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1. 发明申请

US20080287044A1 Method of transferring a wafer 有权
标题翻译：转印晶片的方法
公开(公告)号：US20080287044A1
公开(公告)日：2008-11-20
申请号：US11748477
申请日：2007-05-14
申请人： Kuo-Wei Yang , Hui-Shen Shih , Chih-Jen Mao , Cho-Long Lin
发明人： Kuo-Wei Yang , Hui-Shen Shih , Chih-Jen Mao , Cho-Long Lin
IPC分类号： B24B7/04
CPC分类号： B24B37/345
摘要： A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.
摘要翻译：公开了一种转印晶片的方法。该方法包括提供一个基座和至少一个延伸穿过基座的喷嘴; 使用第一机器人在基座上方设置晶片，其中晶片具有第一表面和第二表面，第一表面面向基座，流体同时喷射到第一表面上，以避免第一表面与基座接触流体含有溶解于其中的成电化学物质; 并使用机器人取出晶片进行交付。由于溶解在流体中的成电化学物质，在喷射流体时避免了在晶片上引起放电损坏的瀑布效应。

2. 发明授权

US07909677B2 Method of transferring a wafer 有权
公开(公告)号：US07909677B2
公开(公告)日：2011-03-22
申请号：US11748477
申请日：2007-05-14
申请人： Kuo-Wei Yang , Hui-Shen Shih , Chih-Jen Mao , Cho-Long Lin
发明人： Kuo-Wei Yang , Hui-Shen Shih , Chih-Jen Mao , Cho-Long Lin
IPC分类号： B24B1/00
CPC分类号： B24B37/345
摘要： A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

3. 发明授权

US08142258B2 Method of transferring a wafer 有权
标题翻译：转印晶片的方法
公开(公告)号：US08142258B2
公开(公告)日：2012-03-27
申请号：US12964716
申请日：2010-12-09
申请人： Kuo-Wei Yang , Hui-Shen Shih , Chih-Jen Mao , Cho-Long Lin
发明人： Kuo-Wei Yang , Hui-Shen Shih , Chih-Jen Mao , Cho-Long Lin
IPC分类号： B24B1/00
CPC分类号： B24B37/345
摘要： A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.
摘要翻译：公开了一种转印晶片的方法。该方法包括提供一个基座和至少一个延伸穿过基座的喷嘴; 使用第一机器人在基座上方设置晶片，其中晶片具有第一表面和第二表面，第一表面面向基座，流体同时喷射到第一表面上，以避免第一表面与基座接触流体含有溶解于其中的成电化学物质; 并使用机器人取出晶片进行交付。由于溶解在流体中的成电化学物质，在喷射流体时避免了在晶片上引起放电损坏的瀑布效应。

4. 发明申请

US20110076129A1 Method of transferring a wafer 有权
标题翻译：转印晶片的方法
公开(公告)号：US20110076129A1
公开(公告)日：2011-03-31
申请号：US12964716
申请日：2010-12-09
申请人： Kuo-Wei Yang , Hui-Shen Shih , Chih-Jen Mao , Cho-Long Lin
发明人： Kuo-Wei Yang , Hui-Shen Shih , Chih-Jen Mao , Cho-Long Lin
IPC分类号： B65G47/22
CPC分类号： B24B37/345
摘要： A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.
摘要翻译：公开了一种转印晶片的方法。该方法包括提供一个基座和至少一个延伸穿过基座的喷嘴; 使用第一机器人在基座上方设置晶片，其中晶片具有第一表面和第二表面，第一表面面向基座，流体同时喷射到第一表面上，以避免第一表面与基座接触流体含有溶解于其中的成电化学物质; 并使用机器人取出晶片进行交付。由于溶解在流体中的成电化学物质，在喷射流体时避免了在晶片上引起放电损坏的瀑布效应。

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