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1. 发明申请

US20090097175A1 ESD PROTECTION SUBSTRATE AND INTEGRATED CIRCUIT UTILIZING THE SAME 有权
标题翻译： ESD保护基板和整合电路
公开(公告)号：US20090097175A1
公开(公告)日：2009-04-16
申请号：US12047283
申请日：2008-03-12
申请人： Chen-Hsuan Chiu , Min-Lin Lee , Shinn-Juh Lai , Shih-Hsien Wu , Chi-Liang Pan
发明人： Chen-Hsuan Chiu , Min-Lin Lee , Shinn-Juh Lai , Shih-Hsien Wu , Chi-Liang Pan
IPC分类号： H02H9/00 , H01L27/02
CPC分类号： H01L23/60 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/49171 , H01L2924/00014 , H01L2924/3011 , H01L2224/05599
摘要： An ESD protection substrate is disclosed. The ESD protection substrate includes a first conductor, a second conductor, a pointed structure, and an ESD protection material. The pointed structure is electrically connected to the first or the second conductor. The ESD protection material is disposed between the first and the second conductors.
摘要翻译：公开了ESD保护衬底。 ESD保护衬底包括第一导体，第二导体，尖锐结构和ESD保护材料。尖的结构电连接到第一或第二导体。 ESD保护材料设置在第一和第二导体之间。

2. 发明授权

US08125761B2 Capacitor devices with co-coupling electrode planes 有权
标题翻译：具有共耦合电极平面的电容器件
公开(公告)号：US08125761B2
公开(公告)日：2012-02-28
申请号：US12390237
申请日：2009-02-20
申请人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Chen-Hsuan Chiu
发明人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Chen-Hsuan Chiu
IPC分类号： H01G4/00
CPC分类号： H01G4/005 , H01G4/228 , H01L2224/16225 , H05K1/0231 , H05K1/0298 , H05K1/112 , H05K1/162 , H05K3/429 , H05K2201/09309 , H05K2201/09672 , H05K2201/09845 , H05K2201/10734
摘要： A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the first electrode and the second electrode being coupled to at least one second conductive via. The capacitive module may also include a second capacitor spaced apart from the first capacitor, the second capacitor including a third electrode and a fourth electrode, one of the third electrode and the fourth electrode being coupled to the at least one first conductive via and the other one of the third electrode and the fourth electrode being coupled to the at least one second conductive via. Furthermore, the capacitive module may include a first conductive plane being electrically coupled to a first plane with a first polarity through one of the at least one first conductive via and a second conductive plane being electrically coupled to a second plane with a second polarity, opposite to the first polarity, through one of the at least one second conductive via.
摘要翻译：提供电容模块。电容性模块可以包括包括第一电极和第二电极的第一电容器，第一电极和第二电极中的一个耦合到至少一个第一导电通孔，而第一电极和第二电极中的另一个耦合到至少一个第二导电通孔。电容性模块还可以包括与第一电容器间隔开的第二电容器，第二电容器包括第三电极和第四电极，第三电极和第四电极中的一个耦合到至少一个第一导电通孔和另一个第三电极和第四电极中的一个耦合到至少一个第二导电通孔。此外，电容性模块可以包括第一导电平面，其通过第一导电通孔中的一个与第一极性电耦合到第一平面，第二导电平面电耦合到具有第二极性的第二平面，通过至少一个第二导电通孔中的一个延伸到第一极性。

3. 发明授权

US07649723B2 ESD protection substrate and integrated circuit utilizing the same 有权
标题翻译： ESD保护基板和利用其的集成电路
公开(公告)号：US07649723B2
公开(公告)日：2010-01-19
申请号：US12047283
申请日：2008-03-12
申请人： Chen-Hsuan Chiu , Min-Lin Lee , Shinn-Juh Lai , Shih-Hsien Wu , Chi-Liang Pan
发明人： Chen-Hsuan Chiu , Min-Lin Lee , Shinn-Juh Lai , Shih-Hsien Wu , Chi-Liang Pan
IPC分类号： H02H9/00 , H02H3/20 , H02H9/04 , H02H3/22 , H02H1/00 , H02H1/04 , H02H9/06
CPC分类号： H01L23/60 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/49171 , H01L2924/00014 , H01L2924/3011 , H01L2224/05599
摘要： An ESD protection substrate is disclosed. The ESD protection substrate includes a first conductor, a second conductor, a pointed structure, and an ESD protection material. The pointed structure is electrically connected to the first or the second conductor. The ESD protection material is disposed between the first and the second conductors.
摘要翻译：公开了ESD保护衬底。 ESD保护衬底包括第一导体，第二导体，尖锐结构和ESD保护材料。尖的结构电连接到第一或第二导体。 ESD保护材料设置在第一和第二导体之间。

4. 发明授权

US07894172B2 ESD protection structure 有权
标题翻译： ESD保护结构
公开(公告)号：US07894172B2
公开(公告)日：2011-02-22
申请号：US12191179
申请日：2008-08-13
申请人： Chi-Liang Pan , Min-Lin Lee , Shinn-Juh Lai , Shih-Hsien Wu , Chen-Hsuan Chiu
发明人： Chi-Liang Pan , Min-Lin Lee , Shinn-Juh Lai , Shih-Hsien Wu , Chen-Hsuan Chiu
IPC分类号： H05F3/00
CPC分类号： H01L23/60 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/3011 , H05K1/0257 , H05K1/0259 , H05K1/0373 , H05K1/116 , H05K1/167 , H05K3/4688 , H05K2201/0738 , H05K2201/09718 , H01L2924/00014
摘要： An ESD protection structure is provided. A substrate includes a first voltage variable material and has a first surface, a second surface substantially paralleled to the first surface and a via connecting the first and second surfaces. A first metal layer is disposed in the substrate for coupling to a ground terminal. The first voltage variable material is in a conductive state when an ESD event occurs, such that the via is electrically connected with the first metal layer to form a discharge path, and the first voltage variable material is in an isolation state when the ESD event is absent, such that the via is electrically isolated from the first metal layer.
摘要翻译：提供ESD保护结构。衬底包括第一电压可变材料，并具有第一表面，与第一表面基本平行的第二表面和连接第一表面和第二表面的通孔。第一金属层设置在衬底中用于耦合到接地端子。当ESD事件发生时，第一电压可变材料处于导通状态，使得通孔与第一金属层电连接以形成放电路径，并且当ESD事件为ESD时，第一电压可变材料处于隔离状态不存在，使得通孔与第一金属层电隔离。

5. 发明申请

US20090213526A1 CAPACITOR DEVICES WITH CO-COUPLING ELECTRODE PLANES 有权
标题翻译：具有CO耦合电极平面的电容器件
公开(公告)号：US20090213526A1
公开(公告)日：2009-08-27
申请号：US12390237
申请日：2009-02-20
申请人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Chen-Hsuan Chiu
发明人： Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Chen-Hsuan Chiu
IPC分类号： H01G4/228 , H05K1/18
CPC分类号： H01G4/005 , H01G4/228 , H01L2224/16225 , H05K1/0231 , H05K1/0298 , H05K1/112 , H05K1/162 , H05K3/429 , H05K2201/09309 , H05K2201/09672 , H05K2201/09845 , H05K2201/10734
摘要： A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the first electrode and the second electrode being coupled to at least one second conductive via. The capacitive module may also include a second capacitor spaced apart from the first capacitor, the second capacitor including a third electrode and a fourth electrode, one of the third electrode and the fourth electrode being coupled to the at least one first conductive via and the other one of the third electrode and the fourth electrode being coupled to the at least one second conductive via. Furthermore, the capacitive module may include a first conductive plane being electrically coupled to a first plane with a first polarity through one of the at least one first conductive via and a second conductive plane being electrically coupled to a second plane with a second polarity, opposite to the first polarity, through one of the at least one second conductive via.
摘要翻译：提供电容模块。电容性模块可以包括包括第一电极和第二电极的第一电容器，第一电极和第二电极中的一个耦合到至少一个第一导电通孔，而第一电极和第二电极中的另一个耦合到至少一个第二导电通孔。电容性模块还可以包括与第一电容器间隔开的第二电容器，第二电容器包括第三电极和第四电极，第三电极和第四电极中的一个耦合到至少一个第一导电通孔和另一个第三电极和第四电极中的一个耦合到至少一个第二导电通孔。此外，电容性模块可以包括第一导电平面，其通过第一导电通孔中的一个与第一极性电耦合到第一平面，第二导电平面电耦合到具有第二极性的第二平面，通过至少一个第二导电通孔中的一个延伸到第一极性。

6. 发明申请

US20090180225A1 ESD PROTECTION STRUCTURE 有权
标题翻译： ESD保护结构
公开(公告)号：US20090180225A1
公开(公告)日：2009-07-16
申请号：US12191179
申请日：2008-08-13
申请人： Chi-Liang Pan , Min-Lin Lee , Shinn-Juh Lai , Shih-Hsien Wu , Chen-Hsuan Chiu
发明人： Chi-Liang Pan , Min-Lin Lee , Shinn-Juh Lai , Shih-Hsien Wu , Chen-Hsuan Chiu
IPC分类号： H02H9/00
CPC分类号： H01L23/60 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/3011 , H05K1/0257 , H05K1/0259 , H05K1/0373 , H05K1/116 , H05K1/167 , H05K3/4688 , H05K2201/0738 , H05K2201/09718 , H01L2924/00014
摘要： An ESD protection structure is provided. A substrate includes a first voltage variable material and has a first surface, a second surface substantially paralleled to the first surface and a via connecting the first and second surfaces. A first metal layer is disposed in the substrate for coupling to a ground terminal. The first voltage variable material is in a conductive state when an ESD event occurs, such that the via is electrically connected with the first metal layer to form a discharge path, and the first voltage variable material is in an isolation state when the ESD event is absent, such that the via is electrically isolated from the first metal layer.
摘要翻译：提供ESD保护结构。衬底包括第一电压可变材料，并具有第一表面，与第一表面基本平行的第二表面和连接第一表面和第二表面的通孔。第一金属层设置在衬底中用于耦合到接地端子。当ESD事件发生时，第一电压可变材料处于导通状态，使得通孔与第一金属层电连接以形成放电路径，并且当ESD事件为ESD时，第一电压可变材料处于隔离状态不存在，使得通孔与第一金属层电隔离。

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