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    • 8. 发明申请
    • INTEGRATED CIRCUIT DEVICE
    • 集成电路设备
    • US20150235998A1
    • 2015-08-20
    • US14180466
    • 2014-02-14
    • Robert MORANDerek BEATTIE
    • Robert MORANDerek BEATTIE
    • H01L25/11
    • H01L25/0657H01L25/0655H01L2924/0002H01L2924/00
    • Aspects of the invention relate to an integrated circuit device and method of production thereof. The integrated circuit device comprises at least one application semiconductor die comprising at least one functional component arranged to provide application functionality, at least one functional safety semiconductor die comprising at least one component arranged to provide at least one functional safety undertaking for the at least one application semiconductor die, and at least one System in Package, SiP, connection component operably coupling the at least one functional safety semiconductor die to the at least one application semiconductor die to enable the at least one functional safety semiconductor die to provide the at least one functional safety undertaking for the at least one application semiconductor die.
    • 本发明的方面涉及一种集成电路装置及其制造方法。 所述集成电路装置包括至少一个应用半导体管芯,所述至少一个应用半导体管芯包括布置成提供应用功能的至少一个功能部件,至少一个功能安全半导体管芯,包括至少一个部件,所述至少一个部件布置成为所述至少一个应用 半导体管芯和至少一个系统级封装SiP连接部件可操作地将至少一个功能安全半导体管芯耦合到至少一个应用半导体管芯,以使至少一个功能安全半导体管芯能够提供至少一个功能性 至少一个应用半导体管芯的安全承诺。