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    • 3. 发明申请
    • Semiconductor device manufacturing apparatus and method of using the same
    • 半导体装置的制造装置及其使用方法
    • US20070266946A1
    • 2007-11-22
    • US11593493
    • 2006-11-07
    • Byung-Chul Choi
    • Byung-Chul Choi
    • H05H1/24C23C16/00
    • C23C16/4405H01J37/32357H01J37/3244
    • A semiconductor device manufacturing apparatus and a method for use in the manufacturing of such devices minimize the amount of particles which accumulate in the process chamber of the apparatus and clean the interior of the process chamber with a high degree of effectiveness. The semiconductor device manufacturing apparatus has a showerhead located at an upper portion of the process chamber, a plate-like gas diffuser disposed in the showerhead, and both a fluid supply line and a plasma waveguide connected to the showerhead. After a substrate is processed in the process chamber using process gas delivered to the showerhead through the fluid supply line, plasma is supplied into the upper portion of the process chamber from a remote plasma reactor via the plasma waveguide.
    • 半导体器件制造装置和用于制造这种装置的方法使得积聚在装置的处理室中的颗粒的量最小化并以高效率清洁处理室的内部。 半导体器件制造装置具有位于处理室的上部的喷头,设置在喷头中的板状气体扩散器,以及连接到喷头的流体供给线和等离子体波导。 在使用通过流体供应管路输送到喷头的处理气体在处理室中处理基板之后,等离子体通过等离子体波导从远程等离子体反应器供应到处理室的上部。
    • 5. 发明申请
    • Chemical vapor deposition apparatus and chemical vapor deposition method using the same
    • 化学气相沉积装置及使用其的化学气相沉积方法
    • US20060121211A1
    • 2006-06-08
    • US11294429
    • 2005-12-06
    • Byung-Chul Choi
    • Byung-Chul Choi
    • C23C16/00H05H1/24
    • H01J37/3244C23C16/401C23C16/455C23C16/5096H01J37/32834
    • chemical vapor deposition (CVD) equipment and a CVD method using the same enhance production yield by preventing non-reacted gas from agglomerating on a substrate before the plasma reaction is induced. This source gas is composed of first and second gases. Only the first gas is initially supplied into the process chamber of the CVD equipment. Then the second source gas and the first source gas are supplied as a mixture but at this time are dumped to the exhaust section of the CVD equipment so as to bypass the process chamber. After a delay, the first source gas and the second source gas are supplied together as source gas into the process chamber and at this time, an RF power is applied to the source gas to induce the plasma reaction that forms a film on a wafer disposed inside the chamber. Thus, non-reacted gas is prevented from agglomerating on the substrate. As a result, the film has a high degree of uniformity.
    • 化学气相沉积(CVD)设备和使用该化学气相沉积(CVD)设备的CVD方法通过在引发等离子体反应之前防止未反应的气体聚集在基板上来提高生产率。 该源气体由第一和第二气体构成。 首先将气体首先供应到CVD设备的处理室中。 然后将第二源气体和第一源气体作为混合物供给,此时被倾倒到CVD设备的排气部分,以绕过处理室。 延迟后,将第一源气体和第二源气体作为源气体一起供入到处理室中,此时,将RF功率施加到源气体,以引起在设置的晶片上形成膜的等离子体反应 在房间里面 因此,防止未反应的气体在基板上附聚。 结果,膜具有高度的均匀性。