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    • 1. 发明授权
    • Phased array antenna apparatus and methods of manufacture
    • 相控阵天线装置及制造方法
    • US07489283B2
    • 2009-02-10
    • US11615740
    • 2006-12-22
    • Daisy L. IngramPatrick Bailleul
    • Daisy L. IngramPatrick Bailleul
    • H01Q21/00
    • H01Q21/0087H01Q3/26H01Q21/061H01Q25/00Y10T29/49016
    • Embodiments include phased array antenna apparatus and methods of manufacturing them. In an embodiment, a phased array antenna apparatus includes at least one printed wiring board (PWB) (1002, FIG. 10) having multiple layers, at least one beamformer module (1014) with at least one beam combiner/divider, at least one amplifier (1016), and at least one integral radiating element (1006). The PWB includes RF manifolds (912, 916, FIG. 9) embedded within the multiple layers between corresponding ports (910, 914) of the beam combiners/dividers. The at least one integral radiating element is located proximate to an edge of the PWB and oriented in parallel with a bore-sight of the phased array antenna apparatus. In an embodiment, the beam combiners/dividers may include an H form combiner (704, FIG. 7). An opening (1026, FIG. 10) in the PWB is adapted to enable the amplifier to directly contact a heat sink (1004), in an embodiment.
    • 实施例包括相控阵天线装置及其制造方法。 在一个实施例中,相控阵天线装置包括至少一个具有多层的印刷布线板(PWB)(1002,图10),至少一个具有至少一个光束组合器/分隔器的波束形成器模块(1014),至少一个 放大器(1016)和至少一个积分辐射元件(1006)。 PWB包括嵌入波束组合器/分配器的相应端口(910,914)之间的多个层中的RF歧管(912,916,图9)。 至少一个整体辐射元件位于PWB的边缘附近并且与相控阵天线装置的孔眼平行定向。 在一个实施例中,光束组合器/分配器可以包括H形组合器(图7中的704)。 在一个实施例中,PWB中的开口(1026,图10)适于使放大器能够直接接触散热器(1004)。
    • 2. 发明申请
    • PHASED ARRAY ANTENNA APPARATUS AND METHODS OF MANUFACTURE
    • 相位阵列天线装置及其制造方法
    • US20080150832A1
    • 2008-06-26
    • US11615740
    • 2006-12-22
    • Daisy L. IngramPatrick Bailleul
    • Daisy L. IngramPatrick Bailleul
    • H01Q21/00H01P11/00H01Q9/04
    • H01Q21/0087H01Q3/26H01Q21/061H01Q25/00Y10T29/49016
    • Embodiments include phased array antenna apparatus and methods of manufacturing them. In an embodiment, a phased array antenna apparatus includes at least one printed wiring board (PWB) (1002, FIG. 10) having multiple layers, at least one beamformer module (1014) with at least one beam combiner/divider, at least one amplifier (1016), and at least one integral radiating element (1006). The PWB includes RF manifolds (912, 916, FIG. 9) embedded within the multiple layers between corresponding ports (910, 914) of the beam combiners/dividers. The at least one integral radiating element is located proximate to an edge of the PWB and oriented in parallel with a bore-sight of the phased array antenna apparatus. In an embodiment, the beam combiners/dividers may include an H form combiner (704, FIG. 7). An opening (1026, FIG. 10) in the PWB is adapted to enable the amplifier to directly contact a heat sink (1004), in an embodiment.
    • 实施例包括相控阵天线装置及其制造方法。 在一个实施例中,相控阵天线装置包括至少一个具有多层的印刷布线板(PWB)(1002,图10),至少一个具有至少一个光束组合器/分隔器的波束形成器模块(1014),至少一个 放大器(1016)和至少一个积分辐射元件(1006)。 PWB包括嵌入波束组合器/分配器的相应端口(910,914)之间的多个层中的RF歧管(912,916,图9)。 至少一个整体辐射元件位于PWB的边缘附近并且与相控阵天线装置的孔眼平行定向。 在一个实施例中,光束组合器/分配器可以包括H形组合器(图7中的704)。 在一个实施例中,PWB中的开口(1026,图10)适于使放大器能够直接接触散热器(1004)。