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1. 发明授权

US5718941A Bleed resistant cyanate ester-containing compositions 失效
标题翻译：含有耐渗氰的含氰酸酯的组合物
公开(公告)号：US5718941A
公开(公告)日：1998-02-17
申请号：US811554
申请日：1997-03-04
申请人： Stephen M. Dershem , Deborah L. Derfelt
发明人： Stephen M. Dershem , Deborah L. Derfelt
IPC分类号： C08G73/06 , C09J4/00 , C09J11/06 , C09J179/04 , B05D5/12 , H01B1/20 , H01L21/02
CPC分类号： C09J179/04 , C08G73/0655 , C09J11/06 , C09J4/00
摘要： In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.
摘要翻译：根据本发明，提供了含有少量渗血控制剂的粘合剂制剂，其使得本发明组合物对树脂流出物具有极高的抗性。考虑用于实施本发明的几种不同类型的排泄控制剂，例如阳离子表面活性剂，叔胺，叔膦，两性表面活性剂，多官能化合物等，以及其任何两种或多种的混合物。

2. 发明授权

US5646241A Bleed resistant cyanate ester-containing compositions 失效
标题翻译：含有耐渗氰的含氰酸酯的组合物
公开(公告)号：US5646241A
公开(公告)日：1997-07-08
申请号：US475006
申请日：1995-06-07
申请人： Stephen M. Dershem , Deborah L. Derfelt
发明人： Stephen M. Dershem , Deborah L. Derfelt
IPC分类号： C08G73/06 , C09J4/00 , C09J11/06 , C09J179/04 , C08G73/00 , C08K5/16
CPC分类号： C09J179/04 , C08G73/0655 , C09J11/06 , C09J4/00
摘要： In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.
摘要翻译：根据本发明，提供了含有少量渗血控制剂的粘合剂制剂，其使得本发明组合物对树脂流出物具有极高的抗性。考虑用于实施本发明的几种不同类型的排泄控制剂，例如阳离子表面活性剂，叔胺，叔膦，两性表面活性剂，多官能化合物等，以及其任何两种或多种的混合物。

3. 发明授权

US5753748A Bleed resistant cyanate ester-containing compositions 失效
标题翻译：含有耐渗氰的含氰酸酯的组合物
公开(公告)号：US5753748A
公开(公告)日：1998-05-19
申请号：US687363
申请日：1996-08-02
申请人： Stephen M. Dershem , Deborah L. Derfelt
发明人： Stephen M. Dershem , Deborah L. Derfelt
IPC分类号： C07K14/65 , C08G73/06 , C09J4/00 , C09J11/06 , C09J179/04 , C08K5/17 , C08K5/49 , H01B1/20
CPC分类号： C09J179/04 , C07K14/65 , C08G73/0655 , C09J11/06 , C09J4/00 , C07K2319/00
摘要： In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.
摘要翻译： PCT No.PCT / US96 / 04960 Sec。 371日期：1996年8月2日 102（e）日期1996年8月2日PCT PCT 1996年4月11日PCT公布。公开号WO96 / 35760 日期1996年11月14日根据本发明，提供了含有少量渗血控制剂的粘合剂制剂，其使本发明组合物对树脂流出物具有极高的抗性。考虑用于实施本发明的几种不同类型的排泄控制剂，例如阳离子表面活性剂，叔胺，叔膦，两性表面活性剂，多官能化合物等，以及其任何两种或多种的混合物。

4. 发明授权

US5447988A Solvent free die-attach compositions 失效
标题翻译：无溶剂的芯片附着组合物
公开(公告)号：US5447988A
公开(公告)日：1995-09-05
申请号：US157665
申请日：1993-11-23
申请人： Stephen M. Dershem , Dennis B. Patterson , Deborah L. Derfelt
发明人： Stephen M. Dershem , Dennis B. Patterson , Deborah L. Derfelt
IPC分类号： C08G73/06 , C08K3/08 , H01B1/22 , H01B1/02
CPC分类号： H01B1/22 , C08G73/0655 , C08K3/08
摘要： In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler, and a curing catalyst, in the substantial absence of alkylphenol. The recognition that attach paste compositions are effective without the addition of alkylphenol has the benefit of reducing the cost of preparation, as well as the ease of preparation of die attach pastes containing electrically conductive filler and polycyanate ester monomer. The incorporation of alkylphenol into die-attach paste compositions has been found to be unnecessary, due to the presence of catalytically active species on the surface of filler flake employed in the preparation of such pastes. Indeed, it is desirable to eliminate alkylphenols from die-attach paste compositions because alkylphenols are acidic species that do not become incorporated into the final polymerized matrix of the cured attach paste. These acidic species can thus leach out, leaving voids in the cured composition and causing corrosion of sensitive electronic parts which come in contact therewith. Optional treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.
摘要翻译：根据本发明，提供了一种用于将半导体器件附着到衬底上的新型组合物。本发明组合物包含液态聚氰酸酯单体，导电填料和固化催化剂，基本上不存在烷基酚。在不添加烷基酚的情况下附着糊剂组合物有效的认识有益于降低制备成本，以及容易制备含有导电填料和聚氰酸酯单体的管芯附着浆料。已经发现，由于在制备这种糊料中使用的填料片表面上存在催化活性物质，因此已经发现将烷基酚引入到模具附着糊剂组合物中是不必要的。实际上，由于烷基酚是不被引入固化的附着浆料的最终聚合基质中的酸性物质，因此期望从模头附着糊剂组合物中除去烷基酚。这些酸性物质因此可能被浸出，在固化的组合物中留下空隙并导致与其接触的敏感电子部件的腐蚀。填充剂的任选处理使其不含催化活性金属离子显着延长了组合物的适用期。

5. 发明授权

US5358992A Die-attach composition comprising polycyanate ester monomer 失效
标题翻译：包含聚氰酸酯单体的模片附着组合物
公开(公告)号：US5358992A
公开(公告)日：1994-10-25
申请号：US23962
申请日：1993-02-26
申请人： Stephen M. Dershem , Deborah L. Derfelt , Dennis B. Patterson
发明人： Stephen M. Dershem , Deborah L. Derfelt , Dennis B. Patterson
IPC分类号： C08G73/06 , C08K3/08 , H01B1/22 , C08G73/00 , C08K5/09 , H01B1/02
CPC分类号： H01B1/22 , C08G73/0655 , C08K3/08
摘要： In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.
摘要翻译：根据本发明，提供了一种用于将半导体器件附着到衬底上的新型组合物。本发明组合物包含液体聚氰酸酯单体，基本上不含催化活性金属离子的导电填料和固化催化剂。填充剂的处理使其不含催化活性金属离子显着延长了组合物的适用期。

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