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1. 发明授权

US07519120B2 Clock EMI reduction 有权
标题翻译：时钟EMI降低
公开(公告)号：US07519120B2
公开(公告)日：2009-04-14
申请号：US11253646
申请日：2005-10-20
申请人： Sheng Wu , Noah Gottfried , James Burnell , Corey M. Dayton
发明人： Sheng Wu , Noah Gottfried , James Burnell , Corey M. Dayton
IPC分类号： H04L27/00 , H05K9/00
CPC分类号： H05K9/0066
摘要： EMI emissions generated by clock signals in a multi-slot electronic system are reduced by providing out-of-phase clock signals to alternate slots, which cause EMI emissions at typical testing distances and farther to be reduced. An electronic equipment comprises a plurality of slots, each slot operable to receive a clock signal and a plurality of phases of the clock signal, wherein a first phase of the clock signal is routed to a portion of the slots and a second phase of the clock signal is routed to a different portion of the slots. The second phase of the clock signal may be substantially 180° out-of-phase with the first phase of the clock signal.
摘要翻译：通过向交替的时隙提供异相时钟信号来减少多时隙电子系统中的时钟信号产生的EMI辐射，从而在典型的测试距离上导致EMI发射，并进一步减少。电子设备包括多个时隙，每个时隙可操作以接收时钟信号和时钟信号的多个相位，其中时钟信号的第一相位被路由到时隙的一部分和时钟的第二相位信号被路由到时隙的不同部分。时钟信号的第二相可以与时钟信号的第一相位基本上为180°异相。

2. 发明授权

US07111674B2 Heat dissipating housing with interlocking chamfers and ESD resistance 有权
标题翻译：具有互锁倒角和ESD电阻的散热外壳
公开(公告)号：US07111674B2
公开(公告)日：2006-09-26
申请号：US10634909
申请日：2003-08-06
申请人： Albert Pedoeem , Willie Ernst Braun , Lang Yuan , Corey M. Dayton , Steven M. Cherry
发明人： Albert Pedoeem , Willie Ernst Braun , Lang Yuan , Corey M. Dayton , Steven M. Cherry
IPC分类号： F28F7/00
CPC分类号： H05K7/20127 , H05K7/1461 , H05K7/20445
摘要： A system is designed to facilitate heat transfer via radiation, convection and conduction from components within the system to the external environment and housing. The system includes a thermally conductive plate positioned between a surface of the housing and one or more heat generating components within the housing. A compliant thermally conductive material may then be placed between the heat generating components and the plate to facilitate conductive heat transfer from the component to the plate. From the plate, heat is transferred to the external environment through radiation and convection of air through perforations in the housing which cover a substantial portion of the surface area of the housing. The housing may also be inexpensively manufactured through stamping and may include two mating pieces which interlock using chamfered electrostatic discharge fingers. The housing may also incorporate a metal shroud for enveloping certain ESD sensitive connectors, such as optical couplers.
摘要翻译：系统设计用于通过辐射，对流和传导从系统内的组件传递到外部环境和外壳。该系统包括位于壳体的表面和壳体内的一个或多个发热部件之间的导热板。随后可以将兼容的导热材料放置在发热部件和板之间，以促进从部件到板的导电热传递。从板中，通过外壳中的穿孔的空气的辐射和对流将热传递到外部环境，其覆盖壳体的表面区域的大部分。壳体也可以通过冲压廉价地制造，并且可以包括使用倒角的静电放电指状物互锁的两个配合件。壳体还可以包括用于包封某些ESD敏感连接器（例如光耦合器）的金属护罩。

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