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1. 发明申请

US20120231689A1 FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME 审中-公开
公开(公告)号：US20120231689A1
公开(公告)日：2012-09-13
申请号：US13075147
申请日：2011-03-29
申请人： Deok Hoon Kim , Kyung Wook Paik , Kyoung Lim Suk , Jae Ok Kim
发明人： Deok Hoon Kim , Kyung Wook Paik , Kyoung Lim Suk , Jae Ok Kim
IPC分类号： D03D15/00 , H01B1/22 , C09K11/08 , H01B1/20 , H01F1/01
CPC分类号： H01R4/04 , C08G2650/40 , C08L71/00 , C08L71/02 , C08L77/00 , C08L77/10 , C08L79/04 , C08L81/02 , C08L81/06 , C09J133/08 , C09J133/20 , C09J133/24 , C09J135/06 , C09J143/04 , D01D5/0007 , D01F1/10 , H01R12/52 , H05K3/323 , H05K2201/0278 , H05K2201/029 , Y10T428/254 , Y10T428/28 , Y10T428/2852 , Y10T428/287 , Y10T428/2874 , Y10T428/2878 , Y10T428/2887 , Y10T428/2891 , Y10T428/2896 , Y10T442/30
摘要： Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

2. 发明申请

US20070007667A1 Electronic package having a sealing structure on predetermined area, and the method thereof 有权
标题翻译：具有预定区域的密封结构的电子封装及其方法
公开(公告)号：US20070007667A1
公开(公告)日：2007-01-11
申请号：US11521369
申请日：2006-09-15
申请人： Deok-Hoon Kim
发明人： Deok-Hoon Kim
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/29011 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/83191 , H01L2924/07811 , H01L2924/00
摘要： An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of wavelengths. The package further formed to include at least one photo-sensing die having a photo-sensing area defined on a front side thereof. The photo-sensing die is mounted to the substrate by a plurality of interconnection joints disposed about the photo-sensing area, whereby the front side of the photo-sensing die is spaced by a gap from a front surface of the substrate. A sealing structure is formed to extend about the interconnection joints to fill portions of the gap thereabout, such that the sealing structure contiguously encloses an internal cavity in substantially sealed manner between the photo-sensing die and substrate. This internal cavity communicates with the photo-sensing area of the photo-sensing die.
摘要翻译：提供了一种用于感光装置的电子封装。封装形成为包括对预定波长范围内的光基本上透明的材料的基板。该封装进一步形成为包括至少一个光敏裸片，其具有限定在其正面的光敏区域。感光芯片通过围绕感光区域设置的多个互连接头安装到基板上，由此感光芯片的前侧与衬底的前表面间隔开间隙。密封结构被形成为围绕互连接头延伸以填充其周围的间隙的部分，使得密封结构以基本上密封的方式在光敏裸片和衬底之间连续地包围内部空腔。该内腔与感光芯片的感光区域连通。

3. 发明授权

US07122874B2 Electronic package having a sealing structure on predetermined area, and the method thereof 有权
标题翻译：具有预定区域的密封结构的电子封装及其方法
公开(公告)号：US07122874B2
公开(公告)日：2006-10-17
申请号：US10937252
申请日：2004-09-10
申请人： Deok-Hoon Kim
发明人： Deok-Hoon Kim
IPC分类号： H01L31/203
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/29011 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/83191 , H01L2924/07811 , H01L2924/00
摘要： An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of wavelengths. The package further formed to include at least one photo-sensing die having a photo-sensing area defined on a front side thereof. The photo-sensing die is mounted to the substrate by a plurality of interconnection joints disposed about the photo-sensing area, whereby the front side of the photo-sensing die is spaced by a gap from a front surface of the substrate. A sealing structure is formed to extend about the interconnection joints to fill portions of the gap thereabout, such that the sealing structure contiguously encloses an internal cavity in substantially sealed manner between the photo-sensing die and substrate. This internal cavity communicates with the photo-sensing area of the photo-sensing die.
摘要翻译：提供了一种用于感光装置的电子封装。封装形成为包括对预定波长范围内的光基本上透明的材料的基板。该封装进一步形成为包括至少一个光敏裸片，其具有限定在其正面的光敏区域。感光芯片通过围绕感光区域设置的多个互连接头安装到基板上，由此感光芯片的前侧与衬底的前表面间隔开间隙。密封结构被形成为围绕互连接头延伸以填充其周围的间隙的部分，使得密封结构以基本上密封的方式在光敏裸片和衬底之间连续地包围内部空腔。该内腔与感光芯片的感光区域连通。

4. 发明申请

US20060097335A1 Electronic package for image sensor, and the packaging method thereof 有权
标题翻译：图像传感器电子封装及其封装方法
公开(公告)号：US20060097335A1
公开(公告)日：2006-05-11
申请号：US11052864
申请日：2005-02-09
申请人： Deok-Hoon Kim , Hwan-Chul Lee
发明人： Deok-Hoon Kim , Hwan-Chul Lee
IPC分类号： H01L31/0203 , H01L21/4763
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/29011 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/1461 , H01L2924/16195 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defining a sealing area, and a first solder sealing ring pad formed on that front side. The substrate is provided with a front surface opposing the front side of the semiconductor die on which a second solder sealing ring pad is formed. A solder sealing ring structure is sandwiched between the first and second solder sealing pads of the substrate and semiconductor die, such that it extends peripherally about a substantial portion of the sealing area to substantially enclose thereat a cavity between the semiconductor die and the substrate. The solder sealing ring structure includes at least one venting portion defining against at least one of the substrate and semiconductor die an air vent in open communication with the cavity.
摘要翻译：提供一种半导体器件封装及其制造方法。半导体器件封装通常包括耦合到半导体管芯的至少一个半导体管芯和衬底。半导体管芯具有限定密封区域的前侧和形成在该前侧的第一焊料密封环垫。基板设置有与形成有第二焊料密封环垫的半导体管芯的前侧相对的前表面。焊料密封环结构被夹在基板和半导体管芯的第一和第二焊料密封垫之间，使得其在密封区域的大部分周围周边延伸，以在半导体管芯和衬底之间基本上封闭空腔。焊料密封环结构包括至少一个排气部分，其限定衬底和半导体管芯中的至少一个，与空腔开放连通的通风口。

5. 发明申请

US20060043513A1 Method of making camera module in wafer level 审中-公开
标题翻译：在晶圆级别制作相机模块的方法
公开(公告)号：US20060043513A1
公开(公告)日：2006-03-02
申请号：US11095456
申请日：2005-04-01
申请人： Deok-Hoon Kim
发明人： Deok-Hoon Kim
IPC分类号： H01L31/062
CPC分类号： H01L27/14618 , H01L31/0203 , H01L31/02325 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2924/00014 , H01L2924/07811 , H04N5/2257 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A plurality of photo-sensing device packages are provided. The packages are formed on unit substrate portions of a substrate to each include at least one photo-sensing semiconductor die. The substrate is formed of a material substantially transparent to light within a predetermined range of wavelengths, with each unit substrate portion being provided with front and backside surfaces on opposite sides thereof. Each photo-sensing semiconductor die defines at least one photo-sensing area opposing the front surface of one unit substrate portion for receiving light impinging upon its backside surface and passing therethrough. A plurality of lens housings are also provided on the substrate, each including at least one lens element disposed in optical alignment with said photo-sensing semiconductor die of one said unit substrate. The plurality of photo-packages are formed by dicing the substrate to separate the unit substrate portions one from the other.
摘要翻译：提供了多个感光装置包装。封装形成在基板的单元基板部分上，每个包括至少一个感光半导体管芯。衬底由在预定波长范围内对光基本上透明的材料形成，每个单元衬底部分在其相对侧上设置有正面和背面。每个感光半导体管芯限定了与一个单元基板部分的前表面相对的至少一个感光区域，用于接收入射在其背面上并穿过其中的光。多个透镜壳体也设置在基板上，每个透镜壳体包括与一个所述单元基板的所述光敏半导体管芯对准设置的至少一个透镜元件。通过对衬底进行切割以将单元衬底部分彼此分开来形成多个光封装。

6. 发明授权

US07494848B2 Flip-chip packaging of a photo-sensor die on a transparent substrate 有权
标题翻译：光传感器芯片在透明基板上的倒装封装
公开(公告)号：US07494848B2
公开(公告)日：2009-02-24
申请号：US11521369
申请日：2006-09-15
申请人： Deok-Hoon Kim
发明人： Deok-Hoon Kim
IPC分类号： H01L23/31
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/29011 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/83191 , H01L2924/07811 , H01L2924/00
摘要： An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of wavelengths. The package further formed to include at least one photo-sensing die having a photo-sensing area defined on a front side thereof. The photo-sensing die is mounted to the substrate by a plurality of interconnection joints disposed about the photo-sensing area, whereby the front side of the photo-sensing die is spaced by a gap from a front surface of the substrate. A sealing structure is formed to extend about the interconnection joints to fill portions of the gap thereabout, such that the sealing structure contiguously encloses an internal cavity in substantially sealed manner between the photo-sensing die and substrate. This internal cavity communicates with the photo-sensing area of the photo-sensing die.
摘要翻译：提供了一种用于感光装置的电子封装。封装形成为包括对预定波长范围内的光基本上透明的材料的基板。该封装进一步形成为包括至少一个光敏裸片，其具有限定在其正面的光敏区域。感光芯片通过围绕感光区域设置的多个互连接头安装到基板上，由此感光芯片的前侧与衬底的前表面间隔开间隙。密封结构被形成为围绕互连接头延伸以填充其周围的间隙的部分，使得密封结构以基本上密封的方式在光敏裸片和衬底之间连续地包围内部空腔。该内腔与感光芯片的感光区域连通。

7. 发明授权

US07291518B2 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof 有权
标题翻译：蜂窝电话摄像机模块中的照片传感器的电子封装及其制造和组装
公开(公告)号：US07291518B2
公开(公告)日：2007-11-06
申请号：US11131271
申请日：2005-05-18
申请人： Deok-Hoon Kim
发明人： Deok-Hoon Kim
IPC分类号： H01L21/44 , H01L21/50 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14645 , H01L27/14683 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15787 , H01L2924/16151 , H01L2924/16195 , H01L2924/19041 , H04N5/2257 , H01L2924/00014 , H01L2924/00
摘要： A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths and a sensing portion having at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths. The assembly portion is formed with at least one metal layer disposed on the substrate about a front surface region thereof, and at least one passivation layer formed to extend over the metal layer. The passivation layer is patterned to define a plurality of first and second access openings respectively about a plurality of first solder wettable pads and at least one second solder wettable pad on the metal layer. Each of the first solder wettable pads is joined by a first solder joint to a solder bump pad formed on the sensing portion, while the second solder wettable pad is joined by a second solder joint to external circuitry.
摘要翻译：提供了一种感光器件封装及其封装方法。该封装包括具有由对预定波长范围内的光基本上透明的材料形成的基板的组件部分和具有在预定波长范围内的至少一个感光芯片光电转换光的感测部分。组装部分形成有至少一个金属层，其围绕其前表面区域设置在基板上，以及形成为在金属层上延伸的至少一个钝化层。钝化层被图案化以分别围绕金属层上的多个第一焊料可湿性焊盘和至少一个第二焊料可润湿焊盘限定多个第一和第二进入开口。每个第一焊料可湿性焊盘通过第一焊接接头连接到形成在感测部分上的焊料凸块焊盘，而第二焊料可湿性焊盘通过第二焊接接头连接到外部电路。

8. 发明申请

US20050073017A1 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof 有权
公开(公告)号：US20050073017A1
公开(公告)日：2005-04-07
申请号：US10829273
申请日：2004-04-22
申请人： Deok-Hoon Kim
发明人： Deok-Hoon Kim
IPC分类号： H01L21/00 , H01L21/50 , H01L23/52 , H01L27/14 , H01L27/146 , H01L29/40 , H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14645 , H01L27/14683 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15787 , H01L2924/16151 , H01L2924/16195 , H01L2924/19041 , H04N5/2257 , H01L2924/00014 , H01L2924/00
摘要： A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths and a sensing portion having at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths. The assembly portion is formed with at least one metal layer disposed on the substrate about a front surface region thereof, and at least one passivation layer formed to extend over the metal layer. The passivation layer is patterned to define a plurality of first and second access openings respectively about a plurality of first solder wettable pads and at least one second solder wettable pad on the metal layer. Each of the first solder wettable pads is joined by a first solder joint to a solder bump pad formed on the sensing portion, while the second solder wettable pad is joined by a second solder joint to external circuitry.

9. 发明申请

US20110193231A1 ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：电子设备包装及其制造方法
公开(公告)号：US20110193231A1
公开(公告)日：2011-08-11
申请号：US12885233
申请日：2010-09-17
申请人： Peter ELENIUS , Deok Hoon KIM , Young Sang CHO
发明人： Peter ELENIUS , Deok Hoon KIM , Young Sang CHO
IPC分类号： H01L23/488 , H01L21/768
CPC分类号： H01L23/10 , H01L23/3128 , H01L23/564 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14683 , H01L31/0203 , H01L2224/13 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13147 , H01L2224/14155 , H01L2224/16237 , H01L2224/16503 , H01L2224/29011 , H01L2224/29014 , H01L2224/29035 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32 , H01L2224/32227 , H01L2224/32503 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81447 , H01L2224/8181 , H01L2224/8182 , H01L2224/83 , H01L2224/83102 , H01L2224/83191 , H01L2224/83447 , H01L2224/8381 , H01L2224/83825 , H01L2224/9211 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/15321 , H01L2924/15788 , H01L2224/81 , H01L2924/00014 , H01L2224/73103 , H01L2924/00012 , H01L2924/00
摘要： An electronic device package includes a substrate assembly, an electronic device disposed to face the substrate assembly, and a sealing ring or rings including a sealing layer and a bonding layer that is disposed between the substrate assembly and the electronic device, wherein the sealing ring(s) has a closed loop shape surrounding a sealing region of the electronic device, and the bonding layer is formed through a reaction of the sealing layer and sealing layer pad with a low-melting-point material layer whose melting point is lower than that of the sealing layer and sealing ring pad. The bonding layer is formed of an intermetallic compound of the sealing layer, sealing ring pad and low-melting-point material that melts at a temperature greater than the melting temperature of the low-melting-point material. The device package also includes electrical connections in the form of joints between the substrate assembly and electronic device.
摘要翻译：电子器件封装包括衬底组件，设置为面对衬底组件的电子器件，以及密封环或环，其包括设置在衬底组件和电子器件之间的密封层和接合层，其中密封环 s）具有围绕电子器件的密封区域的闭环形状，并且通过密封层和密封层焊盘与熔点低于熔点的低熔点材料层的反应形成接合层密封层和密封环垫。接合层由密封层，密封环垫和低熔点材料的金属间化合物形成，其熔点高于低熔点材料的熔融温度。器件封装还包括在衬底组件和电子器件之间的接合形式的电连接。

10. 发明申请

US20100237498A1 PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF 审中-公开
标题翻译：用于半导体器件的封装及其封装方法
公开(公告)号：US20100237498A1
公开(公告)日：2010-09-23
申请号：US12599298
申请日：2008-10-28
申请人： Deok Hoon Kim , Young Sang Cho , Hwan Chul Lee
发明人： Deok Hoon Kim , Young Sang Cho , Hwan Chul Lee
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/29 , H01L23/49811 , H01L24/13 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/32014 , H01L2224/81054 , H01L2224/81136 , H01L2224/81191 , H01L2224/81211 , H01L2224/81801 , H01L2224/8191 , H01L2224/83191 , H01L2224/83194 , H01L2224/83801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/1532 , H01L2924/15788 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2224/83205 , H01L2224/05599
摘要： A semiconductor device package and a method thereof are able to reliably package a semiconductor device on a substrate without using flux. The semiconductor device package includes a semiconductor device and a substrate reciprocally disposed with respect to the semiconductor device, wherein the substrate includes a side reciprocal to the semiconductor device on which there are formed a plurality of prominences surrounding an accommodation region where the semiconductor device is to be disposed. The method of packaging a semiconductor device includes preparing the semiconductor device, preparing a substrate, forming a plurality of prominences to surround an accommodation region on the substrate where the semiconductor device is to be disposed, dropping the semiconductor device within the accommodation region, and packaging the semiconductor device on the substrate.
摘要翻译：半导体器件封装及其方法能够将半导体器件可靠地封装在基板上而不使用焊剂。半导体器件封装包括半导体器件和相对于半导体器件相互配置的衬底，其中衬底包括与半导体器件往复的一侧，在该半导体器件上形成有围绕半导体器件的容纳区域的多个突起被处置封装半导体器件的方法包括制备半导体器件，制备衬底，形成多个突出部以围绕要放置半导体器件的衬底上的容纳区域，将半导体器件放置在容纳区域内，以及封装衬底上的半导体器件。

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