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1. 发明授权

US06876191B2 Apparatus for treating wafers, provided with a sensor box 有权
标题翻译：设置有传感器盒的处理晶片的装置
公开(公告)号：US06876191B2
公开(公告)日：2005-04-05
申请号：US10373645
申请日：2003-02-24
申请人： Christianus Gerardus M. de Ridder , Gert-Jan Snijders , Albert Hasper , Jan Zinger
发明人： Christianus Gerardus M. de Ridder , Gert-Jan Snijders , Albert Hasper , Jan Zinger
IPC分类号： B65G49/07 , H01L21/02 , H01L21/677 , G01R31/02 , G01R31/26
CPC分类号： H01L21/67769
摘要： An apparatus for treating wafers, provided with at least one treatment chamber, the apparatus being provided with a feeding section in which wafers contained in a wafer storage box can be fed into the apparatus, the apparatus being provided with a wafer handling apparatus, by means of which wafers can be taken out of the wafer storage boxes so as to be treated in the treatment chamber, and the apparatus being provided with at least one sensor box arranged such that the wafer handling apparatus can feed a wafer into the sensor box through an opening provided for that purpose in the at least one sensor box, and the at least one sensor box being arranged to carry out measurements at a wafer, wherein the at least one sensor box is movably arranged and the apparatus is provided with a sensor box handling apparatus arranged to move the at least one sensor box from a storage position to a measuring position.
摘要翻译：一种用于处理晶片的设备，设有至少一个处理室，该设备设置有馈送部分，其中容纳在晶片存储箱中的晶片可以被馈送到设备中，该设备通过装置设置有晶片处理装置其中可以将晶片从晶片储存盒中取出以便在处理室中进行处理，并且该设备设置有至少一个传感器盒，其布置成使得晶片处理装置可以通过一个晶片处理装置将晶片馈送到传感器盒中所述至少一个传感器盒被布置成在晶片处执行测量，其中所述至少一个传感器盒可移动地布置，并且所述设备设置有传感器盒处理设置成将所述至少一个传感器盒从存储位置移动到测量位置的装置。

2. 发明授权

US06551404B2 Apparatus for treating a wafer 有权
标题翻译：用于处理晶片的装置
公开(公告)号：US06551404B2
公开(公告)日：2003-04-22
申请号：US09747275
申请日：2000-12-22
申请人： Gert-Jan Snijders , Vladimir Ivanovich Kuznetsov , Christianus Gerardus M. de Ridder , Herbert Terhorst
发明人： Gert-Jan Snijders , Vladimir Ivanovich Kuznetsov , Christianus Gerardus M. de Ridder , Herbert Terhorst
IPC分类号： H01L2120
CPC分类号： H01L21/67017 , H01L21/67109 , H01L21/6838
摘要： An apparatus for treating a wafer manufactured from semiconducting material, the apparatus comprising a first and a second housing part arranged for movement away front and towards each other, the two housing parts bounding a treatment chamber, while around the treatment chamber there is provided a first groove connected to gas discharge means, while in at least one of the two boundary surfaces there is provided a second groove connected to gas feed means, the first groove being located radially within the second groove, and, in use, the pressure created by the gas feed means being such that from the second groove, gas flows both in radial inward and in radial outward direction in the gap between the first and the second boundary surface.
摘要翻译：一种用于处理由半导体材料制成的晶片的设备，所述设备包括布置成彼此远离并朝向彼此移动的第一和第二壳体部分，所述两个壳体部分包围处理室，而在处理室周围设置有第一沟槽连接到气体排出装置，而在两个边界表面中的至少一个中设置有连接到气体供给装置的第二凹槽，第一凹槽径向位于第二凹槽内，并且在使用中由气体供给装置使得从第二凹槽，气体在第一和第二边界表面之间的间隙中径向向内和径向向外的方向流动。

3. 发明授权

US06561798B2 Apparatus for processing a wafer 有权
公开(公告)号：US06561798B2
公开(公告)日：2003-05-13
申请号：US09875277
申请日：2001-06-06
申请人： Vladimir Ivanovich Kuznetsov , Bartholomeus Hans L. Lindeboom , Ronald Bast , Christianus Gerardus M. de Ridder
发明人： Vladimir Ivanovich Kuznetsov , Bartholomeus Hans L. Lindeboom , Ronald Bast , Christianus Gerardus M. de Ridder
IPC分类号： H01L2168
CPC分类号： H01L21/67103 , H01L21/681 , Y10S414/136
摘要： An apparatus for thermally processing a wafer at an elevated temperature, in which a processing position is bounded at least on one side by a housing part which, in use, is at an elevated temperature, the apparatus being provided with measuring means for determining the position of a wafer in the processing position before and/or during processing, the measuring means being provided with at least one signal processor and at least one signal conductor, the or each signal processor being located at a distance from the processing position in an area of lower temperature, the signal conductor extending through the housing part being at an elevated temperature and extending from a measuring point in or near the processing position to the signal processor for transmitting to the signal processor contactlessly obtained measuring signals, the at least one signal conductor, at least the part extending through the housing part being at an elevated temperature, being heat resistant.

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