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    • 1. 发明申请
    • REPLICATION AND TRANSFER OF MICROSTRUCTURES AND NANOSTRUCTURES
    • 微结构和纳米结构的复制和转移
    • US20100044837A1
    • 2010-02-25
    • US11848669
    • 2007-08-31
    • Charles Daniel Schaper
    • Charles Daniel Schaper
    • H01L29/02H01L21/30
    • B81C1/0046B29C33/52B82Y10/00B82Y40/00G03F7/0002G03F7/091Y10S438/942
    • A method for the duplication of microscopic patterns from a master to a substrate is disclosed, in which a replica of a topographic structure on a master is formed and transferred when needed onto a receiving substrate using one of a variety of printing or imprint techniques, and then dissolved. Additional processing steps can also be carried out using the replica before transfer, including the formation of nanostructures, microdevices, or portions thereof. These structures are then also transferred onto the substrate when the replica is transferred, and remain on the substrate when the replica is dissolved. This is a technique that can be applied as a complementary process or a replacement for various lithographic processing steps in the fabrication of integrated circuits and other microdevices.
    • 公开了一种用于从主机到基板的微观图案的复制的方法,其中主体上的形貌结构的复制品在需要时被形成并且使用各种印刷或印记技术之一转印到接收基板上,以及 然后溶解。 另外的处理步骤也可以在转移之前使用复制品进行,包括形成纳米结构,微器件或其部分。 当复制品被转移时,这些结构也被转移到基底上,当复制品溶解时,这些结构保留在基底上。 这是一种技术,可用作互补过程或替代集成电路和其他微型器件制造中的各种光刻处理步骤。
    • 3. 发明授权
    • Replication and transfer of microstructures and nanostructures
    • 微结构和纳米结构的复制和转移
    • US07345002B2
    • 2008-03-18
    • US10974302
    • 2004-10-27
    • Charles Daniel Schaper
    • Charles Daniel Schaper
    • H01L21/31H01L21/469
    • B81C1/0046B29C33/52B82Y10/00B82Y40/00G03F7/0002G03F7/091Y10S438/942
    • A method for the duplication of microscopic patterns from a master to a substrate is disclosed, in which a replica of a topographic structure on a master is formed and transferred when needed onto a receiving substrate using one of a variety of printing or imprint techniques, and then dissolved. Additional processing steps can also be carried out using the replica before transfer, including the formation of nanostructures, microdevices, or portions thereof. These structures are then also transferred onto the substrate when the replica is transferred, and remain on the substrate when the replica is dissolved. This is a technique that can be applied as a complementary process or a replacement for various lithographic processing steps in the fabrication of integrated circuits and other microdevices.
    • 公开了一种用于从主机到基板的微观图案的复制的方法,其中主体上的形貌结构的复制品在需要时被形成并且使用各种印刷或印记技术之一转印到接收基板上,以及 然后溶解。 另外的处理步骤也可以在转移之前使用复制品进行,包括形成纳米结构,微器件或其部分。 当复制品被转移时,这些结构也被转移到基底上,当复制品溶解时,这些结构保留在基底上。 这是一种技术,可用作互补过程或替代集成电路和其他微型器件制造中的各种光刻处理步骤。
    • 4. 发明授权
    • Replication and transfer of microstructures and nanostructures
    • 微结构和纳米结构的复制和转移
    • US07981814B2
    • 2011-07-19
    • US11848669
    • 2007-08-31
    • Charles Daniel Schaper
    • Charles Daniel Schaper
    • H01L21/31H01L21/469
    • B81C1/0046B29C33/52B82Y10/00B82Y40/00G03F7/0002G03F7/091Y10S438/942
    • A method for the duplication of microscopic patterns from a master to a substrate is disclosed, in which a replica of a topographic structure on a master is formed and transferred when needed onto a receiving substrate using one of a variety of printing or imprint techniques, and then dissolved. Additional processing steps can also be carried out using the replica before transfer, including the formation of nanostructures, microdevices, or portions thereof. These structures are then also transferred onto the substrate when the replica is transferred, and remain on the substrate when the replica is dissolved. This is a technique that can be applied as a complementary process or a replacement for various lithographic processing steps in the fabrication of integrated circuits and other microdevices.
    • 公开了一种用于从主机到基板的微观图案的复制的方法,其中主体上的形貌结构的复制品在需要时被形成并且使用各种印刷或印记技术之一转印到接收基板上,以及 然后溶解。 另外的处理步骤也可以在转移之前使用复制品进行,包括形成纳米结构,微器件或其部分。 当复制品被转移时,这些结构也被转移到基底上,当复制品溶解时,这些结构保留在基底上。 这是一种技术,可用作互补过程或替代集成电路和其他微型器件制造中的各种光刻处理步骤。
    • 5. 发明授权
    • Replication and transfer of microstructures and nanostructures
    • 微结构和纳米结构的复制和转移
    • US06849558B2
    • 2005-02-01
    • US10246379
    • 2002-09-17
    • Charles Daniel Schaper
    • Charles Daniel Schaper
    • B81C1/00B82B3/00G03F7/00G03F7/09H01L21/027H01L21/31H01L21/469
    • B81C1/0046B29C33/52B82Y10/00B82Y40/00G03F7/0002G03F7/091Y10S438/942
    • A method for the duplication of microscopic patterns from a master to a substrate is disclosed, in which a replica of a topographic structure on a master is formed and transferred when needed onto a receiving substrate using one of a variety of printing or imprint techniques, and then dissolved. Additional processing steps can also be carried out using the replica before transfer, including the formation of nanostructures, microdevices, or portions thereof. These structures are then also transferred onto the substrate when the replica is transferred, and remain on the substrate when the replica is dissolved. This is a technique that can be applied as a complementary process or a replacement for various lithographic processing steps in the fabrication of integrated circuits and other microdevices.
    • 公开了一种用于从主机到基板的微观图案的复制的方法,其中主体上的形貌结构的复制品在需要时被形成并且使用各种印刷或印记技术之一转印到接收基板上,以及 然后溶解。 另外的处理步骤也可以在转移之前使用复制品进行,包括形成纳米结构,微器件或其部分。 当复制品被转移时,这些结构也被转移到基底上,当复制品溶解时,这些结构保留在基底上。 这是一种技术,可用作互补过程或替代集成电路和其他微型器件制造中的各种光刻处理步骤。