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1. 发明申请

US20120175264A1 WAFER PRETREATMENT FOR COPPER ELECTROPLATING 审中-公开
标题翻译：铜电镀的预处理
公开(公告)号：US20120175264A1
公开(公告)日：2012-07-12
申请号：US13496251
申请日：2010-09-22
申请人： Chien-Hsun Lai , Shao-Min Yang , Tzu-Tsang Huang
发明人： Chien-Hsun Lai , Shao-Min Yang , Tzu-Tsang Huang
IPC分类号： C25D5/02 , C25D3/38
CPC分类号： C25D7/123 , C25D3/38 , C25D5/00 , H01L21/2885 , H01L21/76877 , H01L21/76898
摘要： The present invention is directed to a pretreatment process for copper electroplating of via or trench features on a wafer, comprising filling the via or trench feature with a pretreatment solution, wherein the pretreatment solution comprises copper ions.
摘要翻译：本发明涉及用于在晶片上通孔或沟槽特征的铜电镀的预处理工艺，包括用预处理溶液填充过孔或沟槽特征，其中预处理溶液包含铜离子。

2. 发明申请

US20090038165A1 Cutting Apparatus 审中-公开
标题翻译：切割设备
公开(公告)号：US20090038165A1
公开(公告)日：2009-02-12
申请号：US11834880
申请日：2007-08-07
申请人： Chien-Hsun Lai
发明人： Chien-Hsun Lai
IPC分类号： B26B29/06
CPC分类号： B26B17/00 , B26D3/162 , B26D3/169
摘要： A cutting apparatus includes a blade, a jaw pivotally connected to the blade, an anvil secured to the jaw, an angle-adjusting element pivotally connected to the anvil and at least one positioning device provided on the indicator. The anvil includes marks for indicating different angles at which a piece of work is to be cut by the blade and cutouts in the edge corresponding to the marks. The angle-adjusting element includes at least one indicator for pointing at one of the marks of the anvil. The positioning device is movable between a locking position in a selected one of the cutouts for locking the angle-adjusting element to the anvil and an unlocking position away from the cutouts for allowing the pivoting of the angle-adjusting element on the anvil.
摘要翻译：切割装置包括叶片，枢转地连接到叶片的爪，固定到颚的砧座，可枢转地连接到砧座的角度调节元件和设置在指示器上的至少一个定位装置。砧座包括用于指示不同角度的标记，在该角度处一个工件将被刀片切割，并且在对应于标记的边缘中的切口。角度调节元件包括用于指向砧座的标记之一的至少一个指示器。定位装置可在所选择的一个切口中的锁定位置之间移动，用于将角度调整元件锁定到砧座上，以及远离切口的解锁位置，以允许角度调节元件枢转在砧座上。

3. 发明申请

US20230132867A1 ADJUSTABLE SHADING MODULE 有权
公开(公告)号：US20230132867A1
公开(公告)日：2023-05-04
申请号：US17825731
申请日：2022-05-26
申请人： CHIEN-HSUN LAI
发明人： CHIEN-HSUN LAI
IPC分类号： G03B17/12 , H04N5/225
摘要： An adjustable shading module includes a base, an optical image capturing system, and at least one shading cover. The base has an optical mounting portion and a cover mounting portion that are integrally formed. The optical mounting portion has a chamber and a through-hole communicating with the chamber. The cover mounting portion is located on a side of the optical mounting portion. The optical image capturing system has an optical lens assembly disposed in the chamber and having an optical axis and at least two lenses arranged in order along the optical axis from an object side to an image side. The object side of the optical lens assembly faces the through-hole. The optical axis passes through the through-hole. The shading cover is disposed on the cover mounting portion and is movable on a moving path, which is not parallel to the optical axis, to close or open the through-hole.

4. 发明申请

US20120175744A1 COPPER ELECTROPLATING COMPOSITION 审中-公开
标题翻译：铜电镀组合物
公开(公告)号：US20120175744A1
公开(公告)日：2012-07-12
申请号：US13395041
申请日：2010-09-15
申请人： Chien-Hsun Lai , Tzu-Tsang Huang , Shao-Min Yang , ChiaoHao Chan
发明人： Chien-Hsun Lai , Tzu-Tsang Huang , Shao-Min Yang , ChiaoHao Chan
IPC分类号： H01L23/48 , C25D3/38
CPC分类号： C25D3/38 , C25D5/18
摘要： The present invention relates to a copper electroplating composition comprising a copper alkanesulfonate salt, a free alkanesulfonic acid, and one or more organic compounds selected from the group consisting of suppressors, accelerators, levelers, and mixtures thereof, in which the concentration of free acid is from 0 M to about 0.25 M and the composition is free of halide ions. The present invention also relates to a process of metalizing micro-sized trenches or vias in a substrate using the composition.
摘要翻译：本发明涉及一种铜电镀组合物，其包含烷基磺酸铜盐，游离烷基磺酸和一种或多种选自抑制剂，促进剂，均化剂及其混合物的有机化合物，其中游离酸的浓度为从0M至约0.25M，并且组合物不含卤离子。本发明还涉及使用该组合物使基底中的微尺寸沟槽或通孔金属化的方法。

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