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1. 发明授权

US08517074B2 Apparatus for laminating a film on a wafer 有权
标题翻译：用于在薄片上层压薄膜的装置
公开(公告)号：US08517074B2
公开(公告)日：2013-08-27
申请号：US13345756
申请日：2012-01-09
申请人： Chin-Sen Lai , Ming-Tsung Chen
发明人： Chin-Sen Lai , Ming-Tsung Chen
IPC分类号： B29C65/00 , B32B37/00 , B32B38/04 , B32B38/10
CPC分类号： B32B38/10 , B32B43/00
摘要： An apparatus for laminating a film on a wafer includes a cutting mechanism and a laminating mechanism. The cutting mechanism has a cutting device disposed thereon for pre-cutting a dry film. The cutting mechanism has a supporter disposed adjacent to the cutting device for positioning a wafer. The cutting mechanism has a suction member disposed and corresponding to the cutting device for sucking the cut dry film to allow the cutting device pre-cutting the dry film and moving the cut dry film to the supporter. The laminating mechanism has a first lower member provided for positioning the wafer and a first upper member disposed above the first lower member for laminating the cut dry film with electrically heating to adhere the cut dry film on the wafer.
摘要翻译：用于在薄片上层压膜的设备包括切割机构和层压机构。切割机构具有设置在其上的用于预切割干膜的切割装置。切割机构具有邻近切割装置设置的用于定位晶片的支撑件。切割机构具有设置成对应于切割装置的抽吸构件，用于吸入切割的干膜，以允许切割装置预切割干膜并将切割的干膜移动到支撑件。层压机构具有设置用于定位晶片的第一下部构件和设置在第一下部构件上方的第一上部构件，用于通过电加热层压切割的干燥膜以将切割的干膜粘附在晶片上。

2. 发明授权

US08042590B2 Protection mechanism for dry film laminator 有权
标题翻译：干膜层压机的保护机理
公开(公告)号：US08042590B2
公开(公告)日：2011-10-25
申请号：US12699053
申请日：2010-02-03
申请人： Chin-Sen Lai
发明人： Chin-Sen Lai
IPC分类号： B32B37/00
CPC分类号： B32B37/00 , Y10T156/16 , Y10T156/1707
摘要： A protection mechanism for dry film laminator includes a lower member, and an upper member located above the lower member. The upper member moves downwardly/upwardly relative to the lower member. The upper member has a plurality of through holes defined therein and extending therethrough. An air supply device communicates with the through holes for feeding air into the through holes. A film guide device is disposed above the upper member and includes a supply spool and a take-up spool disposed thereon. A continuous release film movably connected to the film guide device. The continuous release film which is wound on the supply spool is routed from the supply spool to flatly pass between the upper member and the lower member, and is sequentially collected by the take-up spool.
摘要翻译：干膜层压机的保护机构包括下部构件和位于下部构件上方的上部构件。上部构件相对于下部构件向下/向上移动。上部件具有限定在其中并延伸穿过的多个通孔。供气装置与用于将空气进入通孔的通孔连通。胶片引导装置设置在上部构件上方，并且包括供应卷轴和设置在其上的卷取卷轴。可移动地连接到胶片引导装置的连续释放胶片。卷绕在供给卷轴上的连续剥离膜从供给卷轴路由到上部部件和下部部件之间平坦地通过，并且被卷取卷轴依次收集。

3. 发明申请

US20110186239A1 FLATTENING MECHANISM FOR DRY FILM LAMINATOR 有权
标题翻译：干膜机层压机构
公开(公告)号：US20110186239A1
公开(公告)日：2011-08-04
申请号：US12699070
申请日：2010-02-03
申请人： Chin-Sen LAI , Ming-Tsung Chen
发明人： Chin-Sen LAI , Ming-Tsung Chen
IPC分类号： B32B43/00
CPC分类号： B32B43/00 , Y10T156/16
摘要： A flattening mechanism for dry film laminator includes a lower member connected to a dry film laminator. The lower member has a base portion formed thereon. The base portion has a plurality of air holes defined therein. The lower member has a lifting holder movably disposed thereon for holding a wafer. The wafer has a dry film disposed thereon. An upper member is movably disposed above the lower member. The upper member has a pressing portion disposed on a bottom thereof. The pressing portion has a steel plate disposed thereon and a first electric heating layer mounted on a top of the steel. A release film is movably guided between the upper member and the lower member, such that the wafer is lifted to press against the steel plate via the release film for enhancing a lamination of the dry film to the wafer and flattening the dry film.
摘要翻译：用于干膜层压机的压扁机构包括连接到干膜层压机的下部构件。下部构件具有形成在其上的基部。基部具有限定在其中的多个气孔。下部构件具有可移动地设置在其上用于保持晶片的提升保持器。晶片具有设置在其上的干膜。上部构件可移动地设置在下部构件的上方。上部构件具有设置在其底部的按压部。按压部具有设置在其上的钢板和安装在钢的顶部上的第一电加热层。剥离膜在上部构件和下部构件之间被可移动地引导，使得晶片被提升以经由隔离膜压靠钢板，用于增强干膜对晶片的层压并使干膜变平。

4. 发明申请

US20110186232A1 CUTTING MECHANISM FOR DRY FILM LAMINATOR 有权
标题翻译：干膜复合机的切割机理
公开(公告)号：US20110186232A1
公开(公告)日：2011-08-04
申请号：US12699048
申请日：2010-02-03
申请人： Chin-Sen LAI
发明人： Chin-Sen LAI
IPC分类号： B32B38/10
CPC分类号： B32B38/10 , Y10T156/12 , Y10T156/1322 , Y10T156/1744 , Y10T156/1768
摘要： A cutting mechanism for dry film laminator includes a main base connected to a dry film laminator. The main base has a cutting space defined therein. The main base has two rollers disposed thereon and located beside the cutting space. The two rollers flatly guide a film above the cutting space. A film-carrying device is movably disposed on the main base. The film-carrying device includes a suction member movably disposed thereon. The suction member has at least one annular groove defined therein and corresponding to a shape of a wafer. A cutting device is movably disposed below the main base. The cutting device includes a film cutter movably disposed thereon. The cutting device includes an elevating device disposed thereon for moving the film cutter upward/downward. The cutting device includes a motor disposed thereon for rotating the film cutter.
摘要翻译：用于干膜层压机的切割机构包括连接到干膜层压机的主底座。主基座具有限定在其中的切割空间。主基座上设置有两个辊，位于切割空间的旁边。两个滚筒平坦地引导切割空间上方的薄膜。胶片携带装置可移动地设置在主底座上。胶片携带装置包括可移动地设置在其上的抽吸构件。抽吸构件具有限定在其中的至少一个环形槽并且对应于晶片的形状。切割装置可移动地设置在主基座的下方。切割装置包括可移动地设置在其上的胶片切割器。切割装置包括设置在其上的用于使薄膜切割器向上/向下移动的升降装置。切割装置包括设置在其上的用于旋转胶片切割器的马达。

5. 发明申请

US20110186231A1 PROTECTION MECHANISM FOR DRY FILM LAMINATOR 有权
标题翻译：干膜复合机的保护机理
公开(公告)号：US20110186231A1
公开(公告)日：2011-08-04
申请号：US12699053
申请日：2010-02-03
申请人： Chin-Sen LAI
发明人： Chin-Sen LAI
IPC分类号： B32B37/00
CPC分类号： B32B37/00 , Y10T156/16 , Y10T156/1707
摘要： A protection mechanism for dry film laminator includes a lower member, and an upper member located above the lower member. The upper member moves downwardly/upwardly relative to the lower member. The upper member has a plurality of through holes defined therein and extending therethrough. An air supply device communicates with the through holes for feeding air into the through holes. A film guide device is disposed above the upper member and includes a supply spool and a take-up spool disposed thereon. A continuous release film movably connected to the film guide device. The continuous release film which is wound on the supply spool is routed from the supply spool to flatly pass between the upper member and the lower member, and is sequentially collected by the take-up spool.
摘要翻译：干膜层压机的保护机构包括下部构件和位于下部构件上方的上部构件。上部构件相对于下部构件向下/向上移动。上部件具有限定在其中并延伸穿过的多个通孔。供气装置与用于将空气进入通孔的通孔连通。胶片引导装置设置在上部构件上方，并且包括供应卷轴和设置在其上的卷取卷轴。可移动地连接到胶片引导装置的连续释放胶片。卷绕在供给卷轴上的连续剥离膜从供给卷轴路由到上部部件和下部部件之间平坦地通过，并且被卷取卷轴依次收集。

6. 发明申请

US20110186215A1 APPARATUS AND METHOD FOR LAMINATING A FILM ON A WAFER 审中-公开
标题翻译：用于在薄膜上贴膜的装置和方法
公开(公告)号：US20110186215A1
公开(公告)日：2011-08-04
申请号：US12699064
申请日：2010-02-03
申请人： Chin-Sen LAI , Ming-Tsung Chen
发明人： Chin-Sen LAI , Ming-Tsung Chen
IPC分类号： B32B38/10 , B32B43/00
CPC分类号： B32B38/10 , B32B43/00
摘要： A method for laminating a film on a wafer includes a pre-cutting step: pre-cutting a dry film for fitting a size wafer size; a pre-attaching step: moving and pre-attaching the cut dry film on the wafer for corresponding the cut dry film and the wafer; a laminating step: laminating the cut dry film on the wafer with heating for fixing the cut dry film on the wafer. A flattening step: vertically and rigidly laminating the cut dry film on the wafer with heating again for flattening the cut dry film on the wafer.
摘要翻译：用于在晶片上层压膜的方法包括预切割步骤：预切割用于调整晶片尺寸的干膜; 预先安装步骤：将切割的干膜移动并预先安装在晶片上以对应于切割的干膜和晶片; 层压步骤：通过加热将切割的干膜层压在晶片上，以将切割的干膜固定在晶片上。平整步骤：再次加热，将切割的干膜垂直且刚性地层叠在晶片上，以使晶片上的切割干膜变平。

7. 发明授权

US08069893B2 Cutting mechanism for dry film laminator 有权
标题翻译：干膜层压机的切割机制
公开(公告)号：US08069893B2
公开(公告)日：2011-12-06
申请号：US12699048
申请日：2010-02-03
申请人： Chin-Sen Lai
发明人： Chin-Sen Lai
IPC分类号： B32B37/00 , B32B38/04
CPC分类号： B32B38/10 , Y10T156/12 , Y10T156/1322 , Y10T156/1744 , Y10T156/1768
摘要： A cutting mechanism for dry film laminator includes a main base connected to a dry film laminator. The main base has a cutting space defined therein. The main base has two rollers disposed thereon and located beside the cutting space. The two rollers flatly guide a film above the cutting space. A film-carrying device is movably disposed on the main base. The film-carrying device includes a suction member movably disposed thereon. The suction member has at least one annular groove defined therein and corresponding to a shape of a wafer. A cutting device is movably disposed below the main base. The cutting device includes a film cutter movably disposed thereon. The cutting device includes an elevating device disposed thereon for moving the film cutter upward/downward. The cutting device includes a motor disposed thereon for rotating the film cutter.
摘要翻译：用于干膜层压机的切割机构包括连接到干膜层压机的主底座。主基座具有限定在其中的切割空间。主基座上设置有两个辊，位于切割空间的旁边。两个滚筒平坦地引导切割空间上方的薄膜。胶片携带装置可移动地设置在主底座上。胶片携带装置包括可移动地设置在其上的抽吸构件。抽吸构件具有限定在其中的至少一个环形槽并且对应于晶片的形状。切割装置可移动地设置在主基座的下方。切割装置包括可移动地设置在其上的胶片切割器。切割装置包括设置在其上的用于使薄膜切割器向上/向下移动的升降装置。切割装置包括设置在其上的用于旋转胶片切割器的马达。

8. 发明授权

US08016012B2 Flattening mechanism for dry film laminator 有权
标题翻译：干膜层压机压平机构
公开(公告)号：US08016012B2
公开(公告)日：2011-09-13
申请号：US12699070
申请日：2010-02-03
申请人： Chin-Sen Lai , Ming-Tsung Chen
发明人： Chin-Sen Lai , Ming-Tsung Chen
IPC分类号： B32B37/00
CPC分类号： B32B43/00 , Y10T156/16
摘要： A flattening mechanism for dry film laminator includes a lower member connected to a dry film laminator. The lower member has a base portion formed thereon. The base portion has a plurality of air holes defined therein. The lower member has a lifting holder movably disposed thereon for holding a wafer. The wafer has a dry film disposed thereon. An upper member is movably disposed above the lower member. The upper member has a pressing portion disposed on a bottom thereof. The pressing portion has a steel plate disposed thereon and a first electric heating layer mounted on a top of the steel. A release film is movably guided between the upper member and the lower member, such that the wafer is lifted to press against the steel plate via the release film for enhancing a lamination of the dry film to the wafer and flattening the dry film.
摘要翻译：用于干膜层压机的压扁机构包括连接到干膜层压机的下部构件。下部构件具有形成在其上的基部。基部具有限定在其中的多个气孔。下部构件具有可移动地设置在其上用于保持晶片的提升保持器。晶片具有设置在其上的干膜。上部构件可移动地设置在下部构件的上方。上部构件具有设置在其底部的按压部。按压部具有设置在其上的钢板和安装在钢的顶部上的第一电加热层。剥离膜在上部构件和下部构件之间被可移动地引导，使得晶片被提升以经由隔离膜压靠钢板，用于增强干膜对晶片的层压并使干膜变平。

9. 发明申请

US20120103531A1 APPARATUS FOR LAMINATING A FILM ON A WAFER 有权
标题翻译：用于在水平面上贴膜的装置
公开(公告)号：US20120103531A1
公开(公告)日：2012-05-03
申请号：US13345756
申请日：2012-01-09
申请人： Chin-Sen LAI , Ming-Tsung Chen
发明人： Chin-Sen LAI , Ming-Tsung Chen
IPC分类号： B32B38/10
CPC分类号： B32B38/10 , B32B43/00
摘要： An apparatus for laminating a film on a wafer includes a cutting mechanism and a laminating mechanism. The cutting mechanism has a cutting device disposed thereon for pre-cutting a dry film. The cutting mechanism has a supporter disposed adjacent to the cutting device for positioning a wafer. The cutting mechanism has a suction member disposed and corresponding to the cutting device for sucking the cut dry film to allow the cutting device pre-cutting the dry film and moving the cut dry film to the supporter. The laminating mechanism has a first lower member provided for positioning the wafer and a first upper member disposed above the first lower member for laminating the cut dry film with electrically heating to adhere the cut dry film on the wafer.
摘要翻译：用于在薄片上层压膜的设备包括切割机构和层压机构。切割机构具有设置在其上的用于预切割干膜的切割装置。切割机构具有邻近切割装置设置的用于定位晶片的支撑件。切割机构具有设置成对应于切割装置的抽吸构件，用于吸入切割的干膜，以允许切割装置预切割干膜并将切割的干膜移动到支撑件。层压机构具有设置用于定位晶片的第一下部构件和设置在第一下部构件上方的第一上部构件，用于通过电加热层压切割的干燥膜以将切割的干膜粘附在晶片上。

10. 发明授权

US08291957B2 Transporter for dry film laminator 有权
标题翻译：干膜层压机运输机
公开(公告)号：US08291957B2
公开(公告)日：2012-10-23
申请号：US12699056
申请日：2010-02-03
申请人： Chin-Sen Lai , Wei-Hsien Li
发明人： Chin-Sen Lai , Wei-Hsien Li
IPC分类号： B32B37/00 , B32B37/16 , B65H37/00
CPC分类号： B32B38/18 , Y10T156/12 , Y10T156/1317 , Y10T156/1322 , Y10T156/1326 , Y10T156/1348 , Y10T156/17 , Y10T156/1702 , Y10T156/1705
摘要： A transporter for dry film laminator includes a base, a film guider mounted in the base, and a film leveler mounted on the base. The base has a platform disposed thereon. The base has two film extending rollers respectively disposed on two ends thereof. The base has two guiding rails disposed on two sides thereof. The film leveler has two ends respectively mounted on the two guiding rails. The film guider is provided for transporting the dry film to the platform.
摘要翻译：用于干膜层压机的输送器包括基座，安装在基座中的胶片引导器和安装在基座上的胶片调平器。基座上设有平台。底座具有分别设置在其两端的两个薄膜延伸辊。基座具有设置在其两侧的两个导轨。胶片矫直机具有分别安装在两个导轨上的两个端部。提供电影导体用于将干膜运送到平台。

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