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1. 发明申请

US20070261883A1 Methods For Improving The Flux Compatibility Of Underfill Formulations 审中-公开
标题翻译：提高底层填料配方的助焊剂兼容性的方法
公开(公告)号：US20070261883A1
公开(公告)日：2007-11-15
申请号：US10599875
申请日：2005-04-12
申请人： Bruce Chan , Michael Todd , Maurice Edwards
发明人： Bruce Chan , Michael Todd , Maurice Edwards
IPC分类号： H05K1/02 , B29C65/00
CPC分类号： C08G59/68 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01019 , H01L2924/01021 , H01L2924/01029 , H01L2924/01057 , H01L2924/09701 , H01L2924/351 , Y10T156/10 , H01L2924/00
摘要： In accordance with the present invention, it has been discovered that the addition of one or more cationic catalyst(s), such as onium salts as defined herein, provides improved flux compatibility of underfill formulations in the presence of flux, flux residues and/or reaction products thereof. Accordingly, there are provided methods for improving the flux compatibility of underfill formulations in the presence of flux, flux residues and/or reaction products thereof. In accordance with another embodiment of the present invention, there are provided methods for improving HAST performance of underfill formulations, especially in the presence of flux, flux residues and/or reaction products thereof. In accordance with another embodiment of the present invention, there are provided methods for preparing underfill formulations having improved flux compatibility, especially in the presence of flux, flux residues and/or reaction products thereof. In yet another embodiment of the present invention, there are provided methods for adhesively attaching and/or encapsulating electronic components, especially in the presence of flux, flux residues and/or reaction products thereof. In a further embodiment of the present invention, there are provided articles produced by the above-described processes.
摘要翻译：根据本发明，已经发现，加入一种或多种阳离子催化剂，如本文所定义的鎓盐，在助焊剂，助焊剂残余物和/或氧化物存在的情况下提供了底部填充剂配方的改善的助熔剂相容性其反应产物。因此，提供了在助焊剂，助焊剂残余物和/或其反应产物存在的情况下改善底部填充剂的助熔剂相容性的方法。根据本发明的另一个实施方案，提供了用于改善底部填充剂制剂的HAST性能的方法，特别是在助焊剂，助焊剂残余物和/或其反应产物的存在下。根据本发明的另一个实施方案，提供了制备具有改善的助熔剂相容性的底部填充剂的方法，特别是在助焊剂，助焊剂残余物和/或其反应产物的存在下。在本发明的另一个实施方案中，提供了用于粘合地附着和/或封装电子元件的方法，特别是在助焊剂，助焊剂残余物和/或其反应产物的存在下。在本发明的另一个实施方案中，提供了通过上述方法制备的制品。

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