专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4644144A Document carrier envelope 失效
标题翻译：文件载体信封
公开(公告)号：US4644144A
公开(公告)日：1987-02-17
申请号：US733984
申请日：1985-05-13
申请人： Anthony R. Chandek , Leon J. Weistroffer , Donald E. Cooper , Daniel A. Bates
发明人： Anthony R. Chandek , Leon J. Weistroffer , Donald E. Cooper , Daniel A. Bates
IPC分类号： B65D27/06 , G06K19/06
CPC分类号： B65D27/06
摘要： A document carrier envelope is particularly useful for protectively transporting checks being returned from an institution on which the check was written to the institution at which the check was deposited. The envelope is of opaque stock, thereby preserving confidentiality of the return check. The envelope is imprinted with coded indicia indicating specific financial data suitable for high speed processing. The envelope front and back panels are joined in facing contact along the margins of three edges, thereby reducing entry of air into the envelope and eliminating fouling the processing machinery. The envelope flap is notched to receive a letter opener, and the flap fold line is perforated, thereby contributing to high speed handling.
摘要翻译：文件承运人信封对于保护性运输从支票签发的机构退回的支票特别有用，该支票已经存入支票的机构。信封是不透明的股票，从而保持退货支票的机密性。信封印有编码标记，指示适用于高速处理的特定财务数据。信封前后面板沿着三个边缘的边缘接合在一起，从而减少空气进入信封并消除加工机械的污染。信封瓣被切口以接收信号开启器，并且折翼折线被穿孔，从而有助于高速处理。

2. 发明授权

US08440543B2 Hybrid circuit structure and partial backfill method for improving thermal cycling reliability of same 有权
标题翻译：混合电路结构和部分回填方法提高热循环的可靠性
公开(公告)号：US08440543B2
公开(公告)日：2013-05-14
申请号：US13236421
申请日：2011-09-19
申请人： Donald E. Cooper , William E. Tennant
发明人： Donald E. Cooper , William E. Tennant
IPC分类号： H01L21/46 , H01L23/34 , H01L23/04 , B32B37/00
CPC分类号： H01L27/1465 , H01L21/563 , H01L27/14683 , H01L2924/0002 , H01L2924/351 , H01L2924/00
摘要： A method of improving thermal cycling reliability for a hybrid circuit structure requires providing at least two circuit layers, aligning two of the circuit layers vertically such that their respective circuit elements have a precise and well-defined spatial relationship, and providing an adhesive material which wicks into a portion of the space between the aligned layers so as to mitigate damage to the structure and/or interconnections that might otherwise occur due to thermal contraction mismatch between the layers. The adhesive material is required to have an associated viscosity such that, when provided under predetermined conditions, the adhesive stops wicking before reaching, and possibly degrading the performance of, the circuit elements.
摘要翻译：一种提高混合电路结构的热循环可靠性的方法需要提供至少两个电路层，使两个电路层垂直排列，使得它们各自的电路元件具有精确和明确定义的空间关系，并且提供芯片的粘合剂材料进入对准的层之间的空间的一部分，以便减轻由于层之间的热收缩失配而可能发生的结构和/或互连的损坏。粘合剂材料需要具有相关联的粘度，使得当在预定条件下提供时，粘合剂在到达之前停止芯吸，并且可能降低电路元件的性能。

3. 发明申请

US20130069192A1 HYBRID CIRCUIT STRUCTURE AND PARTIAL BACKFILL METHOD FOR IMPROVING THERMAL CYCLING RELIABILITY OF SAME 有权
标题翻译：混合电路结构和部分回填方法提高其循环可靠性
公开(公告)号：US20130069192A1
公开(公告)日：2013-03-21
申请号：US13236421
申请日：2011-09-19
申请人： DONALD E. COOPER , William E. Tennant
发明人： DONALD E. COOPER , William E. Tennant
IPC分类号： H01L31/02 , B29C65/48
CPC分类号： H01L27/1465 , H01L21/563 , H01L27/14683 , H01L2924/0002 , H01L2924/351 , H01L2924/00
摘要： A method of improving thermal cycling reliability for a hybrid circuit structure requires providing at least two circuit layers, aligning two of the circuit layers vertically such that their respective circuit elements have a precise and well-defined spatial relationship, and providing an adhesive material which wicks into a portion of the space between the aligned layers so as to mitigate damage to the structure and/or interconnections that might otherwise occur due to thermal contraction mismatch between the layers. The adhesive material is required to have an associated viscosity such that, when provided under predetermined conditions, the adhesive stops wicking before reaching, and possibly degrading the performance of, the circuit elements.
摘要翻译：一种提高混合电路结构的热循环可靠性的方法需要提供至少两个电路层，使两个电路层垂直排列，使得它们各自的电路元件具有精确和明确定义的空间关系，并且提供芯片的粘合剂材料进入对准的层之间的空间的一部分，以便减轻由于层之间的热收缩失配而可能发生的结构和/或互连的损坏。粘合剂材料需要具有相关联的粘度，使得当在预定条件下提供时，粘合剂在到达之前停止芯吸，并且可能降低电路元件的性能。

4. 发明授权

US4646765A Nail compositions containing cyanoacrylate and graphite 失效
标题翻译：含有氰基丙烯酸酯和石墨的指甲组合物
公开(公告)号：US4646765A
公开(公告)日：1987-03-03
申请号：US825220
申请日：1986-02-03
申请人： Donald E. Cooper , David A. Cooper
发明人： Donald E. Cooper , David A. Cooper
IPC分类号： A61K8/19 , A61K8/81 , A61K8/97 , A61Q3/02 , A45D29/00 , A45D31/00 , C08K3/04
CPC分类号： A61K8/027 , A61K8/19 , A61K8/8164 , A61K8/97 , A61Q3/02
摘要： A composition for adhering to human nails includes a mixture of a cyanoacrylate compound and/or graphite fibers. Such composition can take the form of either an artificial nail extender or a nail coating. The composition for forming an artificial nail includes graphite fibers, a cyanoacrylate, and a hardening accelerator containing a mixture of trichlorotrifluoroethane and N,N-dimethyl-P-toluidine. The accelerator is adapted to be sprayed onto a base material containing the graphite fibers and cyanoacrylate in the form of a mist. Nail compositions containing graphite fibers have significantly increased strength yet remain flexible to allow for flexure of the nail. The cyanoacrylate compounds increase the chemical bonding of the compositions to a nail.
摘要翻译：用于粘附人指甲的组合物包括氰基丙烯酸酯化合物和/或石墨纤维的混合物。这种组合物可以是人造指甲剂或指甲涂层的形式。用于形成人造指甲的组合物包括石墨纤维，氰基丙烯酸酯和包含三氯三氟乙烷和N，N-二甲基对甲苯胺的混合物的硬化促进剂。加速剂适于喷雾到含有石墨纤维和氰基丙烯酸酯的基材上，其形式为雾。含有石墨纤维的指甲组合物具有显着提高的强度，并保持柔性以允许指甲的挠曲。氰基丙烯酸酯化合物增加了组合物与指甲的化学键合。

5. 发明授权

US5585624A Apparatus and method for mounting and stabilizing a hybrid focal plane array 失效
标题翻译：用于安装和稳定混合焦平面阵列的装置和方法
公开(公告)号：US5585624A
公开(公告)日：1996-12-17
申请号：US409230
申请日：1995-03-23
申请人： Rolin K. Asatourian , Winfred L. Morris , Donald E. Cooper , Michael R. James
发明人： Rolin K. Asatourian , Winfred L. Morris , Donald E. Cooper , Michael R. James
IPC分类号： H01L27/146 , H01J3/14
CPC分类号： H01L27/1465
摘要： A hybrid focal plane array (FPA) structure including a Balanced Composite Structure (BCS) in which several layers of materials having differing thermal expansion coefficients stabilize the FPA during cryogenic cooling. An optical substrate with a layer of an optically sensitive material detects impinging radiation. The optically sensitive material is coupled to a multiplexer (MUX) substrate via interconnection bumps. The MUX is bonded to a layer of a material having a high TEC. A rigid core layer is sandwiched between the MUX and a balancing layer formed of a material having similar mechanical and geometrical characteristics to the MUX substrate. The three-layer BCS consisting of the MUX, the rigid core layer and the balancing layer is designed to have an effective TEC matching that of the optical substrate. The bumps and the optically sensitive material are thus protected from undesirable stresses generated during thermal excursions, thereby resulting in substantially improved FPA reliability.
摘要翻译：包括平衡复合结构（BCS）的混合焦平面阵列（FPA）结构，其中具有不同热膨胀系数的几层材料在低温冷却期间稳定FPA。具有光敏材料层的光学衬底检测入射辐射。光敏材料通过互连凸块耦合到多路复用器（MUX）衬底。 MUX结合到具有高TEC的材料层。一个刚性芯层夹在MUX和由具有与MUX衬底相似的机械和几何特性的材料形成的平衡层之间。由MUX，刚性芯层和平衡层组成的三层BCS被设计成具有与光学基板的TEC匹配的有效TEC。因此，凸块和光敏材料可以防止在热偏移期间产生的不期望的应力，从而导致显着提高的FPA可靠性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式