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1. 发明申请

US20050269385A1 Soldering method and solder joints formed therein 审中-公开
标题翻译：焊接方法和形成在其中的焊点
公开(公告)号：US20050269385A1
公开(公告)日：2005-12-08
申请号：US10859207
申请日：2004-06-03
申请人： Sinn-Wen Chen , Shih-Kang Lin , Ching-Feng Yang , Yu-Chih Huang , Ting-Ying Chung , Ying-Mei Tsai , An-Ren Zi
发明人： Sinn-Wen Chen , Shih-Kang Lin , Ching-Feng Yang , Yu-Chih Huang , Ting-Ying Chung , Ying-Mei Tsai , An-Ren Zi
IPC分类号： B23K31/02 , B23K35/02 , B23K35/26 , C22C13/02 , H01L21/60 , H05K3/34
CPC分类号： H05K3/3463 , B23K35/0238 , B23K35/26 , B23K35/262 , C22C13/00 , H01L24/81 , H01L2224/13609 , H01L2224/16 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/15747 , Y10T428/12493 , H01L2924/00
摘要： This invention forms an indium or indium alloy layer on top of a Sn based lead-free solder. The indium or indium alloy layer can be formed by various methods, such as plating, deposition, printing, dipping, etc. The indium-containing layer melts during the soldering process, wets the substrate, and forms a sound solder joint. Since the melting point of indium is 156.6° C., even lower than that of the eutectic Sn—Pb which is at 183° C., so the soldering process can be carried out at a temperature lower than the conventional soldering process. During the soldering process, the indium reacts with the Sn based Pb-free solder alloy. Since the eutectic temperature of Sn—In is at 120° C., during the short time of the soldering process, the surface of the In deposited Pb-free solder remains as the liquid phase and have a good wetting with the substrate, while a In gradient is formed in the In deposited Pb-free solder.
摘要翻译：本发明在Sn基无铅焊料的顶部形成铟或铟合金层。可以通过电镀，沉积，印刷，浸渍等各种方法形成铟或铟合金层。在焊接工艺期间，含铟层熔化，润湿基板，形成良好的焊点。由于铟的熔点为156.6℃，甚至低于在183℃的共晶Sn-Pb的熔点，所以焊接工艺可以在比常规焊接工艺低的温度下进行。在焊接过程中，铟与Sn基无铅焊料合金反应。由于Sn-In的共晶温度为120℃，在焊接过程的短时间内，In沉积的无铅焊料的表面保持为液相，并且与衬底具有良好的润湿性，而在In沉积的无铅焊料中形成梯度。

2. 发明授权

US06813166B1 Synchronous rectifyier controlled by a current transformer 失效
标题翻译：同步整流器由电流互感器控制
公开(公告)号：US06813166B1
公开(公告)日：2004-11-02
申请号：US10457313
申请日：2003-06-09
申请人： Shun-Te Chang , Ching-Feng Yang
发明人： Shun-Te Chang , Ching-Feng Yang
IPC分类号： H02M3335
CPC分类号： H02M3/33592 , Y02B70/1475
摘要： A power converter with synchronous rectifying through the control of a current transformer is disclosed. The basic architecture of the power converter includes a flyback transformer (10), a switch controller (20) and a current transformer (30). The secondary winding of the flyback transformer (10) is connected to the primary winding of the current transformer (30) used to control the switch controller (20). The primary winding of the current transformer (30) is connected to a synchronous rectifying switch (Q7). If a current change occurs on the secondary winding of the flyback transformer (10), the current transformer (30) detects the phase change and enables the switch controller (20) to switch off the synchronous rectifying switch (Q7). The current transformer (30) turns off the synchronous rectifying switch (Q7) anticipatorily in the continuous current output mode to prevent any power loss from crossovers.
摘要翻译：公开了一种通过电流互感器的控制进行同步整流的功率转换器。功率转换器的基本架构包括回扫变压器（10），开关控制器（20）和电流互感器（30）。回扫变压器（10）的次级绕组连接到用于控制开关控制器（20）的电流互感器（30）的初级绕组。电流互感器（30）的初级绕组连接到同步整流开关（Q7）。如果在回扫变压器（10）的次级绕组上发生电流变化，则电流互感器（30）检测相变，使开关控制器（20）能够关断同步整流开关（Q7）。电流互感器（30）在连续电流输出模式下预期关闭同步整流开关（Q7），以防止分流器发生功率损耗。

3. 发明申请

US20110110813A1 Tin-indium based lead-free solders with zinc addition 审中-公开
标题翻译：镀锡锡无铅焊料
公开(公告)号：US20110110813A1
公开(公告)日：2011-05-12
申请号：US12655000
申请日：2010-01-13
申请人： Sinn-Wen Chen , Ching-Feng Yang
发明人： Sinn-Wen Chen , Ching-Feng Yang
IPC分类号： C22C13/00 , C22C13/02
CPC分类号： C22C13/00 , B23K35/262
摘要： A new kind of Sn—In based Pb-free solders with Zn addition is disclosed, which includes: 15˜25 wt % In; 0.05˜1.5 wt % Zn; and balance Sn. When the solder of the present invention is used in the assembly of electrical products, the dissolution rates of the substrates and the growth of the intermetallic compounds formed at the interfaces can be reduced; and thereby the properties of joints can be improved.
摘要翻译：公开了一种新型的含Zn添加剂的Sn-In基无铅焊料，其中包括：15〜25wt％In; 0.05〜1.5重量％的Zn; 并平衡Sn。当本发明的焊料用于电气产品的组装时，可以降低基板的溶解速率和在界面处形成的金属间化合物的生长; 从而可以提高接头的特性。

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