专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06629876B1 Apparatus for grinding wafers using a grind chuck having a high elastic modulus 失效
标题翻译：使用具有高弹性模量的研磨卡盘研磨晶片的装置
公开(公告)号：US06629876B1
公开(公告)日：2003-10-07
申请号：US09505960
申请日：2000-02-17
申请人： Bae-seung Park , Jin-heung Kim , Do-yun Hwang
发明人： Bae-seung Park , Jin-heung Kim , Do-yun Hwang
IPC分类号： B24B100
CPC分类号： B24B7/228 , B24B41/061 , B24B55/02
摘要： An apparatus for grinding wafers includes a grind chuck, formed of a soft material having a high elastic modulus, formed on a grind table. A grind unit grinds the wafer held by the grind chuck. Deionized water is supplied onto the wafer by a supply duct. A dam is formed on the grind table to surround the grind chuck, so that the wafer and the grind unit are submerged during grinding of the wafer. Also, an exhaust hole is formed through the grind table within an area surrounded by the dam, to exhaust the deionized water from the area surrounded by the dam.
摘要翻译：用于研磨晶片的装置包括：由研磨台上形成的具有高弹性模量的软质材料形成的研磨卡盘。研磨单元研磨由研磨卡盘保持的晶片。去离子水通过供应管道供应到晶片上。在研磨台上形成围绕研磨卡盘的坝，使得晶片和研磨单元在晶片研磨期间被浸没。此外，在由坝围绕的区域内通过研磨台形成排气孔，以从由坝围绕的区域排出去离子水。

2. 发明授权

US06269281B1 Back lapping in-line system for semiconductor device fabrication 有权
标题翻译：背面研磨用于半导体器件制造的在线系统
公开(公告)号：US06269281B1
公开(公告)日：2001-07-31
申请号：US09234498
申请日：1999-01-21
申请人： Do-yun Hwang , Jin-heung Kim
发明人： Do-yun Hwang , Jin-heung Kim
IPC分类号： G06F1900
CPC分类号： H01L21/67276 , B24B7/228
摘要： A back lapping in-line system for semiconductor device fabrication carries out a vinyl covering, a back side grinding, and a vinyl removing for grinding the back side of a wafer in-line with one single process. The back lapping in-line system has a server connected to a network line, a program therein for controlling the in-line processes, and an in-line facility connected to the server by a standard communication line, wherein parts of the in-line facility are assembled in order, and each part carries out its corresponding process according to information communicated to and from the server, and unloads the wafer after it passes through all of the corresponding processes successively. The in-line facility uses a single loading and unloading, and needs no storage space between parts.
摘要翻译：用于半导体器件制造的背面研磨在线系统执行乙烯基覆盖物，背面研磨和乙烯基除去，用于研磨与单一工艺一起的晶片背面。背面研磨在线系统具有连接到网络线的服务器，其中用于控制在线处理的程序，以及通过标准通信线路连接到服务器的在线设备，其中在线的部分设备按顺序进行组装，并且每个部件根据与服务器通信的信息执行其对应的过程，并且在连续通过所有相应处理之后卸载晶片。在线设备使用单个装载和卸载，并且不需要部件之间的存储空间。

3. 发明授权

US06193586B1 Method and apparatus for grinding wafers using a grind chuck having high elastic modulus 有权
标题翻译：使用具有高弹性模量的研磨卡盘研磨晶片的方法和装置
公开(公告)号：US06193586B1
公开(公告)日：2001-02-27
申请号：US09228037
申请日：1998-12-24
申请人： Bae-seung Park , Jin-heung Kim , Do-yun Hwang
发明人： Bae-seung Park , Jin-heung Kim , Do-yun Hwang
IPC分类号： B24B722
CPC分类号： B24B7/228 , B24B41/061 , B24B55/02
摘要： A method and apparatus for grinding wafers without using an ultraviolet tape attached to the front face of the wafer reduces manufacturing costs, simplifies the grinding process and protects the semiconductor chips formed on the front face of the wafer from being damaged by static electricity. The grinding apparatus uses a grind chuck formed of a soft material having a high elastic modulus and a rising groove formed in the grind chuck. Deionized water is supplied onto the wafer from a first direction. Simultaneously, deionized water or air is supplied into the rising groove of the grind chuck from a second direction opposite to the first direction. The circumferential edge of the wafer overlaps the rising groove, such that the simultaneous supply of deionized water and/or air from the two directions protects the front surface of the wafer from being contaminated by silicon dust. The soft material of the grind chuck also protects the front surface of the wafer from being damaged by pressure from the grind unit.
摘要翻译：用于研磨晶片而不使用附着在晶片正面的紫外线带的方法和装置降低了制造成本，简化了研磨工艺，并保护了晶片正面上形成的半导体芯片免受静电损伤。研磨装置使用由具有高弹性模量的软质材料形成的研磨卡盘和形成在研磨卡盘中的上升槽。去离子水从第一方向供应到晶片上。同时，从与第一方向相反的第二方向将去离子水或空气供给到研磨卡盘的上升槽中。晶片的圆周边缘与上升槽重叠，从而从两个方向同时供应去离子水和/或空气保护晶片的前表面免受硅粉污染。研磨卡盘的软质材料还保护晶片的前表面免受来自研磨单元的压力的损坏。

4. 发明授权

US5840614A Method of producing a semiconductor wafer using ultraviolet sensitive tape 失效
标题翻译：使用紫外线敏感胶带制造半导体晶片的方法
公开(公告)号：US5840614A
公开(公告)日：1998-11-24
申请号：US744376
申请日：1996-11-07
申请人： Sung Min Sim , Do Yun Hwang
发明人： Sung Min Sim , Do Yun Hwang
IPC分类号： H01L21/301 , H01L21/304 , H01L21/306 , H01L21/68 , H01L21/302
CPC分类号： H01L21/6835 , H01L21/3043 , H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： A process for producing semiconductor devices using ultraviolet sensitive tape including the steps of forming a plurality of chips on a first surface of a semiconductor wafer, adhering an ultraviolet sensitive tape to the first surface of the semiconductor wafer, back lapping a second surface of the wafer, opposite to the first surface, and irradiating the ultraviolet sensitive tape with ultraviolet rays to release the ultraviolet sensitive tape from the wafer.
摘要翻译：一种使用紫外线敏感带的半导体器件的制造方法，包括以下步骤：在半导体晶片的第一表面上形成多个芯片，将紫外线敏感带粘附到半导体晶片的第一表面，背面研磨晶片的第二表面与第一表面相对，并且用紫外线照射紫外线敏感带以从晶片释放紫外线敏感带。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式