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1. 发明授权

US6113751A Electromagnetic beam assisted deposition method for depositing a material on an irradiated substrate 失效
标题翻译：用于在照射的基底上沉积材料的电磁束辅助沉积方法
公开(公告)号：US6113751A
公开(公告)日：2000-09-05
申请号：US130705
申请日：1998-08-06
申请人： Daniel R. Morgenthaler
发明人： Daniel R. Morgenthaler
IPC分类号： C23C14/04 , C23C16/04 , C23C14/34 , C23C14/28
CPC分类号： H01L31/0749 , C23C14/048 , C23C16/047 , H01L31/0322 , H01L31/18 , Y02E10/541 , Y02P70/521
摘要： A method and system for making monolithically integrated thin film photovoltaic is disclosed. In one embodiment of the system, a device for directing electromagnetic energy having a selected frequency is utilized to electronically excite a portion of a second medium on the surface of a substrate to facilitate reaction with an excitable deposition medium. The frequency may be selected such that the desired reaction between the excited second medium and deposition medium is facilitated and side reactions and incorporation of impurities into the thin film are minimized. Multiple layers may be formed by selecting additional frequencies, if necessary. The method of the present invention allows formation of monolithically integrated thin films without removing material from the substrate surface between deposition steps. In one embodiment, the method of the present invention includes the steps of providing a first excitable deposition medium, providing a substrate having a second medium positionable thereon, selecting a frequency of electromagnetic energy to excite the second medium, and directing electromagnetic energy having the selected frequency on at least a portion of the second medium to excite the medium to an excited state to facilitate a reaction with the excitable deposition medium, the product of such reaction being a first thin film deposit on the substrate.
摘要翻译：公开了一种用于制造单片集成薄膜光伏的方法和系统。在该系统的一个实施例中，用于引导具有选定频率的电磁能的装置用于电子地激发衬底表面上的第二介质的一部分以促进与可兴奋的沉积介质的反应。可以选择频率使得激发的第二介质和沉积介质之间的期望反应被促进，并且杂质的副反应和引入薄膜最小化。如果需要，可以通过选择附加频率来形成多个层。本发明的方法允许在沉积步骤之间形成单片集成薄膜而不从衬底表面去除材料。在一个实施方案中，本发明的方法包括以下步骤：提供第一可激发沉积介质，提供具有可定位于其上的第二介质的基底，选择电磁能量的频率以激发第二介质，以及引导具有所选择的电磁能频率在第二介质的至少一部分上以将介质激发到激发态，以促进与可激发沉积介质的反应，这种反应的产物是在基底上沉积的第一薄膜。

2. 发明授权

US6024581A Electrical socket for a multichip module 失效
标题翻译：多芯片模块的电源插座
公开(公告)号：US6024581A
公开(公告)日：2000-02-15
申请号：US778868
申请日：1997-01-02
申请人： David M. Barnett , Daniel R. Morgenthaler
发明人： David M. Barnett , Daniel R. Morgenthaler
IPC分类号： H01R33/74 , H05K1/18 , H01R9/09
CPC分类号： H01R12/57
摘要： An electrical socket used for interconnecting a multichip module to a printed circuit board or similar electrical system. The electrical socket is independent of the multichip module and permits removal and replacement of the multichip module without damaging the module and its module electrical leads. The socket includes an insulated base strip and an insulated cap strip. The base strip includes a plurality of elongated lower pockets therein for receiving and properly aligning each of the module electrical leads therein. The base strip also includes conductive pads in the bottom of and along the length of each pocket. Each conductive pad is connected to a socket lead. The socket leads are used for connection to the printed circuit board or like electrical system. The cap strip includes a plurality of elongated upper pockets therein which are dimensioned for receipt above the lower pockets of the base strip. The module electrical leads are curved sinusoidally so that when the cap strip is received on top of the base strip, the module electrical leads are compressed inside the upper and lower pockets. The compliance of the leads inside the electrical socket provides for maintaining good electrical contact during various environmental stresses such as temperature fluctuations and vibrations found during aircraft and spacecraft flight.
摘要翻译：用于将多芯片模块互连到印刷电路板或类似电气系统的电插座。电源插座独立于多芯片模块，允许拆卸和更换多芯片模块，而不会损坏模块及其模块电源线。插座包括绝缘基底条和绝缘帽条。基底条在其中包括多个细长的下部袋，用于接收并正确对准每个模块电引线。基底条还包括在每个口袋的底部和沿着每个口袋的长度的导电垫片。每个导电焊盘连接到插座引线。插座引线用于连接到印刷电路板或类似的电气系统。盖带包括多个细长的上袋，其尺寸适于容纳在基条的下袋上方。模块电导线正弦曲线，使得当盖带被接收在基带的顶部时，模块电引线被压缩在上部和下部口袋内。电插座内引线的顺应性提供了在各种环境应力（如飞机和航天器飞行期间发现的温度波动和振动）时保持良好的电接触。

3. 发明授权

US6062526A Differential Stiffness system for attenuating vibrations 失效
标题翻译：用于衰减振动的差速刚度系统
公开(公告)号：US6062526A
公开(公告)日：2000-05-16
申请号：US130133
申请日：1998-08-06
申请人： Daniel R. Morgenthaler
发明人： Daniel R. Morgenthaler
IPC分类号： F16F15/04 , F16M13/00
CPC分类号： F16F15/04 , F16F2224/0258
摘要： A vibration attenuation system (10) is disclosed for at least partially isolating a structure (16) from a vibrating source (14). The system (10) generally includes a differential stiffness assembly (12) interposed between the vibration source (14) and the structure (16), a vibration sensor (18) for sensing a vibration from the source (14), a controller (20) for controlling operation of the differential stiffness assembly (12) based on a sensed vibration from the source (14), and an actuator for varying a load applied to the differential stiffness assembly (12) in response to control signals from the controller (20). The differential stiffness assembly (12) includes an element such as a metallic tube (30), that provides a variable frequency-related vibration transmission/attenuation response depending on a load applied to the member. In one embodiment, a shape memory alloy wire (28) is interconnected to the tube (30) to apply a varying load to the tube (30) depending on a temperature of the wire (28).
摘要翻译：公开了一种用于至少部分隔离振动源（14）的结构（16）的振动衰减系统（10）。系统（10）通常包括置于振动源（14）和结构（16）之间的差动刚度组件（12），用于感测源（14）振动的振动传感器（18），控制器），用于基于来自所述源（14）的感测到的振动来控制所述差速刚度组件（12）的操作;以及致动器，用于响应于来自所述控制器（20）的控制信号而改变施加到所述差速刚度组件（12）的负载）。差速刚度组件（12）包括诸如金属管（30）的元件，其根据施加到构件的负载提供可变频率相关的振动传播/衰减响应。在一个实施例中，形状记忆合金线（28）与管（30）互连以根据线（28）的温度向管（30）施加变化的负载。

4. 发明授权

US06467731B1 Integrated sample return capsule 失效
标题翻译：集成样品回收胶囊
公开(公告)号：US06467731B1
公开(公告)日：2002-10-22
申请号：US09532587
申请日：2000-03-22
申请人： Edward Nathan Harris , Daniel R. Morgenthaler , Kenneth P. Romeo , Michael A. Sasdelli , Janine M. Thornton , Michael G. Thornton , William H. Willcockson
发明人： Edward Nathan Harris , Daniel R. Morgenthaler , Kenneth P. Romeo , Michael A. Sasdelli , Janine M. Thornton , Michael G. Thornton , William H. Willcockson
IPC分类号： B64G162
CPC分类号： B64G1/58 , B64G1/62
摘要： An integrated sample return capsule for use in returning materials to Earth from space, such as core samples from other celestial bodies and experiments from orbiting platforms. The sample return capsule incorporates thermal protection, structural integrity and impact mitigation into a single system capable of safely and securely returning the materials without requiring decelerating parachutes. In one embodiment, the integrated sample return capsule includes a forward facing heat shield and a back shell attached to the rear of the heat shield. The heat shield and the back shell define an interior enclosure. The back shell includes an access, such as a door or a removable panel, there through to the interior enclosure. Materials to be returned may be sealed in a sample containment vault, and the sealed vault may be placed into the interior enclosure through the access. An optional support deck may be provided within the interior enclosure for receiving the sample containment vault and supporting the vault within the interior enclosure.
摘要翻译：一种用于将材料从空间返回到地球的综合样品回收胶囊，例如来自其他天体的核心样品和来自轨道平台的实验。样品回收胶囊将热保护，结构完整性和冲击减轻纳入能够安全可靠地返回材料而不需要减速伞的单个系统。在一个实施例中，集成样品返回胶囊包括附接到隔热罩后部的面向前的隔热罩和后壳。隔热罩和后壳限定一个内部外壳。后壳包括通向内部外壳的通道，例如门或可拆卸面板。要退回的材料可以密封在样品容纳库中，并且密封的保险库可以通过通道被放入内部外壳中。可以在内部外壳内提供可选的支撑平台，用于接收样品收容库，并将保险库支撑在内部外壳内。

5. 发明授权

US6061243A Modular and multifunctional structure 失效
标题翻译：模块化和多功能结构
公开(公告)号：US6061243A
公开(公告)日：2000-05-09
申请号：US331922
申请日：1999-06-29
申请人： David M. Barnett , Suraj P. Rawal , Daniel R. Morgenthaler , Edward N. Harris
发明人： David M. Barnett , Suraj P. Rawal , Daniel R. Morgenthaler , Edward N. Harris
IPC分类号： H01L23/13 , H01L23/14 , H01L23/373 , H01L25/16 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/36 , H05K7/20
CPC分类号： H05K1/021 , B64G1/10 , B64G1/428 , H01L23/13 , H01L23/142 , H01L23/145 , H01L23/3733 , H01L25/162 , B64G2001/1092 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H05K1/0272 , H05K1/142 , H05K1/148 , H05K1/182 , H05K2201/0116 , H05K2201/0209 , H05K2201/0323 , H05K2201/10689 , H05K3/0061 , H05K3/0064 , H05K3/361
摘要： The present invention is directed to a multifunction structure (MFS) in which electrical/electronic componentry, thermal control and structural support are integrated into a monolithic structure that is particularly useful in spacecraft applications. The multifunctional structure is also designed to be modular so that the electrical/electronic componentry can be repaired or replaced.
摘要翻译： PCT No.PCT / US98 / 23840 Sec。 371日期1999年6月29日第 102（e）日期1999年6月29日PCT提交1998年11月6日PCT公布。出版物WO99 / 25165 日期1999年5月20日本发明涉及一种多功能结构（MFS），其中电气/电子组件，热控制和结构支撑被集成到在宇宙飞船应用中特别有用的单片结构中。多功能结构也被设计为模块化的，以便电气/电子组件可以被修理或更换。

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