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    • 2. 发明授权
    • Method and apparatus for making smart card solder contacts
    • 制造智能卡焊接触点的方法和装置
    • US06857552B2
    • 2005-02-22
    • US10414768
    • 2003-04-17
    • Chi Ming Wong
    • Chi Ming Wong
    • B23K1/00G06K19/077H01R43/02H05K3/34B23K31/02
    • G06K19/0775B23K1/0004B23K1/0016G06K19/07749H01R43/0207H01R43/0235H01R43/0263H05K3/3494
    • A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with a heater having horizontal opening with melted solder retained therein. The solder pre-coated terminal ends are maintained in a secured contact with the terminal contacts of the IC module by heating coils mounted at a free front end of two pivotal elongated cantilever arms. A piece of predetermined amount of solder is dropped into the cavity of each heating coil, and the heating coils are actuated with a low electrical current to generate a concentrated intense heat to melt the piece of solder to form secure permanent solder joints between the terminal ends of the antenna to the contact terminals of the IC module.
    • 示出了用于焊接嵌入塑料智能卡中的天线的端部以接触设置在卡上的IC模块的端子的方法和装置。 漆包线天线端子端部用具有水平开口的加热器的焊料预涂覆,熔融的焊料保留在其中。 通过加热安装在两个枢转细长悬臂的自由前端的线圈,将焊料预涂覆的端子保持与IC模块的端子触点的牢固接触。 预定量的焊料落在每个加热线圈的空腔中,并且加热线圈以低电流致动以产生集中的强烈热量,以熔化该焊料片,以在终端之间形成牢固的永久焊接点 的天线连接到IC模块的接触端子。