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1. 发明申请

US20090261388A1 DICE BY GRIND FOR BACK SURFACE METALLIZED DIES 有权
标题翻译：用于后表面金属切割的颗粒
公开(公告)号：US20090261388A1
公开(公告)日：2009-10-22
申请号：US12103878
申请日：2008-04-16
申请人： Craig Hendricks , Eric Woolsey , Jim Murphy
发明人： Craig Hendricks , Eric Woolsey , Jim Murphy
IPC分类号： H01L21/302 , H01L29/78
CPC分类号： H01L21/78
摘要： Semiconductor device processing and methods for dicing a semiconductor wafer into a plurality of individual dies that can have back surface metallization are described. The methods comprise providing a wafer with pre-diced streets in the wafer's front surface, applying a sidewall masking mechanism to the front surface of the wafer so as to substantially fill the pre-diced streets, thinning the back surface of the wafer so as to dice the wafer (e.g., by grinding, etching, or both) and expose a portion of the sidewall masking mechanism from the back surface of the wafer, and applying a material, such as metal, to the back surface of the diced wafer. These methods can prevent the metal from being deposited on die sidewalls and may allow the separation of individual dies without causing the metal to peel from the back surface of one or more adjacent dies. Other embodiments are also described.
摘要翻译：描述了半导体器件处理和用于将半导体晶片切割成可具有背面金属化的多个单独的裸片的方法。这些方法包括在晶片的前表面提供具有预切割街道的晶片，将侧壁屏蔽机构施加到晶片的前表面，以便基本上填充预切割的街道，使晶片的背表面变薄，从而将晶片（例如，通过研磨，蚀刻或两者）切割并将侧壁掩蔽机构的一部分从晶片的背面暴露出来，并将诸如金属的材料施加到切割晶片的背面。这些方法可以防止金属沉积在模具侧壁上，并且可以允许单个模具的分离，而不会使金属从一个或多个相邻模具的背面剥离。还描述了其它实施例。

2. 发明申请

US20070089230A1 WASTE-WATER HEAT RECOVERY SYSTEM 失效
标题翻译：废水回收系统
公开(公告)号：US20070089230A1
公开(公告)日：2007-04-26
申请号：US11539954
申请日：2006-10-10
申请人： CRAIG HENDRICKS
发明人： CRAIG HENDRICKS
IPC分类号： A61H33/02 , A47K3/28 , A47K3/022
CPC分类号： A61H33/6068 , A61H2033/0045 , A61H2201/0126 , F28D21/0012
摘要： The present invention relates to a household heat recovery device and more specifically to a wastewater heat recovery unit, which absorbs residual heat from the water flowing onto the floor and down the drain of an ordinary household shower or bathtub unit. In one embodiment, the heat recovery device adapts for ease-of-use and enables quick set-up in most existing and typical showers or bathtubs without any tools and without coupling to the existing plumbing. Internal passages direct the effluent shower water through a serpentine path to a discharge drain. Over time, the heat transferred from the water to the device then radiates into the environment—thus reducing the total energy cost for a household by reducing the thermal load on the main heating unit for the household.
摘要翻译：家用热回收装置技术领域本发明涉及一种家用热回收装置，更具体地说，涉及一种废水热回收装置，该装置吸收从普通家用淋浴器或浴缸装置的地板和排水口流出的水中的残余热量。在一个实施例中，热回收装置适用于易于使用，并且能够在大多数现有和典型的淋浴器或浴缸中快速设置，而无需任何工具并且不与现有的管道连接。内部通道将流出的淋浴水通过蛇形路径引导到排放管。随着时间的推移，从水传递到设备的热量然后辐射到环境中，从而通过减少家用主加热单元的热负荷来降低家庭的总能量成本。

3. 发明授权

US07849530B2 Waste-water heat recovery system 失效
标题翻译：废水热回收系统
公开(公告)号：US07849530B2
公开(公告)日：2010-12-14
申请号：US11539954
申请日：2006-10-10
申请人： Craig Hendricks
发明人： Craig Hendricks
IPC分类号： A47K3/022
CPC分类号： A61H33/6068 , A61H2033/0045 , A61H2201/0126 , F28D21/0012
摘要： The present invention relates to a household heat recovery device and more specifically to a wastewater heat recovery unit, which absorbs residual heat from the water flowing onto the floor and down the drain of an ordinary household shower or bathtub unit. In one embodiment, the heat recovery device adapts for ease-of-use and enables quick set-up in most existing and typical showers or bathtubs without any tools and without coupling to the existing plumbing. Internal passages direct the effluent shower water through a serpentine path to a discharge drain. Over time, the heat transferred from the water to the device then radiates into the environment—thus reducing the total energy cost for a household by reducing the thermal load on the main heating unit for the household.
摘要翻译：家用热回收装置技术领域本发明涉及一种家用热回收装置，更具体地说，涉及一种废水热回收装置，该装置吸收从普通家用淋浴器或浴缸装置的地板和排水口流出的水中的残余热量。在一个实施例中，热回收装置适用于易于使用，并且能够在大多数现有和典型的淋浴器或浴缸中快速设置，而无需任何工具并且不与现有的管道连接。内部通道将流出的淋浴水通过蛇形路径引导到排放管。随着时间的推移，从水传递到设备的热量然后辐射到环境中，从而通过减少家用主加热单元的热负荷来降低家庭的总能量成本。

4. 发明授权

US07655539B2 Dice by grind for back surface metallized dies 有权
标题翻译：用于后表面金属化模具研磨的骰子
公开(公告)号：US07655539B2
公开(公告)日：2010-02-02
申请号：US12103878
申请日：2008-04-16
申请人： Craig Hendricks , Eric Woolsey , Jim Murphy
发明人： Craig Hendricks , Eric Woolsey , Jim Murphy
IPC分类号： H01L21/78
CPC分类号： H01L21/78
摘要： Semiconductor device processing and methods for dicing a semiconductor wafer into a plurality of individual dies that can have back surface metallization are described. The methods comprise providing a wafer with pre-diced streets in the wafer's front surface, applying a sidewall masking mechanism to the front surface of the wafer so as to substantially fill the pre-diced streets, thinning the back surface of the wafer so as to dice the wafer (e.g., by grinding, etching, or both) and expose a portion of the sidewall masking mechanism from the back surface of the wafer, and applying a material, such as metal, to the back surface of the diced wafer. These methods can prevent the metal from being deposited on die sidewalls and may allow the separation of individual dies without causing the metal to peel from the back surface of one or more adjacent dies. Other embodiments are also described.
摘要翻译：描述了半导体器件处理和用于将半导体晶片切割成具有背面金属化的多个单独的裸片的方法。这些方法包括在晶片的前表面提供具有预切割街道的晶片，将侧壁屏蔽机构施加到晶片的前表面，以便基本上填充预切割的街道，使晶片的背表面变薄，以便将晶片（例如，通过研磨，蚀刻或两者）切割并将侧壁掩蔽机构的一部分从晶片的背面暴露出来，并将诸如金属的材料施加到切割晶片的背面。这些方法可以防止金属沉积在模具侧壁上，并且可以允许单个模具的分离，而不会使金属从一个或多个相邻模具的背面剥离。还描述了其它实施例。

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