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    • 3. 发明申请
    • VERTICALLY OFFSET EMI PROJECTIONS
    • 垂直偏移EMI投影
    • US20060121794A1
    • 2006-06-08
    • US11259291
    • 2005-10-26
    • Michael HanleyJames MoonBruce KrugerDavid Gaio
    • Michael HanleyJames MoonBruce KrugerDavid Gaio
    • H01R13/64
    • H01R13/6596G02B6/4292H01R13/659
    • The present invention relates to an electronic module, such as an opto-electronic transceiver or a copper transceiver, for plugging into a host receptacle. In an effort to eliminate the use of costly and inefficient sheet metal spring fingers for reducing EMI emissions, the present invention proposes to use solid conductive projections extending outwardly from the sides and top of the module housing. However, in highly populated host receptacles, adjacent cages often share a common sheet metal wall, which will deform when a module with a solid projection extending therefrom is inserted, thereby making insertion of an adjacent module very difficult. The present invention eliminates this problem by vertically offsetting projections on the opposite sides of the housing so no two projections are in the same horizontal plane.
    • 本发明涉及一种用于插入主机插座的电子模块,例如光电收发器或铜收发器。 为了消除使用昂贵且低效的钣金弹簧指以减少EMI辐射,本发明提出使用从模块壳体的侧面和顶部向外延伸的固体导电突起。 然而,在高度居住的主机插座中,相邻的笼通常共享一个共同的金属板,当从其延伸的具有实心突起的模块被插入时,其将变形,从而使相邻模块的插入变得非常困难。 本发明通过在壳体的相对侧上垂直偏移的突起来消除这个问题,所以没有两个突起在同一水平面上。