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    • 3. 发明申请
    • DISTRIBUTION PLATE IN ELECTROLYTE BATH
    • 电解槽中的分布板
    • US20140158528A1
    • 2014-06-12
    • US14131065
    • 2012-05-03
    • David MertensDominiek Seynaeve
    • David MertensDominiek Seynaeve
    • C25D5/08C25D7/06C25D17/16
    • C25D5/08C25D7/0607C25D17/00C25D17/16C25D21/12
    • An installation (20) for continuously electroplating a plurality of elongated metal elements (21, 21′, 21″) with another metal comprises a bath (22) of an electrolyte wherein the elongated metal elements (21, 21′, 21″) are travelling. The bath (22) comprises a collector space (24) positioned under the elongated metal elements (21, 21′, 21″) and the bath further comprises a distribution plate (26) between the collector space (24) and the elongated metal elements (21, 21′, 21″). The installation (20) further comprises a pump (25) for circulating the electrolyte in the bath (22) from the collector space (24) through the distribution plate (26). The collector space (24) causes first flow losses to the flow of the electrolyte. The distribution plate (26) has a multiplicity of openings for allowing the flow of the electrolyte and these openings cause second flow losses to the flow of the electrolyte. Each of the second flow losses is at least five times greater than the first flow losses.
    • 用于使用另一种金属连续电镀多个细长金属元件(21,21',21“)的安装件(20)包括电解液的浴槽(22),其中细长的金属元件(21,21',21”)是 旅行 浴(22)包括位于细长金属元件(21,21',21“)下方的收集器空间(24),并且浴还包括在收集器空间(24)和细长金属元件 (21,21',21“)。 该装置(20)还包括用于使来自收集空间(24)的电解液(22)中的电解液循环通过分配板(26)的泵(25)。 收集器空间(24)对电解液的流动造成第一流量损失。 分配板(26)具有多个用于允许电解液流动的开口,并且这些开口对电解液的流动造成第二流量损失。 每个第二流量损失比第一流量损失大至少五倍。