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1. 发明授权

US07223026B1 Solder-free packaging for integrated fiber optics device 有权
标题翻译：集成光纤设备的无焊包装
公开(公告)号：US07223026B1
公开(公告)日：2007-05-29
申请号：US11127951
申请日：2005-05-12
申请人： Chun He , Steven Zhu , Chuying Chen
发明人： Chun He , Steven Zhu , Chuying Chen
IPC分类号： G02B6/36
CPC分类号： G02B6/421 , G02B6/4206 , G02B6/423 , G02B6/4239
摘要： Techniques for packaging in an optical device and an opto-electrical conversion device are disclosed. According to one aspect of the techniques, the optical device is packaged in a piece of tubing and the opto-electrical conversion device is packaged in a TO-can. While the optical device and the opto-electrical conversion device are coaxially aligned, the tube and the TO-can are integrated by a certain amount of epoxy that is later cured by a UV light or heat. As a result, an integrated optical device is formed and enjoys features of small footprint, better alignment, enhanced impact performance, lower cost in addition to easier manufacturing process and environmental-safe.
摘要翻译：公开了用于光学装置和光电转换装置中的封装技术。根据该技术的一个方面，光学装置被封装在管件中，光电转换装置封装在TO-罐中。当光学器件和光电转换器件同轴对准时，管和TO-can可以通过一定量的环氧树脂进行整合，后者通过紫外光或热固化。结果，形成了集成的光学器件，并且具有占地面积小，更好的对准，增强的冲击性能，更低的成本以及更容易的制造工艺和环境安全的特征。

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