02E60/527
摘要： Disclosed are methods using neutral red to mediate the interconversion of chemical and electrical energy. Electrically reduced neutral red has been found to promote cell growth and formation of reduced products by reversibly increasing the ratio of the reduced:oxidized forms of NAD(H) or NADP(H). Electrically reduced neutral red is able to serve as the sole source of reducing power for microbial cell growth. Neutral red is also able to promote conversion of chemical energy to electrical energy by facilitating the transfer of electrons from microbial reducing power to a fuel cell cathode.
摘要翻译：公开了使用中性红介导化学和电能相互转化的方法。已经发现电还原的中性红通过可逆地增加还原的氧化形式的NAD（H）或NADP（H）的比例来促进细胞生长和还原产物的形成。电还原中性红可以作为减少微生物细胞生长能力的唯一来源。中性红还能通过促进电子从微生物还原能转移到燃料电池阴极而促进化学能转化为电能。

5. 发明申请

US20120212176A1 BATTERY MANAGEMENT SYSTEM 有权
标题翻译：电池管理系统
公开(公告)号：US20120212176A1
公开(公告)日：2012-08-23
申请号：US13312811
申请日：2011-12-06
申请人： Jong-Doo Park
发明人： Jong-Doo Park
IPC分类号： H02J7/00
CPC分类号： B60L3/0046 , B60L3/04 , B60L11/1866 , H02J7/0029 , H02J7/0031 , H02J7/0063 , H02J2007/004 , H02J2007/0067 , Y02T10/7005 , Y02T10/7061
摘要： A battery management system (BMS) in which a battery protection circuit controls a main switch using hardware without software control, thereby coping with troubles in the BMS or software errors.
摘要翻译：电池管理系统（BMS），其中电池保护电路使用没有软件控制的硬件来控制主开关，从而应对BMS中的麻烦或软件错误。

6. 发明授权

US07662084B2 Blood pump actuator and a blood pump system thereof 有权
标题翻译：血液泵致动器及其血液泵系统
公开(公告)号：US07662084B2
公开(公告)日：2010-02-16
申请号：US10568090
申请日：2005-10-20
申请人： Kyung Sun , Kyu Back Lee , Yong Doo Park , Ho Sung Son , Chang Mo Hwang , Gi Seok Jeong
发明人： Kyung Sun , Kyu Back Lee , Yong Doo Park , Ho Sung Son , Chang Mo Hwang , Gi Seok Jeong
IPC分类号： A61M1/10
CPC分类号： A61M1/1046 , A61M1/1037 , A61M1/1048 , A61M1/1051 , A61M1/106 , A61M1/122 , F04B9/047 , F04B43/09
摘要： A blood pump actuator to generate a driving force for driving a blood pump is disclosed. The blood pump actuator includes: a motor unit having a stator and a rotor, and rotating to generate a rotating force; a cam unit to convert the rotating motion of the motor unit into a rectilinear reciprocating motion; and a bellows unit having a bellows, which is expandable and contractible and contains a fluid therein, and an upper bellows plate and a lower bellows plate respectively attached to the upper and lower ends of the bellows, wherein the lower bellows plate moves upwards and downwards in a vertical direction according to the rectilinear reciprocating motion of the cam unit engaging with the lower bellows plate, and the bellows repeatedly expands and contracts according to the vertical movement of the lower bellows plate.
摘要翻译：公开了一种用于产生用于驱动血液泵的驱动力的血液泵致动器。血泵致动器包括：电动机单元，具有定子和转子，并且旋转以产生旋转力; 用于将马达单元的旋转运动转换为直线往复运动的凸轮单元; 以及具有可膨胀和收缩并且包含流体的波纹管的波纹管单元，以及分别附接到波纹管的上端和下端的上波纹管板和下波纹管板，其中下波纹管板上下移动根据与下波纹板接合的凸轮单元的直线往复运动而沿垂直方向，并且波纹管根据下波纹管板的垂直运动而反复膨胀和收缩。

7. 发明申请

US20080161637A1 Blood Pump Actuator And A Blood Pump System Thereof 有权
标题翻译：血泵执行机构及其血液泵系统
公开(公告)号：US20080161637A1
公开(公告)日：2008-07-03
申请号：US10568090
申请日：2005-10-20
申请人： Kyung Sun , Kyu Back Lee , Yong Doo Park , Ho Sung Son , Chang Mo Hwang , Gi Seok Jeong
发明人： Kyung Sun , Kyu Back Lee , Yong Doo Park , Ho Sung Son , Chang Mo Hwang , Gi Seok Jeong
IPC分类号： A61M1/10
CPC分类号： A61M1/1046 , A61M1/1037 , A61M1/1048 , A61M1/1051 , A61M1/106 , A61M1/122 , F04B9/047 , F04B43/09
摘要： A blood pump actuator to generate a driving force for driving a blood pump is disclosed. The blood pump actuator includes: a motor unit having a stator and a rotor, and rotating to generate a rotating force; a cam unit to convert the rotating motion of the motor unit into a rectilinear reciprocating motion; and a bellows unit having a bellows, which is expandable and contractible and contains a fluid therein, and an upper bellows plate and a lower bellows plate respectively attached to the upper and lower ends of the bellows, wherein the lower bellows plate moves upwards and downwards in a vertical direction according to the rectilinear reciprocating motion of the cam unit engaging with the lower bellows plate, and the bellows repeatedly expands and contracts according to the vertical movement of the lower bellows plate.
摘要翻译：公开了一种用于产生用于驱动血液泵的驱动力的血液泵致动器。血泵致动器包括：电动机单元，具有定子和转子，并且旋转以产生旋转力; 用于将马达单元的旋转运动转换为直线往复运动的凸轮单元; 以及具有可膨胀和收缩并且包含流体的波纹管的波纹管单元，以及分别附接到波纹管的上端和下端的上波纹管板和下波纹管板，其中下波纹管板上下移动根据与下波纹板接合的凸轮单元的直线往复运动而沿垂直方向，并且波纹管根据下波纹管板的垂直运动而反复膨胀和收缩。

8. 发明申请

US20070298472A1 Electrode compositions and configurations for electrochemical bioreactor systems 有权
标题翻译：电化学生物反应器系统的电极组成和构型
公开(公告)号：US20070298472A1
公开(公告)日：2007-12-27
申请号：US11881846
申请日：2007-07-31
申请人： Joseph Zeikus , Doo Park
发明人： Joseph Zeikus , Doo Park
IPC分类号： C12M1/18 , C12P1/00 , C12P13/00 , H01M8/16
CPC分类号： C02F3/005 , C02F2001/46133 , C12P1/00 , C12P7/46 , C12Q1/004 , C12Q1/02 , C12Q1/26 , G01N2333/245 , G01N2333/32 , H01M8/16 , Y02E60/527 , Y10S435/817 , Y10S436/806
摘要： Electrodes and configurations for electrochemical bioreactor systems that can use electrical energy as a source of reducing power in fermentation or enzymatic reactions and that can use electron mediators and a biocatalyst, such as cells or enzymes, to produce electricity are disclosed. Example electrodes in the system may comprise: (1) neutral red covalently bound to graphite felt; (2) a carboxylated cellulose bound to the graphite felt, neutral red bound to the carboxylated cellulose, NAD+ bound to the graphite felt, and an oxidoreductase (e.g., fumarate reductase) bound to the graphite felt; or (3) a metal ion electron mediator bound to graphite. Various biocatalysts, such as an oxidoreductase, cells of Actinobacillus succinogenes, cells of Escherichia coli, and sewage sludge, are suitable for use in the electrochemical bioreactor system.
摘要翻译：公开了电化学生物反应器系统的电极和结构，其可以使用电能作为在发酵或酶反应中降低功率的来源，并且可以使用电子介体和生物催化剂（例如细胞或酶）产生电。系统中的示例性电极可以包括：（1）与石墨毡共价结合的中性红; （2）与石墨毡结合的羧化纤维素，结合到石墨毡上的羧化纤维素的中性红，NAD + +和与石墨毡结合的氧化还原酶（例如富马酸盐还原酶）; 或（3）与石墨结合的金属离子电子介体。各种生物催化剂，如氧化还原酶，放线芽胞杆菌，大肠杆菌细胞和污水污泥的细胞都适用于电化学生物反应器系统。

9. 发明申请

US20060194370A1 Radio frequency module and fabrication method thereof 审中-公开
标题翻译：射频模块及其制造方法
公开(公告)号：US20060194370A1
公开(公告)日：2006-08-31
申请号：US11328197
申请日：2006-01-10
申请人： Young Lee , Doo Park , Seung Lee , Sang Park , Nam Kim
发明人： Young Lee , Doo Park , Seung Lee , Sang Park , Nam Kim
IPC分类号： H01L21/50 , H01L23/02
CPC分类号： H03H9/1078 , H01L24/97 , H01L2224/16 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H03H9/0542 , H03H9/059 , H03H9/1085 , H05K1/0237 , H05K1/0306 , H05K1/181 , H05K3/284 , H05K2201/10083 , H05K2201/10636 , Y02P70/611 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： The present invention relates to a RF module and a fabrication method thereof, wherein the packaging steps of a SAW component and a module is carried out simultaneously, thereby simplifying the fabrication process and reducing the size of the module. In the invention, a chip component is mounted on a substrate having component-connecting patterns thereon, and a SAW component in a bare chip is flip-bonded to the substrate. Thereafter, the SAW component is selectively laminated with a film and then molded; or the SAW component and the chip component are laminated as a whole and metal-plated, without any molding; or a metal wall is disposed between the substrate and the SAW component and then molded. As a result, this reduces the size of the RF modules, and simplifies the fabrication process, thereby benefiting from a cost-saving effect.
摘要翻译： RF模块及其制造方法技术领域本发明涉及RF模块及其制造方法，其中SAW组件和模块的封装步骤同时进行，从而简化了制造工艺并减小了模块的尺寸。在本发明中，芯片部件安装在其上具有部件连接图案的基板上，裸芯片中的SAW部件被翻转接合到基板。然后，将SAW成分选择性地层压成膜，然后成型; 或者将SAW部件和芯片部件作为整体进行层叠而进行金属镀覆而不进行任何成形。或者金属壁设置在基板和SAW部件之间，然后模制。结果，这减小了RF模块的尺寸，并且简化了制造工艺，从而从成本节约的效果中获益。

10. 发明申请

US20050001299A1 Substrate for semiconductor package wire bonding method using thereof 有权
标题翻译：用于半导体封装引线接合方法的基板
公开(公告)号：US20050001299A1
公开(公告)日：2005-01-06
申请号：US10884082
申请日：2004-07-01
申请人： Dong Ryu , Doo Park , Ho Kim
发明人： Dong Ryu , Doo Park , Ho Kim
IPC分类号： H01L21/60 , H01L23/49 , H01L23/498 , H01L23/544 , H05K1/02 , H05K3/28 , H01L29/06
CPC分类号： H01L24/85 , H01L23/49838 , H01L23/544 , H01L24/48 , H01L24/49 , H01L2223/54426 , H01L2223/54473 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48233 , H01L2224/48465 , H01L2224/49 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H05K1/0269 , H05K3/28 , H05K2201/09381 , H05K2201/09781 , H05K2201/0989 , H05K2203/049 , Y10S438/975 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： Disclosed is a substrate for semiconductor package and a wire bonding method using thereof. The substrate is provided with at least one reference mark on its surface to check a loading position and a shift state of a solder mask. The reference mark is composed of a combination of a reference pattern and a solder mask opening and is positioned in any location on an outer peripheral edge of a die attachment region. The reference mark may take various shapes. A method for checking a solder mask shift using the reference mark includes comparing a design value of the reference pattern and the solder mask opening with the reference pattern and the solder mask opening, which are formed in an actual material. After the solder mask shift is calculated, a wire bonding coordinate is newly constructed in consideration of the solder mask shift. This minimizes the wire bonding error.
摘要翻译：公开了一种半导体封装用基板及其使用的引线接合方法。衬底在其表面上设置有至少一个参考标记，以检查焊接掩模的装载位置和移动状态。参考标记由参考图案和焊接掩模开口的组合构成，并且定位在管芯附接区域的外周边缘上的任何位置。参考标记可以采取各种形状。使用参考标记检查焊接掩模移位的方法包括将参考图案的设计值与焊接掩模开口与用实际材料形成的参考图案和焊料掩模开口进行比较。在计算焊接掩模移位之后，考虑到焊接掩模移位，新构造引线接合坐标。这使引线接合误差最小化。

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