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    • 1. 发明申请
    • BACKSIDE PHASE GRATING MASK AND METHOD FOR MANUFACTURING THE SAME
    • 背面相位掩模及其制造方法
    • US20100167182A1
    • 2010-07-01
    • US12493075
    • 2009-06-26
    • Sung Hyun OHByung Ho Nam
    • Sung Hyun OHByung Ho Nam
    • G03F1/00
    • G03F7/70158G03F1/50
    • A mask includes mask patterns formed over a frontside of a substrate and a phase grating formed over a backside of the substrate. The mask patterns correspond to a layout of diagonal patterns extending in a direction rotated toward a predetermined direction from an axis of a rectangular coordinate system. The phase grating extends in a direction parallel to the extending direction of the mask patterns. The phase grating includes first and second phase regions alternately arranged over the backside of the substrate with a phase difference of 180° therebetween. The first and second phase regions induce a phase interference that blocks a zero-order light of an exposure light incident to the substrate and allows a primary light to be incident to the mask patterns.
    • 掩模包括形成在衬底的前侧上的掩模图案和形成在衬底的背面上的相位光栅。 掩模图案对应于沿着从矩形坐标系的轴线朝向预定方向旋转的方向延伸的对角图案的布局。 相位光栅在与掩模图案的延伸方向平行的方向上延伸。 相位光栅包括交替布置在衬底背面上的相位差为180°的第一和第二相区域。 第一和第二相区域引起阻挡入射到衬底的曝光光的零级光并允许初级光入射到掩模图案的相位干涉。
    • 3. 发明授权
    • Semiconductor device having dummy pattern and the method for fabricating the same
    • 具有虚设图案的半导体器件及其制造方法
    • US08486822B2
    • 2013-07-16
    • US13018358
    • 2011-01-31
    • Byung Ho Nam
    • Byung Ho Nam
    • H01L21/4763
    • H01L21/76819H01L23/522H01L2924/0002Y10S438/926H01L2924/00
    • A method for fabricating a semiconductor device includes forming an interlayer dielectric film on a semiconductor substrate including a pattern region and a dummy region, forming a photoresist pattern on the interlayer dielectric film such that the pattern region and the dummy region are partially exposed, etching the interlayer dielectric film exposed through the photoresist pattern as an etching mask to form a contact hole and a dummy contact hole, filling the contact hole and the dummy contact hole with a conductive material to form a contact plug and a dummy plug, depositing a semiconductor layer on the contact plug and the dummy plug, and subjecting the semiconductor layer to patterning to form a semiconductor layer pattern and a dummy pattern.
    • 一种制造半导体器件的方法包括在包括图案区域和虚拟区域的半导体衬底上形成层间电介质膜,在层间电介质膜上形成光致抗蚀剂图案,使得图案区域和虚拟区域部分地暴露,蚀刻 层间绝缘膜通过光致抗蚀剂图案作为蚀刻掩模暴露以形成接触孔和虚拟接触孔,用导电材料填充接触孔和虚拟接触孔,以形成接触塞和虚拟插塞,沉积半导体层 在接触插塞和虚拟插头上,并对半导体层进行构图以形成半导体层图案和虚设图案。
    • 4. 发明授权
    • Method for detecting failure of database patterns of photo mask
    • 检测防伪数据库图案的方法
    • US07422830B2
    • 2008-09-09
    • US11084618
    • 2005-03-17
    • Byung Ho NamByoung Sub Nam
    • Byung Ho NamByoung Sub Nam
    • G03F1/00
    • G03F1/36
    • A method for detecting failure of database patterns of a photo mask including designing the database patterns of the photo mask according to a design rule of a semiconductor element; performing optical proximity correction (OPC) of the designed database patterns; and detecting failure of the database patterns by obtaining a plurality of bias values based on at least two space widths according to each of line critical dimensions (CDs) of the designed database patterns and by detecting the shape of the pattern having the optimum bias value. The method applies different space widths to the patterns according to critical dimensions of lines of the patterns of the photo mask to preliminarily detect patterning failure varied according to illuminating systems, sub-films, and thicknesses of resist, and to correct failure of the patterns, such as collapse or bridges of the patterns, generated from the different lengths of patterns lines having the same critical dimension, using different bias values.
    • 一种用于检测光掩模的数据库图案的故障的方法,包括根据半导体元件的设计规则设计光掩模的数据库图案; 执行所设计的数据库模式的光学邻近校正(OPC); 以及通过根据所设计的数据库模式的每个线性关键维度(CD),并且通过检测具有最佳偏好值的图案的形状,通过基于至少两个空间宽度获得多个偏置值来检测数据库模式的失败。 该方法根据光掩模的图案的线的临界尺寸对图案应用不同的空间宽度,以初步检测根据照射系统,子膜和抗蚀剂厚度而变化的图案化故障,并且校正图案的失败, 例如使用不同的偏置值从具有相同临界尺寸的不同长度的图案线产生的图案的折叠或桥接。
    • 5. 发明授权
    • Apparatus for aligning semiconductor wafer using mixed light with
different wavelengths
    • 使用不同波长的混合光对准半导体晶片的装置
    • US5859439A
    • 1999-01-12
    • US774680
    • 1996-12-26
    • Byung-Ho NamJae-Keun Jeong
    • Byung-Ho NamJae-Keun Jeong
    • G01B11/00G03F9/00H01L21/027G01N21/86
    • G03F9/70
    • An alignment system of a lithography apparatus which is capable of obtaining an alignment mark without being influenced the height of the alignment mark and the thickness of the photoresist, includes a plurality of light sources emitting a light having each different wavelength, a plurality of beam splitters which reflects some portion of light emitted from the light source and transmits other portion of light and combines the reflected light to emit, a spacial filter for transmitting a light incident through the beam splitter, a first lens for condensing the light transmitted through the spacial filter, a wafer stage on an upper surface of which the wafer having a plurality of alignment marks to diffract a beam incident from the first lens is mounted, a second lens for condensing the light diffracted from the alignment mark on the wafer, a diffraction grating for diffracting the direction of the beam condensed in the second lens, a light collecting device for collecting the light reflected in the diffraction grating and converting the light into an electrical signal, and a control unit from controlling the wafer stage in accordance with the signal applied from the light collecting device.
    • 能够获得对准标记而不影响对准标记的高度和光致抗蚀剂的厚度的光刻设备的对准系统包括发射具有不同波长的光的多个光源,多个分束器 其反射从光源发射的光的一部分并透射其他部分的光并组合反射光以发射用于透射通过分束器入射的光的空间滤光器,用于会聚透过空间滤光器的光的第一透镜 安装有用于衍射从第一透镜入射的光束的多个对准标记的晶片的上表面的晶片台,用于会聚从晶片上的对准标记衍射的光的第二透镜,用于 衍射在第二透镜中聚光的光束的方向,用于收集光反射的光收集装置 在衍射光栅中形成并将光转换成电信号,以及控制单元,根据从光收集装置施加的信号控制晶片台。
    • 9. 发明授权
    • Backside phase grating mask and method for manufacturing the same
    • 背面相位光栅掩模及其制造方法
    • US08021805B2
    • 2011-09-20
    • US12493075
    • 2009-06-26
    • Sung Hyun OhByung Ho Nam
    • Sung Hyun OhByung Ho Nam
    • G03F1/00G03C5/00
    • G03F7/70158G03F1/50
    • A mask includes mask patterns formed over a frontside of a substrate and a phase grating formed over a backside of the substrate. The mask patterns correspond to a layout of diagonal patterns extending in a direction rotated toward a predetermined direction from an axis of a rectangular coordinate system. The phase grating extends in a direction parallel to the extending direction of the mask patterns. The phase grating includes first and second phase regions alternately arranged over the backside of the substrate with a phase difference of 180° therebetween. The first and second phase regions induce a phase interference that blocks a zero-order light of an exposure light incident to the substrate and allows a primary light to be incident to the mask patterns.
    • 掩模包括形成在衬底的前侧上的掩模图案和形成在衬底的背面上的相位光栅。 掩模图案对应于沿着从矩形坐标系的轴线朝向预定方向旋转的方向延伸的对角图案的布局。 相位光栅在与掩模图案的延伸方向平行的方向上延伸。 相位光栅包括交替布置在衬底背面上的相位差为180°的第一和第二相区域。 第一和第二相区域引起阻挡入射到衬底的曝光光的零级光并允许初级光入射到掩模图案的相位干涉。
    • 10. 发明申请
    • Semiconductor Device Having Dummy Pattern and the Method for Fabricating the Same
    • 具有虚拟图案的半导体器件及其制造方法
    • US20110212619A1
    • 2011-09-01
    • US13018358
    • 2011-01-31
    • Byung Ho Nam
    • Byung Ho Nam
    • H01L21/283
    • H01L21/76819H01L23/522H01L2924/0002Y10S438/926H01L2924/00
    • A method for fabricating a semiconductor device includes forming an interlayer dielectric film on a semiconductor substrate including a pattern region and a dummy region, forming a photoresist pattern on the interlayer dielectric film such that the pattern region and the dummy region are partially exposed, etching the interlayer dielectric film exposed through the photoresist pattern as an etching mask to form a contact hole and a dummy contact hole, filling the contact hole and the dummy contact hole with a conductive material to form a contact plug and a dummy plug, depositing a semiconductor layer on the contact plug and the dummy plug, and subjecting the semiconductor layer to patterning to form a semiconductor layer pattern and a dummy pattern.
    • 一种制造半导体器件的方法包括在包括图案区域和虚拟区域的半导体衬底上形成层间电介质膜,在层间电介质膜上形成光致抗蚀剂图案,使得图案区域和虚拟区域部分地暴露,蚀刻 层间绝缘膜通过光致抗蚀剂图案作为蚀刻掩模暴露以形成接触孔和虚拟接触孔,用导电材料填充接触孔和虚拟接触孔,以形成接触塞和虚拟插塞,沉积半导体层 在接触插塞和虚拟插头上,并对半导体层进行构图以形成半导体层图案和虚设图案。