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1. 发明申请

US20140057434A1 THROUGH SILICON VIA PROCESS 有权
标题翻译：通过硅工艺
公开(公告)号：US20140057434A1
公开(公告)日：2014-02-27
申请号：US13593517
申请日：2012-08-24
申请人： Jia-Jia Chen , Chi-Mao Hsu , Tsun-Min Cheng , Ching-Wei Hsu , Szu-Hao Lai , Huei-Ru Tsai , Tsai-Yu Wen , Ching-Li Yang , Chien-Li Kuo
发明人： Jia-Jia Chen , Chi-Mao Hsu , Tsun-Min Cheng , Ching-Wei Hsu , Szu-Hao Lai , Huei-Ru Tsai , Tsai-Yu Wen , Ching-Li Yang , Chien-Li Kuo
IPC分类号： H01L21/768
CPC分类号： H01L21/76898 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： A through silicon via process includes the following steps. A substrate having a front side and a back side is provided. A passivation layer is formed on the back side of the substrate. An oxide layer is formed on the passivation layer.
摘要翻译：硅通孔工艺包括以下步骤。提供具有正面和背面的基板。在基板的背面形成钝化层。在钝化层上形成氧化物层。

2. 发明授权

US08254145B2 Electronic device with expansion card modules 失效
标题翻译：带扩展卡模块的电子设备
公开(公告)号：US08254145B2
公开(公告)日：2012-08-28
申请号：US12698997
申请日：2010-02-02
申请人： Chung-Cheng Hsieh , Ching-Wei Hsu , Li-Ping Chen
发明人： Chung-Cheng Hsieh , Ching-Wei Hsu , Li-Ping Chen
IPC分类号： H05K7/02 , H05K7/04
CPC分类号： G06F1/185
摘要： An electronic device includes a chassis having a bottom wall, a rear wall, and a sidewall perpendicular to each other. A motherboard is secured on the chassis bottom wall. A first socket is disposed on the motherboard. A mounting bracket is secured in the chassis above the motherboard. The mounting bracket includes a first mounting wall and a second mounting wall. The first mounting wall is parallel to and spaced from the sidewall of the chassis, and the second mounting wall is parallel to and spaced from the rear wall. A first riser card is coupled to the first socket on the motherboard, and is secured to the first mounting wall of the mounting bracket. An expansion card module is accommodated in the mounting bracket and parallel to the bottom wall of the chassis.
摘要翻译：电子设备包括具有底壁，后壁和彼此垂直的侧壁的底架。主板固定在机箱底壁上。第一个插座设置在主板上。安装支架固定在主板上方的机箱中。安装支架包括第一安装壁和第二安装壁。第一安装壁平行于底盘的侧壁并与其间隔开，并且第二安装壁平行于后壁并与其隔开。第一转接卡耦合到母板上的第一插座，并且固定到安装支架的第一安装壁上。扩展卡模块容纳在安装支架中并平行于底盘的底壁。

3. 发明申请

US20110116229A1 ELECTRONIC DEVICE WITH EXPANSION CARD MODULES 失效
标题翻译：具有扩展卡模块的电子设备
公开(公告)号：US20110116229A1
公开(公告)日：2011-05-19
申请号：US12698997
申请日：2010-02-02
申请人： Chung-Cheng Hsieh , Ching-Wei Hsu , Li-Ping Chen
发明人： Chung-Cheng Hsieh , Ching-Wei Hsu , Li-Ping Chen
IPC分类号： H05K7/00
CPC分类号： G06F1/185
摘要： An electronic device includes a chassis having a bottom wall, a rear wall, and a sidewall perpendicular to each other. A motherboard is secured on the chassis bottom wall. A first socket is disposed on the motherboard. A mounting bracket is secured in the chassis above the motherboard. The mounting bracket includes a first mounting wall and a second mounting wall. The first mounting wall is parallel to and spaced from the sidewall of the chassis, and the second mounting wall is parallel to and spaced from the rear wall. A first riser card is coupled to the first socket on the motherboard, and is secured to the first mounting wall of the mounting bracket. An expansion card module is accommodated in the mounting bracket and parallel to the bottom wall of the chassis.
摘要翻译：电子设备包括具有底壁，后壁和彼此垂直的侧壁的底架。主板固定在机箱底壁上。第一个插座设置在主板上。安装支架固定在主板上方的机箱中。安装支架包括第一安装壁和第二安装壁。第一安装壁平行于底盘的侧壁并与其间隔开，第二安装壁平行于后壁并与其隔开。第一转接卡耦合到母板上的第一插座，并且固定到安装支架的第一安装壁上。扩展卡模块容纳在安装支架中并平行于底盘的底壁。

4. 发明申请

US20110116227A1 COMPUTER SYSTEM WITH HEAT SINK 失效
标题翻译：具有散热功能的计算机系统
公开(公告)号：US20110116227A1
公开(公告)日：2011-05-19
申请号：US12715649
申请日：2010-03-02
申请人： Chung-Cheng Hsieh , Ching-Wei Hsu , Li-Ping Chen
发明人： Chung-Cheng Hsieh , Ching-Wei Hsu , Li-Ping Chen
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20
摘要： A computer system includes a chassis, a motherboard, an isolation component, and a block. The chassis includes a bottom wall, and a sidewall connected to the bottom wall. The motherboard is secured to the chassis. A heat sink is secured to the motherboard for cooling a chip mounted on the motherboard. An isolation component is secured to the chassis between the bottom wall and the motherboard. The isolation component includes a bent piece attached to the side wall and positioned between the heat sink and the sidewall. A distance is defined between the bent piece and the heat sink. The block is attached to the bent piece and positioned between the heat sink and the sidewall to span the distance.
摘要翻译：计算机系统包括底盘，主板，隔离组件和块。底盘包括底壁和连接到底壁的侧壁。主板固定在机箱上。将散热器固定到母板上以冷却安装在母板上的芯片。隔离部件在底壁和母板之间固定到底盘上。隔离部件包括附接到侧壁并且定位在散热器和侧壁之间的弯曲件。在弯曲部件和散热片之间限定一定距离。该块被附接到弯曲的部件并且位于散热器和侧壁之间以跨越距离。

5. 发明申请

US20130320537A1 THROUGH SILICON VIA (TSV) STRUCTURE AND PROCESS THEREOF 有权
标题翻译：通过硅（TSV）的结构和过程
公开(公告)号：US20130320537A1
公开(公告)日：2013-12-05
申请号：US13483074
申请日：2012-05-30
申请人： Jia-Jia Chen , Chi-Mao Hsu , Tsun-Min Cheng , Chun-Ling Lin , Huei-Ru Tsai , Ching-Wei Hsu , Chin-Fu Lin , Hsin-Yu Chen
发明人： Jia-Jia Chen , Chi-Mao Hsu , Tsun-Min Cheng , Chun-Ling Lin , Huei-Ru Tsai , Ching-Wei Hsu , Chin-Fu Lin , Hsin-Yu Chen
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L21/76847 , H01L21/76898 , H01L2924/0002 , H01L2924/00
摘要： A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.
摘要翻译：硅通孔结构位于衬底的凹槽中。贯通硅通孔结构包括阻挡层，缓冲层和导电层。阻挡层覆盖凹部的表面。缓冲层覆盖阻挡层。导电层位于缓冲层上并填充凹槽，其中导电层和缓冲层之间的接触表面比缓冲层和阻挡层之间的接触表面更平滑。此外，还提供了形成所述贯穿硅通孔结构的通硅通孔工艺。

6. 发明申请

US20110110056A1 MOUNTING APPARATUS FOR PCI CARD 失效
标题翻译： PCI卡安装设备
公开(公告)号：US20110110056A1
公开(公告)日：2011-05-12
申请号：US12713280
申请日：2010-02-26
申请人： CHUNG-CHENG HSIEH , CHING-WEI HSU , LI-PING CHEN
发明人： CHUNG-CHENG HSIEH , CHING-WEI HSU , LI-PING CHEN
IPC分类号： H05K7/14
CPC分类号： G06F1/185
摘要： A mounting apparatus for a PCI card includes a mounting bracket, a mounting piece for attaching the PCI card to the mounting bracket, and a securing member. The mounting bracket has a base and a blocking plate bent from the base. The mounting piece includes an elongated body and a mounting end bent from the elongated body. The elongated body adjoins the base and the mounting end abuts on the blocking plate. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion extending from the pivoting portion, and a securing portion extending from the pressing portion. The pressing portion elastically abuts against the mounting end, thereby sandwiching the mounting end between the blocking plate and the pressing portion. The securing portion is for driving the pressing portion to move away from the mounting end by handling the securing portion.
摘要翻译：用于PCI卡的安装装置包括安装支架，用于将PCI卡连接到安装支架的安装件和固定件。安装支架具有基座和从基座弯曲的阻挡板。安装件包括细长主体和从细长主体弯曲的安装端。细长体与基座相邻，安装端邻接阻挡板。固定构件包括可枢转地附接到安装支架的第一枢转部分，从枢转部分延伸的按压部分和从按压部分延伸的固定部分。按压部分弹性地抵靠安装端，从而将安装端夹在阻挡板和按压部分之间。固定部分用于通过处理固定部分来驱动按压部分远离安装端移动。

7. 发明申请

US20110110033A1 MOUNTING APPARATUS FOR PCI CARD 有权
标题翻译： PCI卡安装设备
公开(公告)号：US20110110033A1
公开(公告)日：2011-05-12
申请号：US12730358
申请日：2010-03-24
申请人： CHUNG-CHENG HSIEH , LI-PING CHEN , CHING-WEI HSU
发明人： CHUNG-CHENG HSIEH , LI-PING CHEN , CHING-WEI HSU
IPC分类号： G06F1/16
CPC分类号： G06F1/185 , Y10T16/5474
摘要： A mounting apparatus includes a mounting bracket, a mounting piece adapted to mount a PCI card to the mounting bracket, and a securing member. The mounting bracket includes a base and a blocking plate. The mounting piece includes an elongated body and a mounting end. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion, and a mounting portion. The mounting portion includes a securing portion. The securing portion includes a handling portion and a second engaging portion extending from the handling portion. The second engaging portion engages the first engaging portion. The handling portion is configured to drive the second engaging portion to disengage the first engaging portion by pressing the handling portion.
摘要翻译：安装装置包括安装支架，适于将PCI卡安装到安装支架的安装件和固定构件。安装支架包括底座和挡板。安装件包括细长主体和安装端。固定构件包括可枢转地附接到安装支架的第一枢转部分，按压部分和安装部分。安装部分包括固定部分。固定部分包括处理部分和从处理部分延伸的第二啮合部分。第二接合部接合第一接合部。处理部构造成驱动第二卡合部，通过按压搬运部来使第一卡合部脱离。

8. 发明授权

US09012324B2 Through silicon via process 有权
标题翻译：通过硅经过工艺
公开(公告)号：US09012324B2
公开(公告)日：2015-04-21
申请号：US13593517
申请日：2012-08-24
申请人： Jia-Jia Chen , Chi-Mao Hsu , Tsun-Min Cheng , Ching-Wei Hsu , Szu-Hao Lai , Huei-Ru Tsai , Tsai-Yu Wen , Ching-Li Yang , Chien-Li Kuo
发明人： Jia-Jia Chen , Chi-Mao Hsu , Tsun-Min Cheng , Ching-Wei Hsu , Szu-Hao Lai , Huei-Ru Tsai , Tsai-Yu Wen , Ching-Li Yang , Chien-Li Kuo
IPC分类号： H01L21/768 , H01L23/48
CPC分类号： H01L21/76898 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： A through silicon via process includes the following steps. A substrate having a front side and a back side is provided. A passivation layer is formed on the back side of the substrate. An oxide layer is formed on the passivation layer.
摘要翻译：硅通孔工艺包括以下步骤。提供具有正面和背面的基板。在基板的背面形成钝化层。在钝化层上形成氧化物层。

9. 发明授权

US09136170B2 Through silicon via (TSV) structure and process thereof 有权
标题翻译：通过硅通孔（TSV）结构及其工艺
公开(公告)号：US09136170B2
公开(公告)日：2015-09-15
申请号：US13483074
申请日：2012-05-30
申请人： Jia-Jia Chen , Chi-Mao Hsu , Tsun-Min Cheng , Chun-Ling Lin , Huei-Ru Tsai , Ching-Wei Hsu , Chin-Fu Lin , Hsin-Yu Chen
发明人： Jia-Jia Chen , Chi-Mao Hsu , Tsun-Min Cheng , Chun-Ling Lin , Huei-Ru Tsai , Ching-Wei Hsu , Chin-Fu Lin , Hsin-Yu Chen
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L21/76847 , H01L21/76898 , H01L2924/0002 , H01L2924/00
摘要： A through silicon via structure is located in a recess of a substrate. The through silicon via structure includes a barrier layer, a buffer layer and a conductive layer. The barrier layer covers a surface of the recess. The buffer layer covers the barrier layer. The conductive layer is located on the buffer layer and fills the recess, wherein the contact surface between the conductive layer and the buffer layer is smoother than the contact surface between the buffer layer and the barrier layer. Moreover, a through silicon via process forming said through silicon via structure is also provided.
摘要翻译：硅通孔结构位于衬底的凹槽中。贯通硅通孔结构包括阻挡层，缓冲层和导电层。阻挡层覆盖凹部的表面。缓冲层覆盖阻挡层。导电层位于缓冲层上并填充凹槽，其中导电层和缓冲层之间的接触表面比缓冲层和阻挡层之间的接触表面更平滑。此外，还提供了形成所述贯穿硅通孔结构的通硅通孔工艺。

10. 发明授权

US08264831B2 Mounting apparatus for PCI card 有权
标题翻译： PCI卡安装装置
公开(公告)号：US08264831B2
公开(公告)日：2012-09-11
申请号：US12730358
申请日：2010-03-24
申请人： Chung-Cheng Hsieh , Li-Ping Chen , Ching-Wei Hsu
发明人： Chung-Cheng Hsieh , Li-Ping Chen , Ching-Wei Hsu
IPC分类号： H05H5/00 , H05K7/00 , H05K7/18 , H04M1/00
CPC分类号： G06F1/185 , Y10T16/5474
摘要： A mounting apparatus includes a mounting bracket, a mounting piece adapted to mount a PCI card to the mounting bracket, and a securing member. The mounting bracket includes a base and a blocking plate. The mounting piece includes an elongated body and a mounting end. The securing member includes a first pivoting portion pivotably attached to the mounting bracket, a pressing portion, and a mounting portion. The mounting portion includes a securing portion. The securing portion includes a handling portion and a second engaging portion extending from the handling portion. The second engaging portion engages the first engaging portion. The handling portion is configured to drive the second engaging portion to disengage the first engaging portion by pressing the handling portion.
摘要翻译：安装装置包括安装支架，适于将PCI卡安装到安装支架的安装件和固定构件。安装支架包括底座和挡板。安装件包括细长主体和安装端。固定构件包括可枢转地附接到安装支架的第一枢转部分，按压部分和安装部分。安装部分包括固定部分。固定部分包括处理部分和从处理部分延伸的第二啮合部分。第二接合部接合第一接合部。处理部构造成驱动第二卡合部，通过按压搬运部来使第一卡合部脱离。

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