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1. 发明授权

US09366441B2 Burner, combustor and remodeling method for burner 有权
公开(公告)号：US09366441B2
公开(公告)日：2016-06-14
申请号：US12706011
申请日：2010-02-16
申请人： Daisuke Hayashi , Shohei Yoshida
发明人： Daisuke Hayashi , Shohei Yoshida
IPC分类号： F23D5/00 , F23R3/34 , F23D14/64 , F23R3/10 , F23R3/28
CPC分类号： F23R3/343 , F23D14/64 , F23D2900/00008 , F23R3/10 , F23R3/286 , F23R2900/00002
摘要： A combustor with a burner maintains combustion stability. The burner includes an air hole member 31 with a plurality of air holes 34, 35 provided at an upstream side of the combustion gases generated by a combustion chamber 1. A first fueling nozzle 33 jets fuel in a direction crossing a central axis of the burner towards at least two of air holes 35. A plurality of second fueling nozzles 32, one for each of the remaining air holes 34, are provided to jet the fuel in a direction routed along the burner axis towards the corresponding air hole 34. A fuel header 30 distributes the fuel to the first fueling nozzle 33 and each of the second fueling nozzles 32. A fuel header storage unit 70 shrouds the fuel header 30, fueling nozzles 32, 33, and has an air inflow hole 71.

2. 发明授权

US09245776B2 Plasma processing apparatus 有权
标题翻译：等离子体处理装置
公开(公告)号：US09245776B2
公开(公告)日：2016-01-26
申请号：US12979875
申请日：2010-12-28
申请人： Shinji Himori , Daisuke Hayashi , Akitaka Shimizu
发明人： Shinji Himori , Daisuke Hayashi , Akitaka Shimizu
IPC分类号： H01J37/32 , H01L21/67
CPC分类号： H01L21/67069 , H01J37/32091 , H01J37/32541 , H01J37/3255 , H01J37/32577 , H01J37/32605
摘要： A plasma processing apparatus includes a processing chamber in which a target substrate is processed; an application electrode and a facing electrode provided to face each other in the processing chamber, a plasma generation space being formed between the application electrode and the facing electrode; and an RF power supply connected to the application electrode, an RF power being supplied from the RF power supply to the application electrode. At least one of the application electrode and the facing electrode includes a base formed of a metal, and a dielectric body inserted into the base, one or more metal plate electrodes being buried in the dielectric body.
摘要翻译：等离子体处理装置包括：处理室，其中处理目标基板; 在处理室中设置成面对的施加电极和对置电极，在施加电极和对置电极之间形成等离子体产生空间; 以及连接到施加电极的RF电源，RF电力从RF电源提供给施加电极。施加电极和对置电极中的至少一个包括由金属形成的基底和插入到基底中的电介质体，一个或多个金属板电极被埋在电介质体内。

3. 发明授权

US09206818B2 Axial flow compressor 有权
标题翻译：轴流压缩机
公开(公告)号：US09206818B2
公开(公告)日：2015-12-08
申请号：US13635518
申请日：2011-03-15
申请人： Yoshihiro Nakayama , Yoshitaka Baba , Satoshi Ide , Koichiro Iizuka , Ryo Fujisawa , Masatake Toshima , Kunihiko Suto , Kazutaka Kurashige , Hiroshi Egawa , Ichirou Sakuraba , Daisuke Hayashi , Keiji Sugano , Svend Rasmussen , Ziad Al-Janabi , Finn Jensen , Lars Bay Moller , Hans Madsboll , Christian Svarregaard-Jensen , Klaus Damgaard Kristensen
发明人： Yoshihiro Nakayama , Yoshitaka Baba , Satoshi Ide , Koichiro Iizuka , Ryo Fujisawa , Masatake Toshima , Kunihiko Suto , Kazutaka Kurashige , Hiroshi Egawa , Ichirou Sakuraba , Daisuke Hayashi , Keiji Sugano , Svend Rasmussen , Ziad Al-Janabi , Finn Jensen , Lars Bay Moller , Hans Madsboll , Christian Svarregaard-Jensen , Klaus Damgaard Kristensen
IPC分类号： F04D29/54 , F04D19/02 , F04D29/66 , F04D25/06 , F04D29/053 , F04D29/56
CPC分类号： F04D29/541 , F04D19/02 , F04D25/0606 , F04D29/053 , F04D29/563 , F04D29/668
摘要： An axial flow compressor includes: an electric motor including a rotating shaft; a compression portion including a driving shaft connected without a speed-up gear to the rotating shaft of the electric motor and a rotor rotating together with the driving shaft, the compression portion driving the driving shaft and thereby compressing a working fluid; and a velocity reducing portion having a space for reducing the flow velocity of a working fluid discharged from a discharge opening of the compression portion. The rotating shaft of the electric motor is connected to the end of the driving shaft on the side of the discharge opening; and the velocity reducing portion is disposed so as to surround the electric motor.
摘要翻译：轴流式压缩机包括：电动机，其包括旋转轴; 压缩部，其包括没有加速齿轮连接到所述电动机的旋转轴的驱动轴和与所述驱动轴一起旋转的转子，所述压缩部驱动所述驱动轴，从而压缩工作流体; 以及减速部，其具有用于降低从压缩部的排出口排出的工作流体的流速的空间。电动机的旋转轴与排出口侧的驱动轴的端部连接，并且减速部设置成围绕电动机。

4. 发明授权

US08941037B2 Substrate processing apparatus, focus ring heating method, and substrate processing method 有权
标题翻译：基板加工装置，聚焦环加热方法和基板处理方法
公开(公告)号：US08941037B2
公开(公告)日：2015-01-27
申请号：US11950773
申请日：2007-12-05
申请人： Daisuke Hayashi , Kazuya Nagaseki
发明人： Daisuke Hayashi , Kazuya Nagaseki
IPC分类号： H05B6/10 , H05B6/36 , H01L21/687 , H01J37/32 , H01L21/67 , H01L21/683
CPC分类号： H01L21/68735 , H01J37/32522 , H01J37/32642 , H01J37/32706 , H01L21/67103 , H01L21/67109 , H01L21/6831 , H05B6/105
摘要： A substrate processing apparatus that can accurately control the temperature of a focus ring without causing abnormal electric discharge and the back-flow of radio frequency electrical power during the application of radio frequency electrical power. A wafer is mounted on a mounting stage disposed in a housing chamber. An annular focus ring is mounted on the mounting stage in such a manner as to surround the peripheral portion of the mounted wafer. The pressure in the housing chamber is reduced, radio frequency electrical power is applied to the mounting stage, and the focus ring generates heat by itself.
摘要翻译：一种基板处理装置，其可以在施加射频电力的同时，不会引起异常放电和射频电力的反向流动而精确地控制聚焦环的温度。晶片安装在设置在容纳室中的安装台上。环形聚焦环以围绕安装晶片的周边部分的方式安装在安装台上。容纳室中的压力减小，射频电力施加到安装台，并且聚焦环自身产生热量。

5. 发明授权

US08920598B2 Electrode and plasma processing apparatus 有权
标题翻译：电极和等离子体处理装置
公开(公告)号：US08920598B2
公开(公告)日：2014-12-30
申请号：US13046900
申请日：2011-03-14
申请人： Daisuke Hayashi , Shoichiro Matsuyama , Koichi Murakami
发明人： Daisuke Hayashi , Shoichiro Matsuyama , Koichi Murakami
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306 , H01J37/32
CPC分类号： H01J37/3266 , H01J37/32091 , H01J37/32541
摘要： There is provided a plasma processing apparatus including a processing chamber 100 configured to perform a plasma process on a wafer W; an upper electrode 105 and a lower electrode 110 arranged to face each other in the processing chamber 100 and configured to form a processing space therebetween; and a high frequency power supply 150 connected with at least one of the upper electrode 105 and the lower electrode 110 and configured to output a high frequency power into the processing chamber 100. The upper electrode 105 includes an upper base 105a made of a dielectric material, and a plurality of fine holes A having a diameter equal to or less than twice a thickness of a sheath are formed in the upper base 105a.
摘要翻译：提供了一种等离子体处理装置，其包括：处理室100，被配置为对晶片W执行等离子体处理; 上部电极105和下部电极110，其配置成在处理室100中彼此面对，并且构成为在其间形成处理空间; 以及与上部电极105和下部电极110中的至少一个连接并构成为向处理室100输出高频电力的高频电源150.上部电极105包括由介电材料制成的上部基座105a 并且在上部基座105a中形成具有等于或小于鞘的厚度的两倍的多个细孔A.

6. 发明授权

US08877005B2 Plasma processing apparatus and electrode used therein 有权
标题翻译：其中使用的等离子体处理装置和电极
公开(公告)号：US08877005B2
公开(公告)日：2014-11-04
申请号：US12979837
申请日：2010-12-28
申请人： Daisuke Hayashi
发明人： Daisuke Hayashi
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00 , H01J37/32 , H01L21/67
CPC分类号： H01L21/67069 , H01J37/32091 , H01J37/3255
摘要： A plasma processing apparatus includes a depressurizable processing chamber; an electrode provided in the processing chamber; and a high frequency power supply for supplying a high frequency power into the processing chamber to thereby generating a plasma. Further, the electrode includes a base formed of a dielectric material; a dielectric body buried in the base and formed of the same dielectric material as the base; and a conductive adhesive layer provided in a bonding portion between the base and the dielectric body, the conductive adhesive layer bonding together and fixing the base and the dielectric body to each other.
摘要翻译：等离子体处理装置包括可减压处理室; 设置在处理室中的电极; 以及用于向处理室提供高频电力从而产生等离子体的高频电源。此外，电极包括由介电材料形成的基座; 埋在基底内并由与基底相同的电介质材料形成的绝缘体; 以及导电性粘合剂层，其设置在基体和电介质体的接合部中，导电性粘合剂层粘合在一起并将基体和电介质体彼此固定。

7. 发明授权

US08852390B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US08852390B2
公开(公告)日：2014-10-07
申请号：US12748702
申请日：2010-03-29
申请人： Daisuke Hayashi
发明人： Daisuke Hayashi
IPC分类号： C23F1/00 , C23C16/00 , H01L21/306 , H01J37/32
CPC分类号： H01J37/32568 , H01J37/32018 , H01J37/32458 , H01J37/32577 , H01J37/32908 , H01J2237/024 , H01J2237/1502 , H01J2237/327 , H01J2237/334 , H01L21/67069
摘要： A substrate processing apparatus includes: a cylindrical shaped chamber configured to accommodate a substrate; a movable electrode capable of moving along a central axis of the cylindrical shaped chamber within the cylindrical shaped chamber; a facing electrode facing the movable electrode within the cylindrical shaped chamber; and an expansible/contractible partition wall connecting the movable electrode with an end wall on one side of the cylindrical shaped chamber. In the substrate processing apparatus, a high frequency power is applied to a first space between the movable electrode and the facing electrode, a processing gas is introduced thereto, and the movable electrode is not in contact with a sidewall of the cylindrical shaped chamber. At least one low dielectric member is provided in a second space between the movable electrode and the end wall on one side of the cylindrical shaped chamber.
摘要翻译：一种基板处理装置，包括：圆筒形室，其构造成容纳基板; 可移动电极，其能够沿着圆柱形腔室的中心轴线移动; 在圆柱形腔室内面向可动电极的面对电极; 以及将可动电极与圆筒形室的一侧上的端壁连接的可膨胀/收缩的分隔壁。在基板处理装置中，向可动电极和对置电极之间的第一空间施加高频电力，向其中引入处理气体，并且可动电极不与圆筒形室的侧壁接触。至少一个低电介质构件设置在可动电极和位于圆柱形腔的一侧的端壁之间的第二空间中。

8. 发明授权

US08660400B2 Imaging apparatus and method of starting the same 有权
标题翻译：成像装置及其启动方法
公开(公告)号：US08660400B2
公开(公告)日：2014-02-25
申请号：US12485442
申请日：2009-06-16
申请人： Masafumi Nosaka , Hisataka Ueda , Daisuke Hayashi , Kazumasa Kashiwagi
发明人： Masafumi Nosaka , Hisataka Ueda , Daisuke Hayashi , Kazumasa Kashiwagi
IPC分类号： H04N5/77
CPC分类号： G11B27/322 , H04N5/23241 , H04N5/772 , H04N5/781 , H04N5/907 , H04N9/8042 , H04N9/8205 , H04N9/8227 , H04N2101/00
摘要： When a power source 22 is turned on, recording management information is obtained from a recording medium 70 and the obtained recording management information is analyzed. Whether or not recording of new image data on the recording medium 70 is possible is determined, based on the analysis result. If it is determined that recording the new image data on the recording medium 70 is possible, reception of recording start input that allows the image generation unit and the media management section respectively to generate and record the new image data generation of the new image data by an image generation unit 104 and recording of the new image data on the recording medium 70 is permitted.
摘要翻译：当电源22接通时，从记录介质70获得记录管理信息，并且分析所获得的记录管理信息。基于分析结果确定是否可以在记录介质70上记录新的图像数据。如果确定在记录介质70上记录新的图像数据是可能的，则接收允许图像生成单元和媒体管理部分的记录开始输入分别生成并记录新的图像数据的新图像数据生成允许图像生成单元104和将新图像数据记录在记录介质70上。

9. 发明申请

US20140041410A1 CONDENSING APPARATUS 有权
标题翻译：冷凝装置
公开(公告)号：US20140041410A1
公开(公告)日：2014-02-13
申请号：US14112889
申请日：2012-04-13
申请人： Ryo Fujisawa , Masatake Toshima , Yoshihiro Nakayama , Yoshitaka Baba , Satoshi Ide , Koichiro Ilzuka , Kunihiko Suto , Hiroshi Egawa , Ichirou Sakuraba , Daisuke Hayashi , Keiji Sugano , Hans Madsboll , Klaus Damgaard Kristensen
发明人： Ryo Fujisawa , Masatake Toshima , Yoshihiro Nakayama , Yoshitaka Baba , Satoshi Ide , Koichiro Ilzuka , Kunihiko Suto , Hiroshi Egawa , Ichirou Sakuraba , Daisuke Hayashi , Keiji Sugano , Hans Madsboll , Klaus Damgaard Kristensen
IPC分类号： F25B39/04
CPC分类号： F25B39/04 , F25B9/002 , F25B40/04 , F28B1/02 , F28B3/04 , F28B5/00 , F28B9/02 , F28B9/04
摘要： The condensing apparatus 71 includes: a compressor 10 which has a compression part 20 compressing a working fluid; a condenser 13 which condenses the working fluid compressed by the compression part 20; and a spray mechanism 81 including a nozzle 82 which sprays a cooling fluid into a fluid passage 91 to cool the working fluid flowing through the fluid passage 91 between a discharge opening CS2 of the compression part 20 and an inlet 13a of the condenser 13.
摘要翻译：冷凝装置71包括：压缩机10，其具有压缩工作流体的压缩部20; 将压缩部20压缩的工作流体冷凝的冷凝器13; 以及喷射机构81，其包括喷嘴82，喷嘴82将冷却流体喷射到流体通道91中，以冷却流过压缩部分20的排放口CS2和冷凝器13的入口13a之间的流体通道91的工作流体。

10. 发明授权

US08568554B2 Movable gas introduction structure and substrate processing apparatus having same 有权
标题翻译：可移动气体导入结构和具有该活性气体导入结构的基板处理装置
公开(公告)号：US08568554B2
公开(公告)日：2013-10-29
申请号：US12610747
申请日：2009-11-02
申请人： Daisuke Hayashi
发明人： Daisuke Hayashi
IPC分类号： C23C16/455 , C23C16/50 , C23C16/505 , C23C16/509 , C23F1/00 , H01L21/306 , C23C16/06 , C23C16/22
CPC分类号： H01J37/3244
摘要： In a gas introduction structure that is reciprocatingly movable in a predetermined direction, a processing gas introduction system is configured to introduce a processing gas into a processing chamber in which a substrate is subjected to a predetermined processing under a clean atmosphere; and a processing gas supply line is configured to be connected to the processing gas introduction system and an external processing gas supply source to supply the processing gas from the processing gas supply source to the processing gas introduction system, mutual relative positions of the processing gas supply source and the processing gas introduction system being changed. The processing gas supply line includes: a first bendable portion connected to the processing gas supply source; a second bendable portion connected to the processing gas introduction system; and a non-bendable pipe interposed between the first bendable portion and the second bendable portion.
摘要翻译：在能够沿预定方向往复运动的气体导入结构中，处理气体导入系统将处理气体导入到处理室中，在处理室中，在干净的气氛下进行规定的处理; 并且处理气体供给管线被配置为连接到处理气体引入系统和外部处理气体供应源，以将来自处理气体供应源的处理气体供应到处理气体引入系统，处理气体供应的相对位置来源和加工气体导入系统正在改变。处理气体供应管线包括：连接到处理气体供应源的第一可弯曲部分; 连接到处理气体引入系统的第二可弯曲部分; 以及插入在所述第一可弯曲部和所述第二可弯曲部之间的不可弯曲的管。

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