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1. 发明授权

US5931156A Integral heat-pipe type solar collector 失效
标题翻译：集成式热管式太阳能收集器
公开(公告)号：US5931156A
公开(公告)日：1999-08-03
申请号：US972389
申请日：1997-11-18
申请人： Chih-Yao Wang , Wei-Yih Wu , Yang-Yih Hu , Tien-Yuan Li
发明人： Chih-Yao Wang , Wei-Yih Wu , Yang-Yih Hu , Tien-Yuan Li
IPC分类号： F24J2/32 , F24J2/34 , F28F13/12
CPC分类号： F24J2/32 , F24J2/345 , F28F13/125 , Y02E10/44
摘要： A heat-pipe type solar collector includes a heat absorber portion adapted to absorb solar energy to evaporate a working fluid in heat tube elements; and a heat release portion communicating with the heat absorber portion and having a body of a semi-annular or annular cross-section. In the daytime, the vaporized working fluid exchanges heat with objects adjacent to the heat release portion. At night when temperature drops, the working fluid flows to the heat absorber portion to allow the body of the heat release portion to generate a vacuum for heat insulating purposes, thereby maintaining the temperature in the water reservoir.
摘要翻译：热管式太阳能收集器包括：吸热部，其适于吸收太阳能以蒸发热管元件中的工作流体; 以及与所述吸热部连通且具有半环状或环状截面的主体的散热部。在白天，蒸发的工作流体与邻近放热部分的物体交换热量。当温度下降的夜晚，工作流体流向吸热器部分，以允许放热部分的主体产生用于绝热目的的真空，从而保持储水器中的温度。

2. 发明申请

US20070163756A1 Closed-loop latent heat cooling method and capillary force or non-nozzle module thereof 审中-公开
标题翻译：闭环潜热冷却方法和毛细管力或非喷嘴组件
公开(公告)号：US20070163756A1
公开(公告)日：2007-07-19
申请号：US11592293
申请日：2006-11-03
申请人： Chih-Yao Wang , Chiung-I Lee , Heng-Chieh Chien , Shu-Jung Yang , Ra-Min Tain , Chih-Min Hsiung
发明人： Chih-Yao Wang , Chiung-I Lee , Heng-Chieh Chien , Shu-Jung Yang , Ra-Min Tain , Chih-Min Hsiung
IPC分类号： H05K7/20
CPC分类号： H05K7/20336
摘要： A closed-loop latent heat cooling method and a capillary force or non-nozzle module thereof are provided, wherein a cooling fluid in a storage tank flows to a gasification pipe via a liquid pipe; the gasification pipe connects with a capillary force or non-nozzle structure; the cooling fluid keeps a liquid thin film in the gasification pipe, and after absorbing the heat of electronic components, it keeps a thin film in a boiling state; then, it is gasified and rises to a vapor chamber more efficiently; the gasified cooling fluid in the vapor chamber flows to a condenser via a vapor pipe and flows back to the storage tank via the liquid pipe after condensed to be a liquid in the condenser.
摘要翻译：提供闭环潜热冷却方法和毛细管力或非喷嘴组件，其中储罐中的冷却流体经由液体管流到气化管; 气化管与毛细管力或非喷嘴结构连接; 冷却液在气化管内保持液体薄膜，吸收电子部件的热量后，保持薄膜处于沸腾状态; 然后，它被气化并更有效地上升到蒸气室; 蒸气室中的气化冷却流体经由蒸汽管流入冷凝器，经冷凝后冷凝后回流至储罐，成为冷凝器中的液体。

3. 发明申请

US20050207120A1 Thermal module with heat reservoir and method of applying the same on electronic products 审中-公开
标题翻译：具有蓄热器的热模块及其应用于电子产品的方法
公开(公告)号：US20050207120A1
公开(公告)日：2005-09-22
申请号：US10978451
申请日：2004-11-02
申请人： Ming-Hsi Tseng , Heng-Chieh Chien , Chih-Yao Wang
发明人： Ming-Hsi Tseng , Heng-Chieh Chien , Chih-Yao Wang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a thermal module with heat reservoir, which is arranged with respect to a chip, and the thermal module comprises: a housing, disposed at a appropriate position corresponding to the chip and made of a material of high heat conductivity; a phase change material, disposed within the housing, capable of changing from a first state to a second state by absorbing heat and changing from the second state to the first state by releasing the heat stored therein; wherein the thermal module can be either mounted on the chip at an appropriate location or disposed at a location separated from the chip by an appropriate distance, in addition, the phase change process of the phase change material changing between the first state and the second state can be either a physical process or a chemical process.
摘要翻译：本发明公开了一种具有储热器的热模块，其相对于芯片布置，并且热模块包括：壳体，设置在与芯片相对应的适当位置处并由导热性高的材料制成; 相变材料，设置在壳体内，能够通过吸收热量从第一状态变为第二状态，并且通过释放存储在其中的热量从第二状态变为第一状态; 其中所述热模块可以或者安装在所述芯片上的适当位置处，或者设置在与所述芯片分离的位置上适当的距离，此外，所述相变材料在所述第一状态和所述第二状态之间变化的相变处理可以是物理过程或化学过程。

4. 发明授权

US06663278B1 Method for determining the thermal performance of a heat sink 有权
标题翻译：确定散热片热性能的方法
公开(公告)号：US06663278B1
公开(公告)日：2003-12-16
申请号：US10194149
申请日：2002-07-11
申请人： Heng Chieh Chien , Ming Hsi Tseng , Wen Wang Ke , Chih Yao Wang , Yi Shiau Chen
发明人： Heng Chieh Chien , Ming Hsi Tseng , Wen Wang Ke , Chih Yao Wang , Yi Shiau Chen
IPC分类号： G01N2520
CPC分类号： G01N25/18
摘要： A method for determining the thermal resistance constant of a modular heat sink. The method can be carried out by first providing a heat capacity tank formed of a high thermal conductivity metal. A modular heat sink is then mounted on top of the heat capacity tank and heated together with the tank to a temperature of at least 40° C. The heating is then stopped and the heat sink/heat capacity tank is allowed to cool for at least 30 seconds before the temperature and the cooling time of the heat capacity tank is monitored and recorded. The function of dT/dt is then calculated. The amount of heat dissipated is then calculated from the equation of Q=W·Cp·(dT/dt), while the thermal resistance constant is calculated by the equation of R=(T−Tamb)/Q.
摘要翻译：一种用于确定模块化散热器的热阻常数的方法。该方法可以通过首先提供由高导热性金属形成的热容罐来进行。然后将模块化散热器安装在热容罐的顶部上并与罐一起被加热到至少40℃的温度。然后停止加热，并使散热器/热容罐至少冷却温度和热容量罐的冷却时间被监视和记录30秒之前。然后计算dT / dt的函数。然后从Q = W.Cp。（dT / dt）的方程式计算散热量，而热阻常数由R =（T-Tamb）/ Q的方程计算。

5. 发明授权

US5465782A High-efficiency isothermal heat pipe 失效
标题翻译：高效等温热管
公开(公告)号：US5465782A
公开(公告)日：1995-11-14
申请号：US259003
申请日：1994-06-13
申请人： Jyi-Yu Sun , Tao Chian , Di-Kon Shih , Chih-Yao Wang
发明人： Jyi-Yu Sun , Tao Chian , Di-Kon Shih , Chih-Yao Wang
IPC分类号： F28D15/02 , F28D15/00
CPC分类号： F28D15/0233 , F28D15/046 , F28F2200/005
摘要： A high-efficiency isothermal heat pipe adapted for use in electronic equipment having a plate-like body with an enclosed inner chamber which has at least a dividing wall extending in the direction from the front end to the rear end of the body, separating the inner chamber into a plurality of zones which are interconnected by channels for the passage of a saturated working fluid filled in the inner chamber under a vacuum state. The dividing wall extends from the upper wall to the lower wall of the body and is integrally formed therewith so that the heat pipe may not distort in shape during the manufacturing process or when in use. The inner walls of the body have a plurality of grooves arranged between the front end and the rear end of the body for producing capillary action to quickly distribute heat.
摘要翻译：一种适用于电子设备的高效等温热管，具有具有封闭内室的板状体，该内壁至少具有从主体的前端向后端延伸的分隔壁，通过通道在真空状态下通过填充在内室中的饱和工作流体通过的多个区域连接。分隔壁从主体的上壁延伸到下壁并与其一体形成，使得热管在制造过程中或在使用时可能不会变形。本体的内壁具有布置在主体的前端和后端之间的多个槽，用于产生毛细作用以快速分配热量。

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