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1. 发明授权

US08915637B2 Light source module 有权
标题翻译：光源模块
公开(公告)号：US08915637B2
公开(公告)日：2014-12-23
申请号：US13848031
申请日：2013-03-20
申请人： Chiao-Chih Yang , Chao-Chun Cheng , Hsin-Hung Lee , Wei-Ching Wu , Yen-Hao Chen
发明人： Chiao-Chih Yang , Chao-Chun Cheng , Hsin-Hung Lee , Wei-Ching Wu , Yen-Hao Chen
IPC分类号： F21V7/04 , F21V8/00
CPC分类号： G02B6/0011 , G02B6/0021 , G02B6/0068
摘要： A light source module including a light guide plate, a plurality of light emitting devices, and a plurality of first reflective devices is provided. The light guide plate has a plurality of through holes and a light emitting surface. The through holes pass through the light emitting surface. Each of the through holes has a first side wall and a second side wall opposite the first side wall. At least one of the light emitting devices is disposed in each of the through holes. Each of the light emitting devices is capable emitting a light beam. The light beam enters the light guide plate from the first side wall of the through hole which the light emitting device is disposed in and leaves the light guide plate from the light emitting surface. The first reflective devices are disposed on the second side walls of the through holes.
摘要翻译：提供了包括导光板，多个发光装置和多个第一反射装置的光源模块。导光板具有多个通孔和发光面。通孔穿过发光表面。每个通孔具有与第一侧壁相对的第一侧壁和第二侧壁。至少一个发光器件设置在每个通孔中。每个发光器件都能够发射光束。光束从设置有发光元件的通孔的第一侧壁进入导光板，并从导光板离开发光面。第一反射装置设置在通孔的第二侧壁上。

2. 发明授权

US08708540B2 Backlight module with heat dissipation structure 失效
标题翻译：具有散热结构的背光模组
公开(公告)号：US08708540B2
公开(公告)日：2014-04-29
申请号：US13040271
申请日：2011-03-04
申请人： Hsin-Tse Tsai , Chiao-Chih Yang , Po-Chun Huang
发明人： Hsin-Tse Tsai , Chiao-Chih Yang , Po-Chun Huang
IPC分类号： F21V7/22 , F21V7/00 , G02F1/1335
CPC分类号： G02B6/0085 , G02B6/0068 , G02B6/0073 , G02B6/009
摘要： A backlight module includes a back plate, a light guide plate, a heat insulation layer, a heat dissipation member, and a light source device. The back plate has a first surface, a second surface opposite to the first surface, and an opening passing through the back plate. The light guide plate is disposed on the first surface, the heat insulation layer is disposed on the second surface, and the heat dissipation member is disposed on the heat insulation layer. The light source device is connected to the heat dissipation member and protrudes from the first surface to face the light guide plate through the opening.
摘要翻译：背光模块包括背板，导光板，隔热层，散热构件和光源装置。背板具有第一表面，与第一表面相对的第二表面和穿过背板的开口。导光板设置在第一表面上，绝热层设置在第二表面上，散热构件设置在绝热层上。光源装置连接到散热构件，并且从第一表面突出并通过开口面对导光板。

3. 发明申请

US20110286235A1 BACKLIGHT MODULE 失效
标题翻译：背光模组
公开(公告)号：US20110286235A1
公开(公告)日：2011-11-24
申请号：US13040271
申请日：2011-03-04
申请人： Hsin-Tse Tsai , Chiao-Chih Yang , Po-Chun Huang
发明人： Hsin-Tse Tsai , Chiao-Chih Yang , Po-Chun Huang
IPC分类号： F21V7/22
CPC分类号： G02B6/0085 , G02B6/0068 , G02B6/0073 , G02B6/009
摘要： A backlight module includes a back plate, a light guide plate, a heat insulation layer, a heat dissipation member, and a light source device. The back plate has a first surface, a second surface opposite to the first surface, and an opening passing through the back plate. The light guide plate is disposed on the first surface, the heat insulation layer is disposed on the second surface, and the heat dissipation member is disposed on the heat insulation layer. The light source device is connected to the heat dissipation member and protrudes from the first surface to face the light guide plate through the opening.
摘要翻译：背光模块包括背板，导光板，隔热层，散热构件和光源装置。背板具有第一表面，与第一表面相对的第二表面和穿过背板的开口。导光板设置在第一表面上，绝热层设置在第二表面上，散热构件设置在绝热层上。光源装置连接到散热构件，并且从第一表面突出并通过开口面对导光板。

4. 发明申请

US20090108271A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20090108271A1
公开(公告)日：2009-04-30
申请号：US12194117
申请日：2008-08-19
申请人： Wei-Jen CHOU , Sheng-Min WANG , Chiao-Chih YANG
发明人： Wei-Jen CHOU , Sheng-Min WANG , Chiao-Chih YANG
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/56 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member.
摘要翻译：发光二极管封装包括安装件，多个LED芯片以及由不同材料制成的第一和第二密封剂。安装座具有容纳空间和至少一个分隔构件，以将容纳空间分成多个单独的空腔。 LED芯片被放置在空腔中，并且通过空腔排出的LED芯片的发射光束包括具有第一波长带和第二波长带的第二发射的第一发射，并且第二波长带与第一波长带不同。第一密封剂和第二密封剂分别用于密封放置在第一或第二排放物通过的至少一个空腔中的至少一个LED芯片。第一密封剂和第二密封剂通过分隔构件彼此分开。

5. 发明申请

US20130250611A1 LIGHT SOURCE MODULE 有权
标题翻译：光源模块
公开(公告)号：US20130250611A1
公开(公告)日：2013-09-26
申请号：US13848065
申请日：2013-03-21
申请人： Hsin-Hung Lee , Chiao-Chih Yang , Wei-Ching Wu , Hung-Sen Lin
发明人： Hsin-Hung Lee , Chiao-Chih Yang , Wei-Ching Wu , Hung-Sen Lin
IPC分类号： F21V8/00
CPC分类号： G02B6/005 , G02B6/0021 , G02B6/0043 , G02B6/0055 , G02B6/0058
摘要： A light source module including a light guide plate, at least one light emitting device, a light-controlling pattern element, and an absorbing pattern element is provided. The light guide plate has a light emitting surface, a first surface opposite the light emitting surface, and at least one opening. The opening passes through the first surface and extends from the first surface toward the light emitting surface. The at least one light emitting device is disposed in the opening and arranged along an arranging direction. The light-controlling pattern element is disposed on the light emitting surface and covers the opening and the light emitting device. The opening faces towards the absorbing pattern element. The absorbing pattern element is disposed besides one of the at least one light emitting device and extends toward a side wall of the opening. Moreover, another two light source modules are also provided.
摘要翻译：提供了一种包括导光板，至少一个发光器件，光控制图案元件和吸收图案元件的光源模块。导光板具有发光表面，与发光表面相对的第一表面和至少一个开口。开口穿过第一表面并从第一表面延伸到发光表面。所述至少一个发光器件设置在所述开口中并沿排列方向布置。光控制图案元件设置在发光表面上并覆盖开口和发光器件。开口朝向吸收图案元件。吸收图案元件除了至少一个发光器件中的一个之外设置并且朝向开口的侧壁延伸。此外，还提供另外两个光源模块。

6. 发明授权

US08449163B2 Backlight module 有权
标题翻译：背光模组
公开(公告)号：US08449163B2
公开(公告)日：2013-05-28
申请号：US12881189
申请日：2010-09-14
申请人： Chiao-Chih Yang , Lei-Ken Hung , Hsin-Tse Tsai , Yi-Yu Tsai
发明人： Chiao-Chih Yang , Lei-Ken Hung , Hsin-Tse Tsai , Yi-Yu Tsai
IPC分类号： F21V7/04
CPC分类号： G02B6/0023 , G02B6/0085 , G02B6/0091
摘要： A backlight module includes at least one light emitting device capable of emitting a light beam, a light guide plate, and a thermal insulation light guide element. The light guide plate has two surfaces opposite to each other and a side surface connecting the two surfaces. The light emitting device is disposed beside the side surface. The light beam enters the light guide plate through the side surface. The thermal insulation light guide element has a light incident surface and a light emitting surface. The light incident surface having at least one first recess is located in a transmission path of the light beam and between the light emitting device and the side surface. The light emitting surface is disposed between the light incident surface and the side surface. The glass transition temperature of the thermal insulation light guide element is higher than that of the light guide plate.
摘要翻译：背光模块包括能够发射光束的至少一个发光器件，导光板和保温导光元件。导光板具有彼此相对的两个表面和连接两个表面的侧表面。发光装置设置在侧面旁边。光束通过侧面进入导光板。保温导光元件具有光入射面和发光面。具有至少一个第一凹部的光入射表面位于光束的传输路径中，并位于发光器件和侧表面之间。发光面配置在光入射面与侧面之间。绝热导光元件的玻璃化转变温度高于导光板的玻璃化转变温度。

7. 发明申请

US20100259572A1 Driving Apparatus and Driving Method of Backlight Module 有权
标题翻译：背光模组的驱动装置及驱动方法
公开(公告)号：US20100259572A1
公开(公告)日：2010-10-14
申请号：US12754612
申请日：2010-04-06
申请人： CHIAO-CHIH YANG , Chih-Hua Lin , Wei-Jen Chou , Chien-Chung Hsiao
发明人： CHIAO-CHIH YANG , Chih-Hua Lin , Wei-Jen Chou , Chien-Chung Hsiao
IPC分类号： G09G5/02
CPC分类号： G09G3/3611 , G09G3/3413 , G09G3/3426 , G09G2320/041 , G09G2320/0626 , G09G2360/145
摘要： A driving apparatus and a driving method of a backlight module are provided. The backlight module includes multiple LEDs. The driving apparatus includes at least one thermal sensor, an optical sensor, and a processor. The thermal sensor is for detecting a working temperature of the LEDs. The optical sensor is for detecting brightness and color of the backlight module after a calibration function is enabled, to obtain difference values of the detected brightness and color with respect to predetermined brightness and color. The processor is for providing at least one initial thermal compensation table, to determine working currents of the LEDs associated with the working temperature. The processor further is for calibrating a content of the initial thermal compensation table corresponding with a current working temperature of the LEDs and storing the calibrated thermal compensation table as the initial thermal compensation table after the calibration function is enabled.
摘要翻译：提供背光模块的驱动装置和驱动方法。背光模块包括多个LED。驱动装置包括至少一个热传感器，光学传感器和处理器。热传感器用于检测LED的工作温度。光学传感器用于在启用校准功能之后检测背光模块的亮度和颜色，以获得相对于预定亮度和颜色的检测到的亮度和颜色的差值。处理器用于提供至少一个初始热补偿表，以确定与工作温度相关联的LED的工作电流。处理器还用于校准对应于LED的当前工作温度的初始热补偿表的内容，并且在校准功能被启用之后将校准的热补偿表存储为初始热补偿表。

8. 发明授权

US08711081B2 Driving apparatus having an optical sensor and a thermal sensor for thermal and aging compensation of backlight module and driving method of backlight module 有权
标题翻译：具有光学传感器和用于背光模块的热老化补偿的热传感器和背光模块的驱动方法的驱动装置
公开(公告)号：US08711081B2
公开(公告)日：2014-04-29
申请号：US12754612
申请日：2010-04-06
申请人： Chiao-Chih Yang , Chih-Hua Lin , Wei-Jen Chou , Chien-Chung Hsiao
发明人： Chiao-Chih Yang , Chih-Hua Lin , Wei-Jen Chou , Chien-Chung Hsiao
IPC分类号： G09G3/36
CPC分类号： G09G3/3611 , G09G3/3413 , G09G3/3426 , G09G2320/041 , G09G2320/0626 , G09G2360/145
摘要： A driving apparatus and a driving method of a backlight module are provided. The backlight module includes multiple LEDs. The driving apparatus includes at least one thermal sensor, an optical sensor, and a processor. The thermal sensor is for detecting a working temperature of the LEDs. The optical sensor is for detecting brightness and color of the backlight module after a calibration function is enabled, to obtain difference values of the detected brightness and color with respect to predetermined brightness and color. The processor is for providing at least one initial thermal compensation table, to determine working currents of the LEDs associated with the working temperature. The processor further is for calibrating a content of the initial thermal compensation table corresponding with a current working temperature of the LEDs and storing the calibrated thermal compensation table as the initial thermal compensation table after the calibration function is enabled.
摘要翻译：提供背光模块的驱动装置和驱动方法。背光模块包括多个LED。驱动装置包括至少一个热传感器，光学传感器和处理器。热传感器用于检测LED的工作温度。光学传感器用于在启用校准功能之后检测背光模块的亮度和颜色，以获得相对于预定亮度和颜色的检测到的亮度和颜色的差值。处理器用于提供至少一个初始热补偿表，以确定与工作温度相关联的LED的工作电流。处理器还用于校准对应于LED的当前工作温度的初始热补偿表的内容，并且在校准功能被启用之后将校准的热补偿表存储为初始热补偿表。

9. 发明申请

US20130286685A1 LIGHT SOURCE MODULE 有权
标题翻译：光源模块
公开(公告)号：US20130286685A1
公开(公告)日：2013-10-31
申请号：US13848031
申请日：2013-03-20
申请人： Chiao-Chih Yang , Chao-Chun Cheng , Hsin-Hung Lee , Wei-Ching Wu , Yen-Hao Chen
发明人： Chiao-Chih Yang , Chao-Chun Cheng , Hsin-Hung Lee , Wei-Ching Wu , Yen-Hao Chen
IPC分类号： F21V8/00
CPC分类号： G02B6/0011 , G02B6/0021 , G02B6/0068
摘要： A light source module including a light guide plate, a plurality of light emitting devices, and a plurality of first reflective devices is provided. The light guide plate has a plurality of through holes and a light emitting surface. The through holes pass through the light emitting surface. Each of the through holes has a first side wall and a second side wall opposite the first side wall. At least one of the light emitting devices is disposed in each of the through holes. Each of the light emitting devices is capable emitting a light beam. The light beam enters the light guide plate from the first side wall of the through hole which the light emitting device is disposed in and leaves the light guide plate from the light emitting surface. The first reflective devices are disposed on the second side walls of the through holes.
摘要翻译：提供了包括导光板，多个发光装置和多个第一反射装置的光源模块。导光板具有多个通孔和发光面。通孔穿过发光表面。每个通孔具有与第一侧壁相对的第一侧壁和第二侧壁。至少一个发光器件设置在每个通孔中。每个发光器件都能够发射光束。光束从设置有发光元件的通孔的第一侧壁进入导光板，并从导光板离开发光面。第一反射装置设置在通孔的第二侧壁上。

10. 发明授权

US08344411B2 Light emitting diode package 有权
标题翻译：发光二极管封装
公开(公告)号：US08344411B2
公开(公告)日：2013-01-01
申请号：US12194117
申请日：2008-08-19
申请人： Wei-Jen Chou , Sheng-Min Wang , Chiao-Chih Yang
发明人： Wei-Jen Chou , Sheng-Min Wang , Chiao-Chih Yang
IPC分类号： H01L29/207
CPC分类号： H01L25/0753 , H01L33/56 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member.
摘要翻译：发光二极管封装包括安装件，多个LED芯片以及由不同材料制成的第一和第二密封剂。安装座具有容纳空间和至少一个分隔构件，以将容纳空间分成多个单独的空腔。将LED芯片放置在空腔中，并且通过空腔排出的LED芯片的发射光束包括具有第一波长带和第二波长带的第二发射的第一发射，并且第二波长带与第一波长带不同。第一密封剂和第二密封剂分别用于密封放置在第一或第二排放物通过的至少一个空腔中的至少一个LED芯片。第一密封剂和第二密封剂通过分隔构件彼此分开。

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