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1. 发明申请

US20090027752A1 PROJECTION DISPLAY APPARATUS FOR REMOVING NOISE 审中-公开
标题翻译：用于移除噪声的投影显示装置
公开(公告)号：US20090027752A1
公开(公告)日：2009-01-29
申请号：US12111881
申请日：2008-04-29
申请人： Chang-Su Park , Dong-Hyun Park , Yeong-Gyu Lee , Jong-Hyeong Song , Heung-Woo Park
发明人： Chang-Su Park , Dong-Hyun Park , Yeong-Gyu Lee , Jong-Hyeong Song , Heung-Woo Park
IPC分类号： G02B26/00 , G02B27/00
CPC分类号： H04N9/315 , H04N9/3141
摘要： A projection type of display apparatus for removing a noise is disclosed. In accordance with an embodiment of the present invention, the projection type of display apparatus includes: a light source; an optical board, incidenting a beam of light emitted from the light source; and an optical modulator, being fixed on one surface of the optical board and modulating and emitting the beam of light that passed through the optical board. The blocking layer is formed on the optical board. With the present invention, it is possible to remove the noise of the image and display the image more clearly by enhancing the contrast.
摘要翻译：公开了一种用于去除噪声的投影型显示装置。根据本发明的实施例，显示装置的投影类型包括：光源; 入射从光源发出的光束的光学板; 以及光调制器，其被固定在所述光学板的一个表面上并且调制和发射通过所述光学板的光束。阻挡层形成在光学板上。利用本发明，可以通过增强对比度来消除图像的噪声并且更清晰地显示图像。

2. 发明授权

US07394139B2 Optical modulator module package using flip-chip mounting technology 有权
标题翻译：光调制器模块封装采用倒装芯片安装技术
公开(公告)号：US07394139B2
公开(公告)日：2008-07-01
申请号：US11347187
申请日：2006-02-03
申请人： Heung Woo Park , Yeong Gyu Lee , Suk Kee Hong , Chang Su Park , Ohk Kun Lim
发明人： Heung Woo Park , Yeong Gyu Lee , Suk Kee Hong , Chang Su Park , Ohk Kun Lim
IPC分类号： H01L27/14 , H01L31/00
CPC分类号： G02B26/0833 , G03H2225/24 , H01L2224/05001 , H01L2224/05023 , H01L2224/051 , H01L2224/05553 , H01L2224/05568 , H01L2224/056 , H01L2224/16 , H01L2224/48091 , H01L2224/48463 , H01L2924/1461 , H01L2924/00014
摘要： Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.
摘要翻译：本文公开了一种使用倒装芯片安装技术的光调制器模块封装，其中使用倒装芯片安装技术将光调制器装置气密地安装。光调制器装置被保护免受外部环境的影响，容易将电信号传输到外部，并且希望保持光调制器件的光学特性。

3. 发明授权

US07227267B2 Semiconductor package using flip-chip mounting technique 失效
标题翻译：半导体封装采用倒装芯片安装技术
公开(公告)号：US07227267B2
公开(公告)日：2007-06-05
申请号：US11245413
申请日：2005-10-06
申请人： Yeong Gyu Lee , Jong Hyeong Song , Sang Kyeong Yun , Heung Woo Park , Chang Su Park
发明人： Yeong Gyu Lee , Jong Hyeong Song , Sang Kyeong Yun , Heung Woo Park , Chang Su Park
IPC分类号： H01L23/48
CPC分类号： H05K3/323 , B81B2207/093 , B81C1/00301 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29399 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73265 , H01L2224/811 , H01L2224/81191 , H01L2224/81855 , H01L2224/83101 , H01L2224/83136 , H01L2224/838 , H01L2224/83851 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/1461 , H05K3/321 , H05K2201/10674 , H01L2924/00 , H01L2924/3512 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.
摘要翻译：公开了使用倒装芯片安装技术的半导体封装。半导体封装包括：半导体器件，其设置有从半导体器件延伸的多个第一焊盘; 衬底，其设置有与所述半导体器件的所述第一焊盘的位置对准的位置处从所述衬底延伸的多个第二焊盘; 以及插入在所述多个第一焊盘和所述多个第二焊盘之间的各向异性导电材料，以将所述第一焊盘电连接到相关联的第二焊盘，所述各向异性导电材料定位在所述半导体器件周围的离散位置处，从而在半导体器件和衬底。

4. 发明申请

US20070047879A1 Optical modulator module package 失效
标题翻译：光调制器模块封装
公开(公告)号：US20070047879A1
公开(公告)日：2007-03-01
申请号：US11503507
申请日：2006-08-11
申请人： Heung-Woo Park , Chang-Su Park
发明人： Heung-Woo Park , Chang-Su Park
IPC分类号： G02B6/36
CPC分类号： G02B26/0808
摘要： An optical modulator module package includes a substrate having a through-hole through which light passes and having a circuit formed on at least one of its inner and outer surfaces; a transparent lid held in the through-hole for transmitting incident light inputted to an optical modulator element and diffracted light emitted from the optical modulator element; and a metal connection part attached to a surface of the substrate for mounting the optical modulator element and driver integrated circuits. With an optical modulator module package according to embodiments of the present disclosure, the size of the module package may be minimized, as a transparent lid installed with a displacement from the optical modulator element is embedded within the substrate.
摘要翻译：一种光调制器模块封装，包括具有光通过的通孔的衬底，并具有形成在其内表面和外表面中的至少一个上的电路; 保持在所述通孔中的透明盖，用于透射输入到光调制元件的入射光和从所述光调制元件发出的衍射光; 以及附接到所述基板的表面以安装所述光调制器元件和所述驱动器集成电路的金属连接部。利用根据本公开的实施例的光调制器模块封装，可以最小化模块封装的尺寸，因为安装有来自光调制器元件的位移的透明盖被嵌入在基板内。

5. 发明申请

US20060078247A1 Package structure for optical modulator 审中-公开
标题翻译：光调制器的封装结构
公开(公告)号：US20060078247A1
公开(公告)日：2006-04-13
申请号：US11244563
申请日：2005-10-06
申请人： Yeong Gyu Lee , Jong Hyeong Song , Heung Woo Park , Suk Kee Hong , Chang Su Park , Ohk Kun Lim
发明人： Yeong Gyu Lee , Jong Hyeong Song , Heung Woo Park , Suk Kee Hong , Chang Su Park , Ohk Kun Lim
IPC分类号： G02B6/12
CPC分类号： G02B6/4232
摘要： Disclosed herein is a package structure for an optical modulator, which is configured such that an optical modulating device and electronic control circuitry are incorporated into a module, thus allowing the manufacture of a compact module while maintaining the optical properties of the optical modulating device.
摘要翻译：这里公开了一种用于光学调制器的封装结构，其被配置为使得光学调制装置和电子控制电路并入模块中，从而允许制造紧凑的模块，同时保持光学调制装置的光学特性。

6. 发明申请

US20070092179A1 MEMS module package 审中-公开
标题翻译： MEMS模块封装
公开(公告)号：US20070092179A1
公开(公告)日：2007-04-26
申请号：US11546696
申请日：2006-10-11
申请人： Heung-Woo Park , Yeong-Gyu Lee , Chang-Su Park , Ohk-Kun Lim , Dong-Hyun Park
发明人： Heung-Woo Park , Yeong-Gyu Lee , Chang-Su Park , Ohk-Kun Lim , Dong-Hyun Park
IPC分类号： G02B6/12
CPC分类号： G02B26/0808 , G02B6/3516 , G02B6/3578 , G02B6/3582 , G02B6/3584 , G02B26/0858 , H01L2224/48091 , H01L2924/00014
摘要： The present invention relates to a MEMS package, and in particular, to the structure of a MEMS package. One aspect of the invention provides an optical modulator module package comprising a substrate, an optical modulator positioned on the substrate which modulates an optical signal and transmits the optical signal through the substrate, a driver IC (driver integrated circuit) mounted adjacent to the optical modulator which operates the optical modulator, circuit wiring formed on the substrate and configured which transfers signals for operating the optical modulator, and a printed circuit board positioned facing the substrate on the optical modulator and the driver IC for signal connection with an external circuit. With a MEMS module package according to an aspect of the invention, the overall size can be reduced by providing a different form of layer composition.
摘要翻译：本发明涉及一种MEMS封装，特别涉及一种MEMS封装的结构。本发明的一个方面提供了一种光调制器模块封装，其包括衬底，位于衬底上的光调制器，其调制光信号并透过衬底传输光信号;驱动器IC（驱动器集成电路），安装在光调制器其操作光学调制器，形成在基板上并被配置为传送用于操作光学调制器的信号的电路布线，以及面向光调制器上的基板的布置电路板和用于与外部电路信号连接的驱动器IC。利用根据本发明的一个方面的MEMS模块封装，通过提供不同形式的层组成可以减小总体尺寸。

7. 发明申请

US20150114425A1 ROTATIONAL HAIR STYLING DEVICE FOR EASILY MAKING SPIRAL CURLS 审中-公开
标题翻译：旋转头发修饰设备，用于轻松制作螺旋曲柄
公开(公告)号：US20150114425A1
公开(公告)日：2015-04-30
申请号：US14201921
申请日：2014-03-09
申请人： Chang Su Park
发明人： Chang Su PARK
IPC分类号： A45D1/04 , A45D2/36
CPC分类号： A45D1/04 , A45D2/367 , A45D2001/004
摘要： Disclosed therein is a rotational hair styling device for easily making spiral curls including: an upper case being elongated; a lower case rotatably hinge-coupled with a hinge part of the upper case; a heating member of a bar shape horizontally located in the winding space part; a driving motor embedded in the lower case collinearly with the heating member; and a winder member connected to a driving gear of the driving motor and rotated forwardly and reversely around the heating member inside the heating space part for spirally winding the hair.
摘要翻译：其中公开了一种用于容易制造螺旋卷曲的旋转头发定型装置，包括：上壳体伸长; 与上壳体的铰链部分可旋转地铰接的下壳体; 水平位于所述卷绕空间部分中的条形加热构件; 与所述加热构件共线地嵌入所述下壳体中的驱动马达; 以及连接到驱动电动机的驱动齿轮并且在加热空间部分内的加热构件的前后反向旋转的卷绕构件，用于螺旋地缠绕头发。

8. 发明申请

US20070080704A1 Semi-conductor chip package capable of detecting open and short 失效
标题翻译：半导体芯片封装，能够检测开路和短路
公开(公告)号：US20070080704A1
公开(公告)日：2007-04-12
申请号：US11546594
申请日：2006-10-11
申请人： Chang-Su Park , Heung-Woo Park
发明人： Chang-Su Park , Heung-Woo Park
IPC分类号： G01R31/26
CPC分类号： G01R31/2853 , G01R31/2884 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip package capable of detecting an open and a short is disclosed, comprising: a first pad group comprising a plurality of first substrate pad sub groups, formed on a substrate, each composed of first substrate pads electrically connected, and insulated from each other, and a plurality of first element pad sub groups formed on an element and composed of first element pads electrically connected such that each first substrate pad sub group is electrically connected through the first element pads corresponding to the first substrate pads; a second pad group electrically insulated from the first pad group when the element is connected to the substrate, and comprising a plurality of second substrate pad sub groups formed on the substrate, composed of second substrate pads electrically connected, and insulated from each other, and a plurality of second element pad sub groups formed on the element, and composed of second element pads electrically connected such that each second substrate pad sub group is electrically connected through the second element pads corresponding to the second substrate pads; a plurality of first measuring pads electrically connected with the first pad group; and a plurality of second measuring pads electrically connected with the second pad group, wherein an open between the pads is detected by checking a connected state between the first or second measuring pads, and a short between the pads by checking a connected state between the first and second measuring pads.
摘要翻译：公开了一种能够检测开路和短路的半导体芯片封装，包括：第一焊盘组，包括形成在基板上的多个第一衬底焊盘子组，每个由彼此电连接并彼此绝缘的第一衬底焊盘组成以及形成在元件上并由电连接的第一元件焊盘构成的多个第一元件焊盘子组，使得每个第一衬底焊盘子组通过与第一衬底焊盘对应的第一元件焊盘电连接; 当所述元件连接到所述衬底时，与所述第一衬垫组电绝缘的第二衬垫组，并且包括形成在所述衬底上的多个第二衬底焊盘子组，所述第二衬底焊盘子组由彼此电连接并彼此绝缘的第二衬底焊盘组成，以及形成在所述元件上的多个第二元件焊盘子组，并且由电连接的第二元件焊盘组成，使得每个第二衬底焊盘子组通过对应于第二衬底焊盘的第二元件焊盘电连接; 与所述第一焊盘组电连接的多个第一测量焊盘; 以及与第二焊盘组电连接的多个第二测量垫，其中通过检查第一或第二测量焊盘之间的连接状态以及焊盘之间的短路来检测焊盘之间的打开，通过检查第一焊盘之间的连接状态和第二测量垫。

9. 发明授权

US07529013B2 Optical modulator module package 失效
标题翻译：光调制器模块封装
公开(公告)号：US07529013B2
公开(公告)日：2009-05-05
申请号：US11503507
申请日：2006-08-11
申请人： Heung-Woo Park , Chang-Su Park
发明人： Heung-Woo Park , Chang-Su Park
IPC分类号： G02F1/00 , H01L23/02
CPC分类号： G02B26/0808
摘要： An optical modulator module package includes a substrate having a through-hole through which light passes and having a circuit formed on at least one of its inner and outer surfaces; a transparent lid held in the through-hole for transmitting incident light inputted to an optical modulator element and diffracted light emitted from the optical modulator element; and a metal connection part attached to a surface of the substrate for mounting the optical modulator element and driver integrated circuits. With an optical modulator module package according to embodiments of the present disclosure, the size of the module package may be minimized, as a transparent lid installed with a displacement from the optical modulator element is embedded within the substrate.
摘要翻译：一种光调制器模块封装，包括具有光通过的通孔的衬底，并具有形成在其内表面和外表面中的至少一个上的电路; 保持在所述通孔中的透明盖，用于透射输入到光调制元件的入射光和从所述光调制元件发出的衍射光; 以及附接到所述基板的表面以安装所述光调制器元件和所述驱动器集成电路的金属连接部。利用根据本公开的实施例的光调制器模块封装，可以最小化模块封装的尺寸，因为安装有来自光调制器元件的位移的透明盖被嵌入在基板内。

10. 发明申请

US20080158649A1 OPTICAL MODULATOR MODULE PACKAGE 审中-公开
标题翻译：光学调制器模块封装
公开(公告)号：US20080158649A1
公开(公告)日：2008-07-03
申请号：US11957107
申请日：2007-12-14
申请人： Heung-Woo Park , Tae-Won Lee , Sang-Kyeong Yun , Chang-Su Park , Victor Yurlov , Jong-Hyeong Song
发明人： Heung-Woo Park , Tae-Won Lee , Sang-Kyeong Yun , Chang-Su Park , Victor Yurlov , Jong-Hyeong Song
IPC分类号： G02B26/02
CPC分类号： G02B26/0808
摘要： The present invention relates to a MEMS package, more specifically to an optical module package. According to an aspect of the present invention, the optical modulator module package includes an optical modulator, emitting a beam of light, which is modulated by diffracting and interfering the beam of light by an upwardly and downwardly spaced distance of a mirror, the beam of light being incident from a light source; a driver IC, mounted on the surrounding of the optical modulator to drive the optical modulator; and a noise removing member, intercepting a beam of light, which is not incident to a mirror area of the light modulator, of the incident beams of light.
摘要翻译：本发明涉及一种MEMS封装，更具体地说涉及一种光学模块封装。根据本发明的一个方面，光调制器模块封装包括光调制器，其发射光束，该光束通过镜的向上和向下间隔的距离衍射和干扰光束而被调制，来自光源的光; 驱动器IC，安装在光调制器的周围以驱动光调制器; 以及噪声去除构件，其遮挡不入射到光调制器的镜面区域的入射光束的光束。

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