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    • 2. 发明申请
    • METHOD FOR PRESERVING PROCESSING HISTORY ON A WAFER
    • 保存加工历史的方法
    • US20080237811A1
    • 2008-10-02
    • US11694057
    • 2007-03-30
    • Rohit PalDavid F. Brown
    • Rohit PalDavid F. Brown
    • H01L23/544
    • H01L22/20
    • A method for capturing process history includes performing at least a first process for forming features on a semiconducting substrate. A first cap is formed over a first region of the semiconducting substrate after performing the first process. At least a second process is performed for forming the features in a second region other than the first region while leaving the first cap in place to thereby prevent the features in the first region covered by the first cap from being exposed to the second process. A first characteristic of a first feature is measured in the first region, and a second characteristic of a second feature in the second region is measured. A wafer includes a first partially completed feature disposed in a first region. A first cap is formed above the first partially completed feature. A second partially completed feature is disposed in a second region of the wafer different than the first region. The second partially completed feature is at a later stage of completion than the first partially completed feature.
    • 用于捕获工艺历史的方法包括至少执行用于在半导体衬底上形成特征的第一工艺。 在执行第一处理之后,在半导体基板的第一区域上形成第一盖。 执行至少第二过程,用于在除了第一区域之外的第二区域中形成特征,同时将第一盖留在适当位置,从而防止第一盖子覆盖的第一区域中的特征暴露于第二过程。 在第一区域中测量第一特征的第一特征,并且测量第二区域中的第二特征的第二特征。 晶片包括设置在第一区域中的第一部分完成特征。 在第一部分完成的特征之上形成第一盖。 第二部分完成的特征被布置在不同于第一区域的晶片的第二区域中。 第二部分完成的功能处于完成的后期,而不是第一部分完成的功能。