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1. 发明授权

US09007149B2 Common mode filter with multi spiral layer structure and method of manufacturing the same 有权
标题翻译：共模滤波器具有多螺旋层结构及其制造方法
公开(公告)号：US09007149B2
公开(公告)日：2015-04-14
申请号：US13572378
申请日：2012-08-10
申请人： Yu Chia Chang , Chi Long Lin , Cheng Yi Wang , Shin Min Tai
发明人： Yu Chia Chang , Chi Long Lin , Cheng Yi Wang , Shin Min Tai
IPC分类号： H03H7/09 , H01F17/00 , H03H7/42 , H01P11/00 , H03H1/00
CPC分类号： H01F17/0013 , H01F2017/0066 , H01P11/003 , H03H7/09 , H03H7/427 , H03H2001/0085 , H03H2001/0092 , Y10T29/49124
摘要： A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.
摘要翻译：具有多螺旋层结构的共模滤波器包括第一线圈，第二线圈，与第一线圈串联连接的第三线圈，与第二线圈串联连接的第四线圈，第一材料层和第二材料层。第二线圈设置在第一和第三线圈之间，第三线圈设置在第二和第四线圈之间。第一和第二材料层中的至少一个包括磁性材料。第一，第二，第三和第四线圈设置在第一和第二材料层之间。

2. 发明授权

US08988181B2 Common mode filter with multi-spiral layer structure and method of manufacturing the same 有权
标题翻译：共模滤波器具有多螺旋层结构及其制造方法
公开(公告)号：US08988181B2
公开(公告)日：2015-03-24
申请号：US13606531
申请日：2012-09-07
申请人： Yu Chia Chang , Cheng Yi Wang , Shin Min Tai
发明人： Yu Chia Chang , Cheng Yi Wang , Shin Min Tai
IPC分类号： H01F5/00 , H01F27/30 , H01L27/08 , H01F17/00
CPC分类号： H01F17/0013 , H01F17/0033 , H01F2017/0066 , H01F2017/0093 , Y10T29/49071
摘要： A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material.
摘要翻译：共模滤波器包括第一线圈，第二线圈，将第一线圈与第二线圈分开的第一绝缘层，与第一线圈串联连接的第三线圈，将第二线圈与第三线圈分开的第二绝缘层，与第二线圈串联连接的第四线圈，以及将第三线圈与第四线圈分开的第三绝缘层。第二线圈在第一和第三线圈之间，第三线圈在第二和第四线圈之间。第一绝缘层，第二绝缘层和第三绝缘层中的至少一个可以包括磁性材料。

3. 发明授权

US08278756B2 Single chip semiconductor coating structure and manufacturing method thereof 有权
标题翻译：单芯片半导体涂层结构及其制造方法
公开(公告)号：US08278756B2
公开(公告)日：2012-10-02
申请号：US12711712
申请日：2010-02-24
申请人： Liang-Chieh Wu , Cheng-Yi Wang
发明人： Liang-Chieh Wu , Cheng-Yi Wang
IPC分类号： H01L23/52
CPC分类号： H01L21/568 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/33 , H01L2924/00011 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2224/29298 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.
摘要翻译：单芯片半导体涂层结构的制造方法包括以下步骤。步骤1是提供具有多个表面的单芯片半导体，并且从多个表面中选择的两个相对表面分别是制造表面，并且在其上具有衬垫的导电区域。步骤2提供了用垫覆盖导电区域之一的工具。步骤3提供了在单芯片半导体上形成绝缘层的涂覆步骤。步骤4提供去除用于暴露被覆盖的导电区域和垫的绝缘层的去除步骤。步骤5形成两个电极，并且两个电极中的每个电极用垫覆盖导电区域。

4. 发明申请

US20080314405A1 Structure of a make-up container 审中-公开
标题翻译：化妆品容器的结构
公开(公告)号：US20080314405A1
公开(公告)日：2008-12-25
申请号：US11812539
申请日：2007-06-20
申请人： Ming-Chih Chu , Cheng-Yi Wang
发明人： Ming-Chih Chu , Cheng-Yi Wang
IPC分类号： A45D40/26
CPC分类号： A45D34/04 , A45D2200/051 , A61H7/003 , A61H2201/105 , A61H2201/169
摘要： A make-up container includes a containing body, a soft application device, a rigid reinforcement element for the soft application device, and a cap; the containing body has an opening, and the reinforcement element is positioned on the opening of the containing body; the application device surrounds and covers an annular portion of the reinforcement element at a base portion thereof therefore the base portion of the application device can't change shape easily even if it is subjected to pressure; the application device and the containing body are joined together so as to be inseparable; the application device has a through hole on one end thereof, which communicates with an inside of the containing body; the cap serves to cover the application device.
摘要翻译：一种化妆容器包括容纳体，软涂敷装置，用于软涂敷装置的刚性加强件和帽; 容纳体具有开口，并且加强元件位于容纳体的开口上; 应用装置在其基部围绕并覆盖加强元件的环形部分，因此施加装置的基部即使经受压力也不容易改变形状; 所述应用装置和所述容纳体是不可分离的，所述应用装置的一端具有与所述容纳体的内部连通的通孔，盖用于覆盖应用设备。

5. 发明申请

US20050099468A1 Structure of stacked inkjet head 有权
标题翻译：堆叠喷墨头的结构
公开(公告)号：US20050099468A1
公开(公告)日：2005-05-12
申请号：US10801560
申请日：2004-03-17
申请人： Chun-Fu Lu , Fa-Yuan Hsu , Howard Liu , Cheng-Yi Wang , Huen-Ling Chen , Chi-Bin Lo
发明人： Chun-Fu Lu , Fa-Yuan Hsu , Howard Liu , Cheng-Yi Wang , Huen-Ling Chen , Chi-Bin Lo
IPC分类号： B41J2/16 , B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/162 , B41J2/1623 , B41J2/1629 , B41J2002/14362
摘要： A structure of the stacked inkjet head is composed of a stacked fluid structure and an actuator. At least one of the several plates in the stacked fluid structure has a junction with a tuning hole for enhancing the connection strength of the junction, accommodating overflown adhesive, and reducing structural deformation resulted from the temperature. The invention also avoids the troubles of inhomogeneous etching speeds when making nozzles or channels.
摘要翻译：堆叠式喷墨头的结构由层叠的流体结构和致动器构成。层叠流体结构中的几个板中的至少一个具有与调谐孔的接合部，用于增强接头的连接强度，容纳溢出的粘合剂，并减少由温度引起的结构变形。本发明还避免了制造喷嘴或通道时不均匀蚀刻速度的问题。

6. 发明申请

US20140138559A1 LAMPSHADE AND ILLUMINATION MODULE 审中-公开
标题翻译： LAMPSHADE和照明模块
公开(公告)号：US20140138559A1
公开(公告)日：2014-05-22
申请号：US13678559
申请日：2012-11-16
申请人： Tzyy-Jang Tseng , Cheng-Yi Wang
发明人： Tzyy-Jang Tseng , Cheng-Yi Wang
IPC分类号： F21V1/00 , G21K5/00
CPC分类号： G21K5/00 , F21K9/64 , F21V3/02 , F21V3/049 , F21Y2115/10 , H01L33/507 , H01L33/58
摘要： A lampshade including a plurality of plate structures is provided. The plurality of plate structures are connected to one another to form a hollow casing having an opening. An illumination module including a base plate, a light source, and a lampshade is further provided. The light source is disposed on the base plate. The lampshade is covered on the base plate, and the light source is sited between the base plate and the lampshade. The lampshade includes a plurality of plate structures, wherein the plurality of plate structures are connected to one another to form a hollow casing having an opening.
摘要翻译：提供了包括多个板结构的灯罩。多个板结构彼此连接以形成具有开口的中空壳体。还提供了包括基板，光源和灯罩的照明模块。光源设置在基板上。灯罩覆盖在底板上，光源位于底板和灯罩之间。灯罩包括多个板结构，其中多个板结构彼此连接以形成具有开口的中空壳体。

7. 发明申请

US20130009740A1 COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：共模滤波器及其制造方法
公开(公告)号：US20130009740A1
公开(公告)日：2013-01-10
申请号：US13429864
申请日：2012-03-26
申请人： YU CHIA CHANG , CHI LONG LIN , HUAI LUH CHANG , CHENG YI WANG
发明人： YU CHIA CHANG , CHI LONG LIN , HUAI LUH CHANG , CHENG YI WANG
IPC分类号： H01F5/00 , H01F41/00
CPC分类号： H01F41/04 , H01F17/0013 , H01F27/255 , H01F41/046 , H01F41/14 , H01F41/22 , H01F2017/0066 , H01F2017/0073 , H03H7/427 , H03H2001/0085 , Y10T29/4902 , Y10T29/49069 , Y10T29/49073 , Y10T29/49078
摘要： A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.
摘要翻译：具有异质层叠体的共模滤波器包括第一磁性层，非磁性绝缘基板，第二磁性层，第一线圈层和第二线圈层。第二磁性层形成在非磁性绝缘基板上，非磁性绝缘基板与第一磁性层之间。第一线圈层设置在第一磁性层和第二磁性层之间，并且包括第一线圈。第二线圈层设置在第一磁性层和第二磁性层之间，并且包括第二线圈。第一和第二线圈层彼此分离，并且第一和第二线圈彼此磁耦合。

8. 发明申请

US20120206538A1 SUPPLY SYSTEM AND INJECTION-HEAD STRUCTURE THEREOF 审中-公开
标题翻译：供应系统及其注射头结构
公开(公告)号：US20120206538A1
公开(公告)日：2012-08-16
申请号：US13429015
申请日：2012-03-23
申请人： Cheng-Yi WANG , Wan-Wen CHIU , Kuo-Hua WU , Chen-Chu TSAI , Chao-Kai CHENG
发明人： Cheng-Yi WANG , Wan-Wen CHIU , Kuo-Hua WU , Chen-Chu TSAI , Chao-Kai CHENG
IPC分类号： B41J2/145
CPC分类号： B41J2/145 , B41J2/175 , B41J2/19 , B41J2202/20
摘要： A supply system capable of providing a working fluid is provided. The supply system includes an access device, a first energizer, a second energizer, a third energizer and an output device. The access device utilized to access the working fluid includes a connecting port. The first energizer provides a first energy to energize the working fluid, thereby expelling the bubbles from the working fluid. The second energizer provides a second energy to energize the working fluid received in the access device, thereby expelling the working fluid through the connecting port of the access device. The output device is connected to the access device, thereby receiving and outputting the working fluid. The third energizer provides a third energy to heat the working fluid passing through the access device and the output device.
摘要翻译：提供了能够提供工作流体的供应系统。供电系统包括一个接入装置，一个第一激发器，一个第二激发器，一个第三激发器和一个输出装置。用于接近工作流体的进入装置包括连接端口。第一激发器提供第一能量来激励工作流体，从而从工作流体排出气泡。第二激发器提供第二能量以激励接入设备中接收的工作流体，从而通过接入设备的连接端口排出工作流体。输出装置与接入装置连接，从而接收并输出工作流体。第三激发器提供第三能量来加热通过进入装置和输出装置的工作流体。

9. 发明申请

US20120100711A1 SINGLE CHIP SEMICONDUCTOR COATING STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：单芯片半导体涂层结构及其制造方法
公开(公告)号：US20120100711A1
公开(公告)日：2012-04-26
申请号：US13343372
申请日：2012-01-04
申请人： LIANG-CHIEH WU , CHENG-YI WANG
发明人： LIANG-CHIEH WU , CHENG-YI WANG
IPC分类号： H01L21/28
CPC分类号： H01L21/568 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/33 , H01L2924/00011 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2224/29298 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.
摘要翻译：单芯片半导体涂层结构的制造方法包括以下步骤。步骤1是提供具有多个表面的单芯片半导体，并且从多个表面中选择的两个相对表面分别是制造表面，并且在其上具有衬垫的导电区域。步骤2提供了用垫覆盖导电区域之一的工具。步骤3提供了在单芯片半导体上形成绝缘层的涂覆步骤。步骤4提供去除用于暴露被覆盖的导电区域和垫的绝缘层的去除步骤。步骤5形成两个电极，并且两个电极中的每个电极用垫覆盖导电区域。

10. 发明申请

US20110204521A1 CHIP-SCALE SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：芯片半导体器件封装及其制造方法
公开(公告)号：US20110204521A1
公开(公告)日：2011-08-25
申请号：US13030842
申请日：2011-02-18
申请人： LIANG CHIEH WU , CHENG YI WANG
发明人： LIANG CHIEH WU , CHENG YI WANG
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L23/3107 , H01L23/3114 , H01L23/315 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A chip-scale semiconductor device package includes a die, an insulating substrate having a through hole, a first metal layer, a second metal layer, and an insulating layer. The first metal layer is on a first surface of the insulating substrate and a first side of the through hole. The insulating layer is overlaid on a second surface of the insulating substrate and surrounds a second side of the through hole. The second metal is on the insulating layer and the second side of the through hole. The die is in the through hole and includes a first electrode and a second electrode. The first electrode is electrically connected to the first metal layer, and the second electrode is electrically connected to the second metal layer.
摘要翻译：芯片级半导体器件封装包括管芯，具有通孔的绝缘基板，第一金属层，第二金属层和绝缘层。第一金属层位于绝缘基板的第一表面和通孔的第一侧上。绝缘层覆盖在绝缘基板的第二表面上并且围绕通孔的第二侧。第二金属位于绝缘层和通孔的第二面上。模具在通孔中并且包括第一电极和第二电极。第一电极与第一金属层电连接，第二电极与第二金属层电连接。

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