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1. 发明授权

US08277227B2 Feedthrough for electrical connectors 有权
标题翻译：电连接器馈通
公开(公告)号：US08277227B2
公开(公告)日：2012-10-02
申请号：US13196207
申请日：2011-08-02
申请人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John L. Parker
发明人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John L. Parker
IPC分类号： H01R12/00
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
摘要翻译：一种形成导电馈通的方法（10）。方法（10）包括形成包括牺牲部件和非牺牲部件的导电结构（21）的第一步骤（11）。在从导电结构去除至少一部分牺牲部件之前，非牺牲部件的至少一部分可以被相对电绝缘的材料（35）涂覆。馈通的结构提供通过可植入组件的壳体的壁的电连接，同时防止材料在组件的内部与周围环境之间的不期望的转移。

2. 发明授权

US08672667B2 Electrically insulative structure having holes for feedthroughs 失效
标题翻译：具有用于馈通孔的电绝缘结构
公开(公告)号：US08672667B2
公开(公告)日：2014-03-18
申请号：US12669793
申请日：2008-07-15
申请人： Desmond A. McCusker , Mark Spalding , Steven J. Berry , Nicholas C. K. Pawsey , Steven Kennedy
发明人： Desmond A. McCusker , Mark Spalding , Steven J. Berry , Nicholas C. K. Pawsey , Steven Kennedy
IPC分类号： B29C45/34
CPC分类号： A61N1/3754 , H01R13/5224 , H01R43/24 , H01R2201/12
摘要： Forming feedthrough device comprising an electrically insulative structure having holes extending there through. The holes have disposed therein conductive members around which the electrically insulative structure is hermetically sealed.
摘要翻译：形成馈通装置，其包括具有在其延伸的孔的电绝缘结构。孔中设置有导电构件，电绝缘结构围绕该导电构件进行气密密封。

3. 发明申请

US20090034769A1 IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：可植入医疗器械
公开(公告)号：US20090034769A1
公开(公告)日：2009-02-05
申请号：US11814507
申请日：2006-01-27
申请人： Ian Darley , Slobodan Ilic , Desmond A. McCusker , John Parker
发明人： Ian Darley , Slobodan Ilic , Desmond A. McCusker , John Parker
IPC分类号： H04R25/00
CPC分类号： A61N1/36032 , A61N1/36036 , A61N1/375 , A61N1/3758
摘要： The present invention provides an implant device comprising a shell and a printed circuit board for mounting electronic components, wherein the shell surrounds the printed circuit board and defines a large area for large electronic components mounted on the printed circuit board and a small area for smaller electronic components. The shell has a shape that is curved. The shell may consist of two layers, with one layer being thicker. Also one layer may provide openings or feedthroughs for connecting the implant to other components, such as coils and electrode arrays.
摘要翻译：本发明提供了一种植入装置，其包括外壳和用于安装电子部件的印刷电路板，其中壳体围绕印刷电路板并且为安装在印刷电路板上的大型电子部件和用于较小电子的小面积限定了大面积组件。外壳具有弯曲的形状。外壳可以由两层组成，一层较厚。还有一层可以提供用于将植入物连接到其它部件（例如线圈和电极阵列）的开口或馈通。

4. 发明授权

US08885837B2 Implantable medical device 有权
标题翻译：植入式医疗器械
公开(公告)号：US08885837B2
公开(公告)日：2014-11-11
申请号：US11814507
申请日：2006-01-27
申请人： Ian Darley , Slobodan Ilic , Desmond A. McCusker , John Parker
发明人： Ian Darley , Slobodan Ilic , Desmond A. McCusker , John Parker
IPC分类号： H04R5/00 , H04R25/00 , A61N1/36 , A61N1/375
CPC分类号： A61N1/36032 , A61N1/36036 , A61N1/375 , A61N1/3758
摘要： An implantable device having an impact side likely to receive forces applied to the device is disclosed, the device comprising: a hermetically-sealed container including, a chassis having secure thereto at least one functional component, a first shell hermetically connected to the chassis to form a hermetic enclosure in which the at least one functional component is located, at least on feedthrough disposed in one or more of either the chassis and the first shell, configured to permit at least one input/output line to infiltrate the hermetic enclosure; and a second shell connected to the container so as to be spaced from and adjacent to the container to define the impact side of the device and to form with the container a non-hermetic enclosure.
摘要翻译：公开了具有可能接收施加到该装置的力的冲击侧的可植入装置，所述装置包括：密封容器，其包括：固定至少一个功能部件的底盘;密封地连接到所述底盘的第一壳体，以形成至少一个功能部件位于其中的至少一个位于至少一个设置在底盘和第一壳体中的一个或多个中的馈通孔上，其配置成允许至少一个输入/输出线渗透密封外壳; 以及与容器连接以便与容器间隔开并与容器相邻的第二壳体，以限定装置的冲击侧，并与容器形成非密封的外壳。

5. 发明授权

US07988507B2 Feedthrough for electrical connectors 有权
标题翻译：电连接器馈通
公开(公告)号：US07988507B2
公开(公告)日：2011-08-02
申请号：US12025145
申请日：2008-02-04
申请人： Derek Ian Darley , Desmond A. McCusker , Dusan Milojevicrg , John L. Parker
发明人： Derek Ian Darley , Desmond A. McCusker , Dusan Milojevicrg , John L. Parker
IPC分类号： H01R9/22
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
摘要翻译：一种形成导电馈通的方法（10）。方法（10）包括形成包括牺牲部件和非牺牲部件的导电结构（21）的第一步骤（11）。在从导电结构去除至少一部分牺牲部件之前，非牺牲部件的至少一部分可以被相对电绝缘的材料（35）涂覆。馈通的结构提供通过可植入组件的壳体的壁的电连接，同时防止材料在组件的内部与周围环境之间的不期望的转移。

6. 发明申请

US20080208289A1 FEEDTHROUGH FOR ELECTRICAL CONNECTORS 有权
公开(公告)号：US20080208289A1
公开(公告)日：2008-08-28
申请号：US12025145
申请日：2008-02-04
申请人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John Parker
发明人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John Parker
IPC分类号： A61N1/00 , H01R3/00
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.

7. 发明授权

US07996982B2 Method of making feedthroughs for electrical connectors 有权
标题翻译：电连接器馈通方法
公开(公告)号：US07996982B2
公开(公告)日：2011-08-16
申请号：US12025180
申请日：2008-02-04
申请人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John Parker
发明人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John Parker
IPC分类号： H01G4/00
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
摘要翻译：一种形成导电馈通的方法（10）。方法（10）包括形成包括牺牲部件和非牺牲部件的导电结构（21）的第一步骤（11）。在从导电结构去除至少一部分牺牲部件之前，非牺牲部件的至少一部分可以被相对电绝缘的材料（35）涂覆。馈通的结构提供通过可植入组件的壳体的壁的电连接，同时防止材料在组件的内部与周围环境之间的不期望的转移。

8. 发明申请

US20110059331A1 DIVERTING A CAPILLARY FLOW OF BRAZE MATERIAL DURING A BRAZING METHOD 审中-公开
标题翻译：在BRAZING方法期间划分布料材料的毛细管流
公开(公告)号：US20110059331A1
公开(公告)日：2011-03-10
申请号：US12878711
申请日：2010-09-09
申请人： James G. E. Smith , Mark A. Spalding , Desmond A. McCusker , Derek I. Darley
发明人： James G. E. Smith , Mark A. Spalding , Desmond A. McCusker , Derek I. Darley
IPC分类号： B32B3/10 , B23K1/00
CPC分类号： B23K1/18 , A61N1/3754 , B23K1/0008 , Y10T428/12361
摘要： A method for joining a first component to a second component with a brazing material, the first component including an aperture for receiving the second component. The method includes positioning the second component within the first component via the aperture to form a gap between an inner surface of the first component and an outer surface of the second component, introducing by capillary action brazing material into the gap between the first component and the second component, and forming a join between the first and second component upon cooling of the brazing material introduced by capillary action. According to this first aspect of the present invention, the capillary flow of brazing material in the gap is diverted via a capillary flow diverter located in the gap between the first and second component.
摘要翻译：一种用钎焊材料将第一部件连接到第二部件的方法，所述第一部件包括用于接收第二部件的孔。该方法包括经由孔将第二部件定位在第一部件内，以在第一部件的内表面和第二部件的外表面之间形成间隙，通过毛细作用钎焊材料引入第一部件和第二部件之间的间隙并且在通过毛细管作用引入的钎焊材料冷却时，在第一和第二部件之间形成接头。根据本发明的第一方面，通过位于第一和第二部件之间的间隙中的毛细管分流器将间隙中的钎焊材料的毛细管流转移。

9. 发明申请

US20100326723A1 ELECTRICALLY INSULATIVE STRUCTURE HAVING HOLES FOR FEEDTHROUGHS 失效
标题翻译：电气绝缘结构具有用于馈线的孔
公开(公告)号：US20100326723A1
公开(公告)日：2010-12-30
申请号：US12669793
申请日：2008-07-15
申请人： Desmond A. McCusker , Mark Spalding , Steven J. Berry , Nicholas C. K. Pawsey , Steven Kennedy
发明人： Desmond A. McCusker , Mark Spalding , Steven J. Berry , Nicholas C. K. Pawsey , Steven Kennedy
IPC分类号： H02G3/02 , B29C45/56
CPC分类号： A61N1/3754 , H01R13/5224 , H01R43/24 , H01R2201/12
摘要： Forming feedthrough device comprising an electrically insulative structure having holes extending there through. The holes have disposed therein conductive members around which the electrically insulative structure is hermetically sealed.
摘要翻译：形成馈通装置，其包括具有在其延伸的孔的电绝缘结构。孔中设置有导电构件，电绝缘结构围绕该导电构件进行气密密封。

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