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1. 发明授权

US08355246B2 Modular air management devices 有权
标题翻译：模块化空气管理设备
公开(公告)号：US08355246B2
公开(公告)日：2013-01-15
申请号：US12562772
申请日：2009-09-18
申请人： Manuel D. Linhares, Jr. , Michael J. Tresh , David Lucia , Dan Murphy , Meagan Foley , Mark Dignum , Richard Latino
发明人： Manuel D. Linhares, Jr. , Michael J. Tresh , David Lucia , Dan Murphy , Meagan Foley , Mark Dignum , Richard Latino
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The invention provides modular air management devices for directing or diverting air flow within an equipment cabinet or enclosure to provide adequate cooling for non-“front to back” breathing electronic devices, and include a scoop assembly, a tray assembly, a vertical mount assembly, and a shroud assembly. The air management devices are designed to direct air flow to and from “side to side” breathing and “side inlet, rear exhaust” electronic equipment. The assemblies may be mounted inside or outside enclosure rails and may be augmented with fan assemblies.
摘要翻译：本发明提供了用于引导或转移设备柜或外壳内的空气流的模块化空气管理装置，以为非前后呼吸电子装置提供足够的冷却，并且包括勺组件，托盘组件，垂直安装组件和护罩总成。空气管理装置设计用于将气流引导到一侧到另一侧呼吸和侧入口，后排气电子设备。组件可以安装在机箱导轨的内部或外部，并且可以用风扇组件增强。

2. 发明申请

US20100248609A1 Assembly For Providing A Downflow Return Air Supply 审中-公开
标题翻译：提供回流供气的装配
公开(公告)号：US20100248609A1
公开(公告)日：2010-09-30
申请号：US12551657
申请日：2009-09-01
申请人： Michael Tresh , Brian Jackson , Edward Bednarcik , John Prunier , Martin Olsen , Mark Germagian , David Lucia
发明人： Michael Tresh , Brian Jackson , Edward Bednarcik , John Prunier , Martin Olsen , Mark Germagian , David Lucia
IPC分类号： H05K5/02 , F24D19/00 , F28D15/00 , F28F13/12
CPC分类号： H05K7/20745
摘要： An assembly for supplying heated air to a housing with an interior that is adapted to hold air conditioning equipment. The housing has a top portion and a back portion, where the top portion defines a first opening that leads to the interior of the housing, and where the first opening is proximate the back of the top portion of the housing. The back portion of the housing defines a second opening that leads to the housing interior, where the second opening is proximate the top of the back portion. The assembly includes a flue external to the housing and adapted to be coupled to the housing such that the flue encompasses and is in fluid communication with the first and second openings, the flue defining an inlet for conducting heated air into the flue and an outlet for conducting heated air out of the flue and into the housing through the first and second openings. The air cooled by the air conditioning equipment in the housing is used to cool electronic equipment.
摘要翻译：用于将热空气供应到具有适于容纳空调设备的内部的壳体的组件。壳体具有顶部部分和后部部分，其中顶部部分限定通向壳体内部的第一开口，并且其中第一开口靠近壳体顶部部分的后部。壳体的后部限定了通向壳体内部的第二开口，其中第二开口靠近后部的顶部。该组件包括外壳外部的烟道并且适于联接到壳体，使得烟道包围并与第一和第二开口流体连通，烟道限定用于将加热的空气传导到烟道中的入口和用于将热空气通过第一和第二开口导出烟道并进入壳体。由外壳中的空调设备冷却的空气用于冷却电子设备。

3. 发明申请

US20100238626A1 Modular Air Management Devices 有权
标题翻译：模块化空气管理设备
公开(公告)号：US20100238626A1
公开(公告)日：2010-09-23
申请号：US12562772
申请日：2009-09-18
申请人： Manuel D. Linhares, JR. , Michael Tresh , Meagan Foley , David Lucia , Mark Dignum , Dan Murphy , Richard Latino
发明人： Manuel D. Linhares, JR. , Michael Tresh , Meagan Foley , David Lucia , Mark Dignum , Dan Murphy , Richard Latino
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The invention provides modular air management devices for directing or diverting air flow within an equipment cabinet or enclosure to provide adequate cooling for non-“front to back” breathing electronic devices, and include a scoop assembly, a tray assembly, a vertical mount assembly, and a shroud assembly. The air management devices are designed to direct air flow to and from “side to side” breathing and “side inlet, rear exhaust” electronic equipment. The assemblies may be mounted inside or outside enclosure rails and may be augmented with fan assemblies.
摘要翻译：本发明提供了用于引导或转向设备柜或外壳内的空气流的模块化空气管理装置，以为非“前后”呼吸电子设备提供足够的冷却，并且包括勺组件，托盘组件，垂直安装组件，和护罩组件。空气管理装置被设计成引导空气流入“从一侧到另一侧”呼吸和“侧入口，后排气”电子设备。组件可以安装在机箱导轨的内部或外部，并且可以用风扇组件增强。

4. 发明授权

US10588245B2 Assembly for extracting heat from a housing for electronic equipment 有权
公开(公告)号：US10588245B2
公开(公告)日：2020-03-10
申请号：US13538480
申请日：2012-06-29
申请人： David Lucia , Michael Tresh , Edward Bednarcik
发明人： David Lucia , Michael Tresh , Edward Bednarcik , Mark Germagian , John Prunier , Martin Olsen
IPC分类号： H05K7/00 , H05K7/20
摘要： An assembly for extracting heat from a housing for electronic equipment, the housing having an essentially solid top portion and an essentially solid back portion. The assembly includes a first opening in the top portion of the housing, the first opening located at the back of the top portion, proximate the back portion of the housing, a second opening in the back portion of the housing, the second opening located at the top of the back portion, proximate the top portion of the housing, wherein the first opening is contiguous with the second opening, and a chimney external to the housing and coupled to the housing. The chimney encompasses and is in fluid communication with the first and second openings.

5. 发明申请

US20120329378A1 Assembly for Extracting Heat from a Housing for Electronic Equipment 审中-公开
标题翻译：从电子设备外壳提取热量的组件
公开(公告)号：US20120329378A1
公开(公告)日：2012-12-27
申请号：US13538480
申请日：2012-06-29
申请人： David Lucia , Michael Tresh , Edward Bednarcik , Mark Germagian , John Prunier , Martin Olsen
发明人： David Lucia , Michael Tresh , Edward Bednarcik , Mark Germagian , John Prunier , Martin Olsen
IPC分类号： H05K5/00 , F24F13/02 , H05K7/20
CPC分类号： H05K7/20745
摘要： An assembly for extracting heat from a housing for electronic equipment the housing having an essentially solid top portion and an essentially solid back portion. The assembly includes a first opening in the top portion of the housing, the first opening located at the back of the top portion, proximate the back portion of the housing, a second opening in the back portion of the housing, the second opening located at the top of the back portion, proximate the top portion of the housing, wherein the first opening is contiguous with the second opening, and a chimney external to the housing and coupled to the housing. The chimney encompasses and is in fluid communication with the first and second openings.
摘要翻译：一种用于从用于电子设备的壳体提取热量的组件，该壳体具有基本上固体的顶部部分和基本上固体的后部部分。组件包括位于壳体顶部的第一开口，位于顶部后部附近的第一开口，靠近壳体的后部，壳体后部的第二开口，第二开口位于背部的顶部，靠近壳体的顶部，其中第一开口与第二开口邻接，以及位于外壳外部并联接到壳体的烟囱。烟囱包围并与第一和第二开口流体连通。

6. 发明申请

US20090239460A1 Assembly for Extracting Heat from a Housing for Electronic Equipment 审中-公开
标题翻译：从电子设备外壳提取热量的组件
公开(公告)号：US20090239460A1
公开(公告)日：2009-09-24
申请号：US12409647
申请日：2009-03-24
申请人： David Lucia , Michael Tresh , Edward Benarcik
发明人： David Lucia , Michael Tresh , Edward Benarcik
IPC分类号： H05K5/00
CPC分类号： H05K7/20745
摘要： An assembly for extracting heat from a housing for electronic equipment with an interior that is adapted to hold heat-generating electronic equipment, the housing having an essentially solid top portion and an essentially solid back portion. The assembly includes a first opening in the top portion of the housing that leads to the housing interior, the first opening located at the back of the top portion, proximate the back portion of the housing, a second opening in the back portion of the housing that leads to the housing interior, the second opening located at the top of the back portion, proximate the top portion of the housing, wherein the first opening is contiguous with the second opening, and a chimney external to the housing and coupled to the housing such that the chimney encompasses and is in fluid communication with the first and second openings, the chimney defining an inlet for taking in air leaving the housing through the first and second openings and an outlet for conducting the air out of the chimney.
摘要翻译：一种用于从具有适于保持发热电子设备的内部的用于电子设备的壳体提取热量的组件，所述壳体具有基本上固体的顶部部分和基本上固体的后部部分。组件包括在壳体的顶部部分中的第一开口，该第一开口通向壳体内部，第一开口位于顶部的后部，靠近壳体的后部，壳体的后部中的第二开口其导致壳体内部，第二开口位于靠近壳体顶部的靠背部分的顶部，其中第一开口与第二开口邻接，而烟囱外部连接到壳体使得烟囱包围并与第一和第二开口流体连通，烟囱限定用于吸入通过第一和第二开口离开壳体的空气的入口和用于将空气导出烟囱的出口。

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