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1. 外观设计

USD419160S Personal communications unit docking station 失效
公开(公告)号：USD419160S
公开(公告)日：2000-01-18
申请号：US88089
申请日：1998-05-14
申请人： Steven F. Davidson , Kim D. Vollendorf , Michael F. DiCicco , David C. Brown , Christopher C. Gielow , David J. Cottingham
设计人： Steven F. Davidson , Kim D. Vollendorf , Michael F. DiCicco , David C. Brown , Christopher C. Gielow , David J. Cottingham

2. 外观设计

USD421443S Holder for a communication device 失效
公开(公告)号：USD421443S
公开(公告)日：2000-03-07
申请号：US88061
申请日：1998-05-14
申请人： Albert L. Nagele , Scott Kouri , Brian J. Hassemer , Patrick McCormick , David J. Cottingham
设计人： Albert L. Nagele , Scott Kouri , Brian J. Hassemer , Patrick McCormick , David J. Cottingham

3. 发明授权

US5159751A Method of manufacturing electronic module assembly 失效
标题翻译：电子模块组装制造方法
公开(公告)号：US5159751A
公开(公告)日：1992-11-03
申请号：US835817
申请日：1992-02-18
申请人： David J. Cottingham , Michael J. Petrites , Thomas J. Tischhauser
发明人： David J. Cottingham , Michael J. Petrites , Thomas J. Tischhauser
IPC分类号： H05K1/00 , H05K1/05 , H05K1/18 , H05K3/00 , H05K5/00
CPC分类号： H05K1/028 , H05K1/189 , H05K5/0043 , H05K1/05 , H05K2201/09063 , H05K2201/09109 , H05K2201/10189 , H05K2201/2009 , H05K3/0061 , Y10T29/4913 , Y10T29/49135
摘要： An electronic module assembly (31) is provided by assembling components (17) to a planar polyimide flex circuit film (14) laminated to an aluminum rigidizer plate (11). The flex circuit film and rigidizer are then bent by a sheet metal bending process such that the rigidizer plate forms an exterior protective housing and the components are provided in an interior space (30). Connector pins (23) provide external electrical access to the components and circuit patterns (15, 16, 19) on the film (14). Structures (24, 25, 29) mate with the bent plate and substantially enclose the interior space. Module cost is reduced since the existing flex circuit rigidizer plate is used to form part of the module housing, and economical planar component assembly techniques are utilized while eliminating the step of mounting the flex circuit rigidizer plate to an external module housing. Two techniques for using a mandrel shaft (26, 35) to bend the plate (11) without stressing the film (14) are disclosed.
摘要翻译：通过将部件（17）组装到层压到铝刚性板（11）上的平面聚酰亚胺柔性电路膜（14）上来提供电子模块组件（31）。柔性电路膜和刚性化器然后通过金属板弯曲工艺弯曲，使得刚性板形成外部保护壳体，并且部件设置在内部空间（30）中。连接器引脚（23）提供对薄膜（14）上的组件和电路图案（15,16,19）的外部电接入。结构（24,25,29）与弯曲板匹配并且基本上包围内部空间。模块成本降低，因为现有的柔性电路刚性板用于形成模块壳体的一部分，并且利用经济的平面部件组装技术，同时消除将柔性电路刚性化板安装到外部模块壳体的步骤。公开了使用心轴（26,35）在不压制薄膜（14）的情况下使板（11）弯曲的两种技术。

4. 外观设计

USD421002S Personal communications unit handset 失效
公开(公告)号：USD421002S
公开(公告)日：2000-02-22
申请号：US88163
申请日：1998-05-15
申请人： Steven F. Davidson , Kim D. Vollendorf , Michael F. DiCicco , David C. Brown , Christopher C. Gielow , David J. Cottingham
设计人： Steven F. Davidson , Kim D. Vollendorf , Michael F. DiCicco , David C. Brown , Christopher C. Gielow , David J. Cottingham

5. 外观设计

USD399504S Housing for a portable communications device 失效
公开(公告)号：USD399504S
公开(公告)日：1998-10-13
申请号：US66009
申请日：1997-02-03
申请人： Phillip E. Lindeman , Leslie J. Clemens , David J. Cottingham
设计人： Phillip E. Lindeman , Leslie J. Clemens , David J. Cottingham

6. 发明授权

US5103375A Electronic module assembly and method of manufacture 失效
标题翻译：电子模块组装及制造方法
公开(公告)号：US5103375A
公开(公告)日：1992-04-07
申请号：US474873
申请日：1990-02-05
申请人： David J. Cottingham , Michael I. Petrites , Thomas J. Tischhauser
发明人： David J. Cottingham , Michael I. Petrites , Thomas J. Tischhauser
IPC分类号： H05K1/00 , H05K1/05 , H05K1/18 , H05K3/00 , H05K5/00
CPC分类号： H05K1/028 , H05K1/189 , H05K5/0043 , H05K1/05 , H05K2201/09063 , H05K2201/09109 , H05K2201/10189 , H05K2201/2009 , H05K3/0061 , Y10T29/4913
摘要： An electronic module assembly (31) is provided by assembling components (17) to a planar polyimide flex circuit film (14) laminated to an aluminum rigidizer plate (11). The flex circuit film and rigidizer are then bent by a sheet metal bending process such that the rigidizer plate forms an exterior protective housing and the components are provided in an interior space (30). Connector pins (23) provide external electrical access to the components and circuit patterns (15, 16, 19) on the film (14). Structures (24, 25, 29) mate with the bent plate and substantially enclose the interior space. Module cost is reduced since the existing flex circuit rigidizer plate is used to form part of the module housing, and economical planar component assembly techniques are utilized while eliminating the step of mounting the flex circuit rigidizer plate to an external module housing. Two techniques for using a mandrel shaft (26, 35) to bend the plate (11) without stressing the film (14) are disclosed.
摘要翻译：通过将部件（17）组装到层压到铝刚性板（11）上的平面聚酰亚胺柔性电路膜（14）上来提供电子模块组件（31）。柔性电路膜和刚性化器然后通过金属板弯曲工艺弯曲，使得刚性板形成外部保护壳体，并且部件设置在内部空间（30）中。连接器引脚（23）提供对薄膜（14）上的组件和电路图案（15,16,19）的外部电接入。结构（24,25,29）与弯曲板匹配并且基本上包围内部空间。模块成本降低，因为现有的柔性电路刚性板用于形成模块壳体的一部分，并且利用经济的平面部件组装技术，同时消除将柔性电路刚性化板安装到外部模块壳体的步骤。公开了使用心轴（26,35）在不压制薄膜（14）的情况下使板（11）弯曲的两种技术。

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