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    • 4. 发明申请
    • LARGE AREA LIGHT EMITTING ELECTRICAL PACKAGE WITH CURRENT SPREADING BUS
    • 具有电流扩展总线的大面积发光电气封装
    • US20120153812A1
    • 2012-06-21
    • US12972913
    • 2010-12-20
    • Deeder AURONGZEBJames Michael KOSTKA
    • Deeder AURONGZEBJames Michael KOSTKA
    • H01J1/62
    • H01L51/5212H01L27/3204H01L27/3237H01L27/3288H01L2251/5361
    • Disclosed herein is a light emitting electrical package having a first electrode layer comprising a substantially transparent nonmetallic conductive material, and a plurality of light emitting elements disposed on said first electrode layer. The first electrode layer comprises a peripheral region, and an elongated bus is disposed on at least a portion of the peripheral region and adjacent the first electrode layer. The elongated bus is configured to spread current across a length dimension of said first electrode layer. Also disclosed are elongated bus structure designed intended to reduce the resistive losses along a transparent nonmetallic conductive contact at its edge or periphery. One design for an elongated bus comprises: (1) a conductive adhesive/metal foil/conductive adhesive sandwich structure; (2) another design comprises a vapor deposited bus of one or more materials; and a further design employs (1) and (2) in tandem.
    • 本文公开了一种具有包括基本上透明的非金属导电材料的第一电极层和设置在所述第一电极层上的多个发光元件的发光电气封装。 第一电极层包括外围区域,并且细长总线设置在周边区域的至少一部分上并与第一电极层相邻。 细长总线被配置成在所述第一电极层的长度尺寸上扩展电流。 还公开了细长总线结构,其旨在减少沿着其边缘或周边的透明非金属导电接触的电阻损耗。 一种用于细长母线的设计包括:(1)导电粘合剂/金属箔/导电粘合剂夹心结构; (2)另一设计包括一种或多种材料的气相沉积总线; 并且进一步的设计一起使用(1)和(2)。
    • 10. 发明申请
    • Foil connector for a lamp
    • 用于灯的箔连接器
    • US20070262688A1
    • 2007-11-15
    • US11433108
    • 2006-05-12
    • Deeder Aurongzeb
    • Deeder Aurongzeb
    • H01J5/48
    • H01J61/368H01J9/28
    • A foil connector (28, 30) suited for use in a lamp (10) is provided. The foil connector includes a substrate layer (40) formed from an electrically conductive material. A coating (42) is provided for reducing oxidation of the substrate during lamp operation. The coating includes a first coating layer (44) on the substrate comprising a noble metal, a second coating layer (46) spaced from the substrate by the first coating layer, the second coating layer comprising a noble metal, and optionally, a third coating layer (48) spaced from the substrate by the first and second coating layers, the third coating layer comprising a noble metal.
    • 提供适用于灯(10)的箔连接器(28,30)。 箔连接器包括由导电材料形成的基底层(40)。 提供涂层(42),用于在灯操作期间减少衬底的氧化。 所述涂层包括在所述基材上的第一涂层(44),所述第一涂层包括贵金属,通过所述第一涂层与所述基板间隔开的第二涂层(46),所述第二涂层包含贵金属,以及任选地,第三涂层 层(48)通过第一和第二涂层与衬底隔开,第三涂层包含贵金属。