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    • 1. 发明授权
    • Integrated circuit test vehicle
    • 集成电路测试车
    • US06534968B1
    • 2003-03-18
    • US09928071
    • 2001-08-10
    • Leah M. MillerAnand GovindZafer KutluChao-Wen ChungAritharan Thurairajaratnam
    • Leah M. MillerAnand GovindZafer KutluChao-Wen ChungAritharan Thurairajaratnam
    • G01R3100
    • G01R31/04G01R31/2853G01R31/31716H05K1/0268H05K3/3436
    • An apparatus for detecting failures in electrical connections between an integrated circuit package substrate and a circuit board. The substrate has substrate electrical contacts that are electrically connected one to another in first sets in a first region of the substrate. The circuit board has circuit board electrical contacts that are electrically connected one to another in second sets in a second region of the circuit board. The substrate electrical contacts align with and make electrical contact with the circuit board electrical contacts. The first region of the substrate aligns with the second region of the circuit board when the substrate electrical contacts make electrical contact with the circuit board electrical contacts. The first sets of substrate electrical contacts form chains of electrical contacts with the second sets of circuit board electrical contacts. The chains of electrical contacts loop back and forth electrically between the substrate and the circuit board.
    • 一种用于检测集成电路封装衬底和电路板之间的电连接故障的装置。 衬底具有在衬底的第一区域中的第一组中彼此电连接的衬底电触点。 电路板具有在电路板的第二区域中在第二组中彼此电连接的电路板电触点。 基板电触点与电路板电触点对齐并与之电接触。 当基板电触头与电路板电触点电接触时,基板的第一区域与电路板的第二区域对齐。 第一组基板电触点与第二组电路板电触点形成电触点链。 电触头链在基板和电路板之间电连接。