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    • 5. 发明授权
    • Method for forming an array of DRAM cells by employing a self-aligned adjacent node isolation technique
    • 通过采用自对准相邻节点隔离技术形成DRAM单元阵列的方法
    • US06440794B1
    • 2002-08-27
    • US09321922
    • 1999-05-28
    • Byeong Kim
    • Byeong Kim
    • H01C218242
    • H01L27/10867H01L21/76232
    • In a method for forming an array of dynamic random access memory (DRAM) cells, each DRAM cell having one or more field effect transistors (FETs) and a deep trench capacitor, first, a substrate is prepared. Line type active areas (AAs) are patterned on the substrate to thereby provide AA lines (AALs). Next, deep trench capacitors (DTCs) are fabricated in an AAL in a predetermined configuration to thereby define deep trench areas (DTAs) for the DTCs, each DTC having a storage node, a collar insulator and a buried strap. In subsequent step, a node isolation area (NIA) is defined to isolate a storage node of a DTC and a storage node of its adjacent DTC and then a trench isolation area (TIA) for each of the DRAM cell is defined. Further, one or more FETs are fabricated in each AA to thereby form the array of DRAM cells, wherein a conductive path is formed from an electrode of one of the FETs to the buried strap of a corresponding DTC. In accordance with the present invention, since the AAs can be formed before DTCs are formed, the so-called thermal budget problem can be solved or relaxed; the AAs can be patterned with a great ease since the AAs are patterned as a line type; and the overlay margin between each AA and a corresponding DTA in a DRAM cell can be improved by employing a maskless self-aligned adjacent node isolation technique.
    • 在形成动态随机存取存储器(DRAM)单元阵列的方法中,每个DRAM单元具有一个或多个场效应晶体管(FET)和深沟槽电容器,首先准备衬底。 线型有源面积(AAs)在衬底上图案化,从而提供AA线(AAL)。 接下来,以预定配置以AAL制造深沟槽电容器(DTC),从而为DTC定义深沟槽区域(DTAs),每个DTC具有存储节点,套环绝缘体和埋设带。 在随后的步骤中,定义节点隔离区(NIA)以隔离DTC的存储节点及其相邻DTC的存储节点,然后定义每个DRAM单元的沟槽隔离区域(TIA)。 此外,在每个AA中制造一个或多个FET,从而形成DRAM单元的阵列,其中导电路径由一个FET的电极到相应的DTC的掩埋带形成。 根据本发明,由于可以在DTC形成之前形成AAs,所以可以解决或放松所谓的热预算问题; AAs可以非常容易地图案化,因为AAs被图案化为线型; 并且可以通过采用无掩模自对准相邻节点隔离技术来改善DRAM单元中每个AA与相应DTA之间的覆盖边界。