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    • 4. 发明申请
    • METHOD FOR FABRICATING THIN FILM TRANSISTOR
    • 薄膜晶体管的制作方法
    • US20090305473A1
    • 2009-12-10
    • US12258451
    • 2008-10-27
    • Fang-Chen LuoShuo-Wei LiangShin-Chuan ChiangChao-Nan ChenChin-Chih Yu
    • Fang-Chen LuoShuo-Wei LiangShin-Chuan ChiangChao-Nan ChenChin-Chih Yu
    • H01L21/336
    • H01L29/7869
    • A method for fabricating a thin film transistor is provided. A gate is formed on a substrate. A gate insulating layer is formed on the substrate to cover the gate. A metal oxide material layer is formed on the gate insulating layer. A photoresist layer is formed on the metal oxide material layer, in which a thickness of the photoresist layer above the gate is larger than that of the photoresist layer above two sides adjacent to the gate. A portion of the metal oxide material layer is removed to form a metal oxide active layer by using the photoresist layer as a mask. The photoresist layer above the two sides adjacent to the gate is removed and the remaining photoresist layer covers a portion of the metal oxide active layer. A source and a drain are formed on the metal oxide active layer covered by the photoresist layer.
    • 提供一种制造薄膜晶体管的方法。 栅极形成在基板上。 在基板上形成栅极绝缘层以覆盖栅极。 在栅极绝缘层上形成金属氧化物材料层。 在金属氧化物材料层上形成光致抗蚀剂层,其中栅极上方的光致抗蚀剂层的厚度大于与栅极相邻的两侧上方的光致抗蚀剂层的厚度。 通过使用光致抗蚀剂层作为掩模,去除金属氧化物材料层的一部分以形成金属氧化物活性层。 去除与栅极相邻的两侧上方的光致抗蚀剂层,剩余的光致抗蚀剂层覆盖金属氧化物活性层的一部分。 在由光致抗蚀剂层覆盖的金属氧化物有源层上形成源极和漏极。
    • 6. 发明授权
    • Method for fabricating thin film transistor
    • 制造薄膜晶体管的方法
    • US08222095B2
    • 2012-07-17
    • US12258451
    • 2008-10-27
    • Fang-Chen LuoShuo-Wei LiangShin-Chuan ChiangChao-Nan ChenChin-Chih Yu
    • Fang-Chen LuoShuo-Wei LiangShin-Chuan ChiangChao-Nan ChenChin-Chih Yu
    • H01L21/00
    • H01L29/7869
    • A method for fabricating a thin film transistor is provided. A gate is formed on a substrate. A gate insulating layer is formed on the substrate to cover the gate. A metal oxide material layer is formed on the gate insulating layer. A photoresist layer is formed on the metal oxide material layer, in which a thickness of the photoresist layer above the gate is larger than that of the photoresist layer above two sides adjacent to the gate. A portion of the metal oxide material layer is removed to form a metal oxide active layer by using the photoresist layer as a mask. The photoresist layer above the two sides adjacent to the gate is removed and the remaining photoresist layer covers a portion of the metal oxide active layer. A source and a drain are formed on the metal oxide active layer covered by the photoresist layer.
    • 提供一种制造薄膜晶体管的方法。 栅极形成在基板上。 在基板上形成栅极绝缘层以覆盖栅极。 在栅极绝缘层上形成金属氧化物材料层。 在金属氧化物材料层上形成光致抗蚀剂层,其中栅极上方的光致抗蚀剂层的厚度大于与栅极相邻的两侧上方的光致抗蚀剂层的厚度。 通过使用光致抗蚀剂层作为掩模,去除金属氧化物材料层的一部分以形成金属氧化物活性层。 去除与栅极相邻的两侧上方的光致抗蚀剂层,剩余的光致抗蚀剂层覆盖金属氧化物活性层的一部分。 在由光致抗蚀剂层覆盖的金属氧化物有源层上形成源极和漏极。