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1. 发明授权

US08774241B2 Optical module 有权
标题翻译：光模块
公开(公告)号：US08774241B2
公开(公告)日：2014-07-08
申请号：US12864694
申请日：2008-03-18
申请人： Akira Nakamura , Masamitsu Okamura , Keiichi Fukuda , Chise Nanba , Kazutaka Ikeda
发明人： Akira Nakamura , Masamitsu Okamura , Keiichi Fukuda , Chise Nanba , Kazutaka Ikeda
IPC分类号： H01S3/04
CPC分类号： H01S3/025 , H01S3/0092 , H01S3/042 , H01S3/094053 , H01S3/09415 , H01S3/1611 , H01S3/1673
摘要： To constitute an optical module comprising a mount and a board that supports the mount, wherein a solid-state laser device that oscillates fundamental laser light, a pump light source that pumps the solid-state laser device, and a wavelength converting device that converts a wavelength of the fundamental laser light oscillated by the solid-state laser device are mounted on the mount, the mount is divided into three blocks, that is, a first block on which a laser medium is mounted, a second block on which the pump light source is mounted, and a third block on which the wavelength converting device is mounted. A side surface or a bottom surface of only the second block is fixed to the board, the first block is fixed to the other side surface of the second block, and the third block is fixed to a side surface of the first block.
摘要翻译：为了构成一种光学模块，其包括支撑所述支架的支架和板，其中振荡基本激光的固态激光装置，泵浦所述固态激光装置的泵浦光源以及转换器由固体激光装置振荡的基本激光的波长安装在安装座上，将安装件分成三块，即安装有激光介质的第一块，第二块，泵浦光源安装，并且安装波长转换装置的第三块。仅第二块的侧表面或底表面固定到板，第一块固定到第二块的另一侧表面，并且第三块固定到第一块的侧表面。

2. 发明申请

US20100309946A1 OPTICAL MODULE 有权
标题翻译：光学模块
公开(公告)号：US20100309946A1
公开(公告)日：2010-12-09
申请号：US12864694
申请日：2008-03-18
申请人： Akira Nakamura , Masamitsu Okamura , Keiichi Fukuda , Chise Nanba , Kazutaka Ikeda
发明人： Akira Nakamura , Masamitsu Okamura , Keiichi Fukuda , Chise Nanba , Kazutaka Ikeda
IPC分类号： H01S3/042 , H01S3/0941
CPC分类号： H01S3/025 , H01S3/0092 , H01S3/042 , H01S3/094053 , H01S3/09415 , H01S3/1611 , H01S3/1673
摘要： To constitute an optical module comprising a mount and a board that supports the mount, wherein a solid-state laser device that oscillates fundamental laser light, a pump light source that pumps the solid-state laser device, and a wavelength converting device that converts a wavelength of the fundamental laser light oscillated by the solid-state laser device are mounted on the mount, the mount is divided into three blocks, that is, a first block on which a laser medium is mounted, a second block on which the pump light source is mounted, and a third block on which the wavelength converting device is mounted. A side surface or a bottom surface of only the second block is fixed to the board, the first block is fixed to the other side surface of the second block, and the third block is fixed to a side surface of the first block.
摘要翻译：为了构成一种光学模块，其包括支撑所述支架的支架和板，其中振荡基本激光的固态激光装置，泵浦所述固态激光装置的泵浦光源以及转换器由固体激光装置振荡的基本激光的波长安装在安装座上，将安装件分成三块，即安装有激光介质的第一块，第二块，泵浦光源安装，并且安装波长转换装置的第三块。仅第二块的侧表面或底表面固定到板，第一块固定到第二块的另一侧表面，并且第三块固定到第一块的侧表面。

3. 发明授权

US08391326B1 Laser light source module 有权
标题翻译：激光光源模块
公开(公告)号：US08391326B1
公开(公告)日：2013-03-05
申请号：US12865258
申请日：2008-03-18
申请人： Motoaki Tamaya , Kenji Okuda , Chise Nanba , Akira Nakamura , Junichi Aizawa
发明人： Motoaki Tamaya , Kenji Okuda , Chise Nanba , Akira Nakamura , Junichi Aizawa
IPC分类号： H01S3/04
CPC分类号： H01S5/02469 , H01S5/02212 , H01S5/02272 , H01S5/02284 , H01S5/02492 , H01S5/4025
摘要： To obtain a laser light source module, a copper-based material is press-fitted into a through hole formed in a stem made of an iron-based material, thereby forming a first heat sink. A mount made of a copper-based material is fixed to the first heat sink and at least one semiconductor laser device is mounted on the mount. A second heat sink is bonded to lower surfaces of the stem and the first heat sink by a thermal conductive adhesive. An upper surface of the first heat sink is located on a same plane as that of the stem, and a lower surface of the first heat sink is located higher than that of the stem.
摘要翻译：为了获得激光光源模块，将铜基材料压配合到形成在由铁基材料制成的杆中的通孔中，从而形成第一散热器。由铜基材料制成的安装座固定在第一散热器上，并且至少一个半导体激光装置安装在安装座上。第二散热器通过导热粘合剂粘合到杆和第一散热器的下表面。第一散热器的上表面位于与杆的相同的平面上，并且第一散热器的下表面被定位成高于杆的下表面。

4. 发明申请

US20120177076A1 SEMICONDUCTOR LASER MODULE 审中-公开
标题翻译：半导体激光模块
公开(公告)号：US20120177076A1
公开(公告)日：2012-07-12
申请号：US13496147
申请日：2010-01-27
申请人： Motoaki Tamaya , Akira Nakamura , Chise Nanba
发明人： Motoaki Tamaya , Akira Nakamura , Chise Nanba
IPC分类号： H01S5/02
CPC分类号： H01S5/02212 , H01L23/10 , H01L2924/0002 , H01R4/58 , H01R13/03 , H01S5/0222 , H01S5/02236 , H01L2924/00
摘要： A semiconductor laser module includes: a semiconductor laser element which emits light; a package base having a through hole; a lead pin which passes through the through hole and supplies the current to the semiconductor laser element; a glass material which seals the through hole through which the lead pin passes; and a cap which has a window from which light emitted by the semiconductor laser element is taken out and has the semiconductor laser element in the inside thereof, the cap being joined in air sealing relation to the package base. The lead pin is an iron-nickel alloys in which the coefficient of linear expansion is not higher than a predetermined ratio in difference with the glass material, the saturation magneto-striction constant is not higher than a predetermined value, and volume resistivity is not higher than a predetermined rate.
摘要翻译：半导体激光器模块包括：发光的半导体激光元件; 具有通孔的封装基座; 引脚，其穿过所述通孔并将电流提供给所述半导体激光元件; 密封引脚通过的通孔的玻璃材料; 以及盖，其具有从该半导体激光元件发出的光被取出并且在其内部具有半导体激光元件的窗口，该盖与封装基座空气密封地接合。引脚是铁 - 镍合金，其中线膨胀系数不高于与玻璃材料不同的预定比例，饱和磁致伸缩常数不高于预定值，体积电阻率不高比预定速率。

5. 发明申请

US20110026548A1 LASER LIGHT SOURCE MODULE 有权
标题翻译：激光光源模块
公开(公告)号：US20110026548A1
公开(公告)日：2011-02-03
申请号：US12921822
申请日：2008-03-18
申请人： Motoaki Tamaya , Chise Nanba , Akira Nakamura , Keiichi Fukuda , Koji Funaoka , Manabu Kawakami , Masamitsu Okamura
发明人： Motoaki Tamaya , Chise Nanba , Akira Nakamura , Keiichi Fukuda , Koji Funaoka , Manabu Kawakami , Masamitsu Okamura
IPC分类号： H01S3/10 , H01S3/04
CPC分类号： H01S3/025 , G02F1/37 , H01S3/0092 , H01S3/042 , H01S3/09415
摘要： When a laser light source module includes a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, wherein the heat sink is separated into three blocks, namely a first block including a laser oscillating unit for the solid laser element is arranged, a second block including a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block including the wavelength conversion element that converts the wavelength of the fundamental laser beam and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged, enabling thus downsizing of the module and improvement of the positioning accuracy of the elements.
摘要翻译：当激光光源模块包括其中布置有固体激光元件，激发光源和波长转换元件的散热器和支撑散热器的灯杆时，其中散热器被分成三块，即布置包括用于固体激光元件的激光振荡单元的第一块，布置包括发射用于激光振荡单元的激发光的半导体激光元件的第二块和第一温度传感器，并且其特定表面上的第一加热器并且配置有包括转换基波激光束的波长的波长转换元件和第二温度传感器的第三块，并且在其特定表面上布置有第二加热器，从而能够实现模块的小型化和改进元素的定位精度。

6. 发明申请

US20100260226A1 LASER LIGHT SOURCE MODULE 有权
标题翻译：激光光源模块
公开(公告)号：US20100260226A1
公开(公告)日：2010-10-14
申请号：US12740055
申请日：2007-12-21
申请人： Motoaki Tamaya , Keiichi Fukuda , Shinichi Oe , Chise Nanba , Akira Nakamura
发明人： Motoaki Tamaya , Keiichi Fukuda , Shinichi Oe , Chise Nanba , Akira Nakamura
IPC分类号： H01S5/42
CPC分类号： H01S5/02276 , H01L2224/48091 , H01L2224/49175 , H01S5/0224 , H01S5/02272 , H01S5/02492 , H01S5/4031 , H01L2924/00014
摘要： A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.
摘要翻译：散热器由导热性优异的材料制成，并安装在杆上; 副安装基板由绝缘性优异的材料制成，并安装在散热片上; 由导电性和导热性优异的材料制成的具有类似于半导体激光器阵列的线性膨胀系数的第一引线框安装在安装有半导体激光器阵列的子安装基板上，并组成半导体激光器阵列的馈电路径; 由导电性和导热性优异的材料构成的第二引线框架与第一引线框并排配置在副安装基板上，构成半导体激光器阵列的馈电路径; 并且导线将半导体激光器阵列和第二引线框架电连接。

7. 发明授权

US08265111B2 Laser light source module 有权
标题翻译：激光光源模块
公开(公告)号：US08265111B2
公开(公告)日：2012-09-11
申请号：US12921822
申请日：2008-03-18
申请人： Motoaki Tamaya , Chise Nanba , Akira Nakamura , Keiichi Fukuda , Koji Funaoka , Manabu Kawakami , Masamitsu Okamura
发明人： Motoaki Tamaya , Chise Nanba , Akira Nakamura , Keiichi Fukuda , Koji Funaoka , Manabu Kawakami , Masamitsu Okamura
IPC分类号： H01S3/04
CPC分类号： H01S3/025 , G02F1/37 , H01S3/0092 , H01S3/042 , H01S3/09415
摘要： When a laser light source module includes a heat sink in which a solid laser element, an excitation light source, and a wavelength conversion element are arranged and a stem that supports the heat sink, wherein the heat sink is separated into three blocks, namely a first block including a laser oscillating unit for the solid laser element is arranged, a second block including a semiconductor laser element that emits excitation light for the laser oscillating unit and a first temperature sensor are arranged and on a specific surface of which the first heater is arranged, and a third block including the wavelength conversion element that converts the wavelength of the fundamental laser beam and a second temperature sensor are arranged and on a specific surface of which a second heater is arranged, enabling thus downsizing of the module and improvement of the positioning accuracy of the elements.
摘要翻译：当激光光源模块包括其中布置有固体激光元件，激发光源和波长转换元件的散热器和支撑散热器的灯杆时，其中散热器被分成三块，即布置包括用于固体激光元件的激光振荡单元的第一块，布置包括发射用于激光振荡单元的激发光的半导体激光元件的第二块和第一温度传感器，并且其特定表面上的第一加热器并且配置有包括转换基波激光束的波长的波长转换元件和第二温度传感器的第三块，并且在其特定表面上布置有第二加热器，从而能够实现模块的小型化和改进元素的定位精度。

8. 发明申请

US20120263200A1 LASER MODULE 审中-公开
标题翻译：激光模块
公开(公告)号：US20120263200A1
公开(公告)日：2012-10-18
申请号：US13514918
申请日：2010-12-16
申请人： Motoaki Tamaya , Chise Nanba , Takayuki Yanagisawa , Shinichi Oe , Shuhei Yamamoto , Akira Yokoyama
发明人： Motoaki Tamaya , Chise Nanba , Takayuki Yanagisawa , Shinichi Oe , Shuhei Yamamoto , Akira Yokoyama
IPC分类号： H01S3/04
CPC分类号： H01S5/02476 , H01L2224/48091 , H01S5/02272 , H01S5/02276 , H01S5/4031 , H01L2924/00014
摘要： A laser module includes: a heat sink that releases heat from a member in contact with the heat sink; a sub-mount substrate that is disposed on the heat sink and made of an insulating material; a feeding layer that is disposed on the sub-mount substrate; and a laser diode array that has plural light-emitting portions disposed on the feeding layer in a parallel arrangement. A linear expansion coefficient of the sub-mount substrate is made smaller than a linear expansion coefficient of the laser diode array, and the linear expansion coefficient of the sub-mount substrate in a state connected to the heat sink having a larger linear expansion coefficient than the laser diode array is set to fall within a predetermined range including the linear expansion coefficient of the laser diode array.
摘要翻译：激光模块包括：散热器，其从与散热器接触的部件释放热量; 一个设置在散热器上并由绝缘材料制成的子安装基板; 馈送层，其设置在所述副安装基板上; 以及激光二极管阵列，其以平行布置设置在馈电层上的多个发光部分。使得副安装基板的线膨胀系数小于激光二极管阵列的线膨胀系数，并且在与散热器连接的状态下的副安装基板的线膨胀系数比线膨胀系数大将激光二极管阵列置于包括激光二极管阵列的线膨胀系数的预定范围内。

9. 发明授权

US08233512B2 Laser light source module 有权
标题翻译：激光光源模块
公开(公告)号：US08233512B2
公开(公告)日：2012-07-31
申请号：US12740055
申请日：2007-12-21
申请人： Motoaki Tamaya , Keiichi Fukuda , Shinichi Oe , Chise Nanba , Akira Nakamura
发明人： Motoaki Tamaya , Keiichi Fukuda , Shinichi Oe , Chise Nanba , Akira Nakamura
IPC分类号： H01S3/04
CPC分类号： H01S5/02276 , H01L2224/48091 , H01L2224/49175 , H01S5/0224 , H01S5/02272 , H01S5/02492 , H01S5/4031 , H01L2924/00014
摘要： A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.
摘要翻译：散热器由导热性优异的材料制成，并安装在杆上; 副安装基板由绝缘性优异的材料制成，并安装在散热片上; 由导电性和导热性优异的材料制成的具有类似于半导体激光器阵列的线性膨胀系数的第一引线框安装在安装有半导体激光器阵列的子安装基板上，并组成半导体激光器阵列的馈电路径; 由导电性和导热性优异的材料构成的第二引线框架与第一引线框并排配置在副安装基板上，构成半导体激光器阵列的馈电路径; 并且导线将半导体激光器阵列和第二引线框架电连接。

10. 发明申请

US20100078191A1 HERMETIC SEAL AND A METHOD OF MANUFACTURING HERMETIC SEAL 审中-公开
标题翻译： HERMETIC SEAL和一种制造护肤品的方法
公开(公告)号：US20100078191A1
公开(公告)日：2010-04-01
申请号：US12566727
申请日：2009-09-25
申请人： Chise NANBA , Akira NAKAMURA , Toru YOSHIHARA
发明人： Chise NANBA , Akira NAKAMURA , Toru YOSHIHARA
IPC分类号： H05K5/06
CPC分类号： H01R13/521 , H01R13/03 , H01R13/405
摘要： A hermetic seal includes a package base, a glass material provided on the inside of the package base, and a lead pin that is provided to penetrate through the glass material and is composed of a copper-tungsten alloy.
摘要翻译：气密密封包括：包装基座，设置在封装基座内部的玻璃材料，以及设置成穿过玻璃材料并由铜 - 钨合金构成的引脚。

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