专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08248809B2 Inverter power module with distributed support for direct substrate cooling 有权
标题翻译：逆变器电源模块具有分布式支持，用于直接衬底冷却
公开(公告)号：US08248809B2
公开(公告)日：2012-08-21
申请号：US12198723
申请日：2008-08-26
申请人： David Harold Miller , Mark D. Korich , Terence G. Ward , Brooks S. Mann
发明人： David Harold Miller , Mark D. Korich , Terence G. Ward , Brooks S. Mann
IPC分类号： H05K5/06
CPC分类号： H01L23/4735 , H01L23/3735 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/4809 , H01L2224/48095 , H01L2224/48137 , H01L2224/48139 , H01L2224/4847 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , Y10T29/53122 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.
摘要翻译：为具有分布式支持直接衬底冷却的逆变器功率模块提供系统和/或方法。逆变器模块包括电力电子基板。第一支撑框架适于容纳电力电子基板，并且具有适于允许电力电子基板的直接冷却的第一区域。在电力电子基板和第一支撑框架之间插入垫圈。垫圈构造成在第一区域和电力电子基板之间提供密封。第二支撑框架适于容纳电力电子基板并且连接到第一支撑框架以形成密封。

2. 发明申请

US20110069466A1 LOW INDUCTANCE POWER ELECTRONICS ASSEMBLY 有权
标题翻译：低电感电力电子装配
公开(公告)号：US20110069466A1
公开(公告)日：2011-03-24
申请号：US12632067
申请日：2009-12-07
申请人： NICHOLAS HAYDEN HERRON , BROOKS S. MANN , MARK D. KORICH , CINDY CHOU , DAVID TANG , DOUGLAS S. CARLSON , ALAN L. BARRY
发明人： NICHOLAS HAYDEN HERRON , BROOKS S. MANN , MARK D. KORICH , CINDY CHOU , DAVID TANG , DOUGLAS S. CARLSON , ALAN L. BARRY
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H02M7/003
摘要： A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.
摘要翻译：提供电力电子组件。第一支撑构件包括第一多个导体。第一多个电力开关装置耦合到第一支撑构件。第一电容器耦合到第一支撑构件。第二支撑构件包括第二多个导体。第二多个电力开关装置耦合到第二支撑构件。第二电容器耦合到第二支撑构件。第一和第二多个导体，第一和第二多个功率开关器件，以及第一和第二电容器电连接，使得第一多个功率开关器件与第一电容器和第二电容器并联连接，第二多个功率开关器件与第二电容器和第一电容器并联连接。

3. 发明申请

US20110042038A1 POWER MODULE ASSEMBLIES WITH STAGGERED COOLANT CHANNELS 有权
标题翻译：功率模块组件与STAGGERED冷却通道
公开(公告)号：US20110042038A1
公开(公告)日：2011-02-24
申请号：US12543271
申请日：2009-08-18
申请人： NICHOLAS HAYDEN HERRON , BROOKS S. MANN , MARK D. KORICH
发明人： NICHOLAS HAYDEN HERRON , BROOKS S. MANN , MARK D. KORICH
IPC分类号： F28D15/00
CPC分类号： H05K7/20927 , H01L2924/0002 , H01L2924/00
摘要： A manifold is provided for supporting a power module assembly with a plurality of power modules. The manifold includes a first manifold section. The first face of the first manifold section is configured to receive the first power module, and the second face of the first manifold section defines a first cavity with a first baseplate thermally coupled to the first power module. The first face of the second manifold section is configured to receive the second power module, and the second face of the second manifold section defines a second cavity with a second baseplate thermally coupled to the second power module. The second face of the first manifold section and the second face of the second manifold section are coupled together such that the first cavity and the second cavity form a coolant channel. The first cavity is at least partially staggered with respect to second cavity.
摘要翻译：提供了用于支撑具有多个功率模块的功率模块组件的歧管。歧管包括第一歧管部分。第一歧管部分的第一面被配置为接收第一功率模块，并且第一歧管部分的第二面限定具有热耦合到第一功率模块的第一基板的第一腔体。第二歧管部分的第一面构造成接收第二功率模块，并且第二歧管部分的第二面限定具有热耦合到第二功率模块的第二基板的第二腔。第一歧管部分的第二面和第二歧管部分的第二面被联接在一起，使得第一腔体和第二腔体形成冷却剂通道。第一腔相对于第二腔至少部分交错。

4. 发明授权

US08488315B2 Power module assemblies with staggered coolant channels 有权
标题翻译：具有交错冷却剂通道的电源模块组件
公开(公告)号：US08488315B2
公开(公告)日：2013-07-16
申请号：US12543271
申请日：2009-08-18
申请人： Nicholas Hayden Herron , Brooks S. Mann , Mark D. Korich
发明人： Nicholas Hayden Herron , Brooks S. Mann , Mark D. Korich
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L2924/0002 , H01L2924/00
摘要： A manifold is provided for supporting a power module assembly with a plurality of power modules. The manifold includes a first manifold section. The first face of the first manifold section is configured to receive the first power module, and the second face of the first manifold section defines a first cavity with a first baseplate thermally coupled to the first power module. The first face of the second manifold section is configured to receive the second power module, and the second face of the second manifold section defines a second cavity with a second baseplate thermally coupled to the second power module. The second face of the first manifold section and the second face of the second manifold section are coupled together such that the first cavity and the second cavity form a coolant channel. The first cavity is at least partially staggered with respect to second cavity.
摘要翻译：提供了用于支撑具有多个功率模块的功率模块组件的歧管。歧管包括第一歧管部分。第一歧管部分的第一面被配置为接收第一功率模块，并且第一歧管部分的第二面限定具有热耦合到第一功率模块的第一基板的第一腔体。第二歧管部分的第一面构造成接收第二功率模块，并且第二歧管部分的第二面限定具有热耦合到第二功率模块的第二基板的第二腔。第一歧管部分的第二面和第二歧管部分的第二面被联接在一起，使得第一腔体和第二腔体形成冷却剂通道。第一腔相对于第二腔至少部分交错。

5. 发明授权

US08169779B2 Power electronics substrate for direct substrate cooling 有权
标题翻译：电子电子基板用于直接基板冷却
公开(公告)号：US08169779B2
公开(公告)日：2012-05-01
申请号：US12638683
申请日：2009-12-15
申请人： Khiet Le , Terence G. Ward , Brooks S. Mann , Edward P. Yankoski , Gregory S. Smith
发明人： Khiet Le , Terence G. Ward , Brooks S. Mann , Edward P. Yankoski , Gregory S. Smith
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L25/072 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
摘要翻译：为适用于直接基板冷却的电力电子基板提供系统和装置。电力电子基板包括被配置为具有设置在其上的电路的第一表面，第二表面和第二表面上的多个物理特征。物理特征被配置为促进撞击在第二表面上的冷却剂中的湍流边界层。

6. 发明申请

US20110168435A1 PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板
公开(公告)号：US20110168435A1
公开(公告)日：2011-07-14
申请号：US12686775
申请日：2010-01-13
申请人： ALAN L. BARRY , ELI B. SMITH , BROOKS S. MANN , NICHOLAS HAYDEN HERRON , MARK D. KORICH , DAVID TANG , CINDY CHOU
发明人： ALAN L. BARRY , ELI B. SMITH , BROOKS S. MANN , NICHOLAS HAYDEN HERRON , MARK D. KORICH , DAVID TANG , CINDY CHOU
IPC分类号： H05K1/09 , H05K1/00
CPC分类号： H05K1/117 , H05K1/0265 , H05K2201/0352 , H05K2201/0919
摘要： A printed circuit board includes, but is not limited to, a plurality of electrically conductive layers and a plurality of dielectric layers. Each dielectric layer is interposed between adjacent conductive layers to form a body of alternate conductive layers and dielectric layers. At least one of the electrically conductive layers protrudes beyond an end of the body.
摘要翻译：印刷电路板包括但不限于多个导电层和多个电介质层。每个电介质层插入相邻的导电层之间以形成交替导电层和电介质层的主体。至少一个导电层突出超过主体的端部。

7. 发明授权

US07847256B2 Secure enclosure 有权
标题翻译：安全外壳
公开(公告)号：US07847256B2
公开(公告)日：2010-12-07
申请号：US12130676
申请日：2008-05-30
申请人： Seok-Joo Jang , Terrence G. Ward , Daniel J. Kaplan , Brooks S. Mann , Louis Thompson
发明人： Seok-Joo Jang , Terrence G. Ward , Daniel J. Kaplan , Brooks S. Mann , Louis Thompson
IPC分类号： G01J1/42
CPC分类号： B60R25/00
摘要： A system is provided for detecting when an enclosure having a body and a removable cover is opened. The system comprises a light source for generating a light beam, a light detector for detecting the light beam, and at least one reflector all mounted inside the enclosure. The reflector reflects the light beam along a predetermined pathway toward the light detector when the removable cover is closed over the body.
摘要翻译：提供一种用于检测何时打开具有主体和可拆卸盖的外壳的系统。该系统包括用于产生光束的光源，用于检测光束的光检测器，以及全部安装在外壳内的至少一个反射器。当可拆卸的盖子关闭在身体上时，反射器将沿着预定路径的光束反射到光检测器。

8. 发明申请

US20100053889A1 INVERTER POWER MODULE FOR WITH DISTRIBUTED SUPPORT FOR DIRECT SUBSTRATE COOLING 有权
标题翻译：用于直接基板冷却的分布式支持的逆变器功率模块
公开(公告)号：US20100053889A1
公开(公告)日：2010-03-04
申请号：US12198723
申请日：2008-08-26
申请人： DAVID HAROLD MILLER , MARK D. KORICH , TERENCE G. WARD , BROOKS S. MANN
发明人： DAVID HAROLD MILLER , MARK D. KORICH , TERENCE G. WARD , BROOKS S. MANN
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： H01L23/4735 , H01L23/3735 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/4809 , H01L2224/48095 , H01L2224/48137 , H01L2224/48139 , H01L2224/4847 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , Y10T29/53122 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.
摘要翻译：为具有分布式支持直接衬底冷却的逆变器功率模块提供系统和/或方法。逆变器模块包括电力电子基板。第一支撑框架适于容纳电力电子基板，并且具有适于允许电力电子基板的直接冷却的第一区域。在电力电子基板和第一支撑框架之间插入垫圈。垫圈构造成在第一区域和电力电子基板之间提供密封。第二支撑框架适于容纳电力电子基板并且连接到第一支撑框架以形成密封件。

9. 发明申请

US20110141690A1 POWER ELECTRONICS SUBSTRATE FOR DIRECT SUBSTRATE COOLING 有权
标题翻译：用于直接基板冷却的电力电子基板
公开(公告)号：US20110141690A1
公开(公告)日：2011-06-16
申请号：US12638683
申请日：2009-12-15
申请人： Khiet LE , Terence G. WARD , Brooks S. MANN , Edward P. YANKOSKI , Gregory S. SMITH
发明人： Khiet LE , Terence G. WARD , Brooks S. MANN , Edward P. YANKOSKI , Gregory S. SMITH
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L25/072 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
摘要翻译：为适用于直接基板冷却的电力电子基板提供系统和装置。电力电子基板包括被配置为具有设置在其上的电路的第一表面，第二表面和第二表面上的多个物理特征。物理特征被配置为促进撞击在第二表面上的冷却剂中的湍流边界层。

10. 发明授权

US07948125B2 System and method for cooling an electric motor 有权
标题翻译：用于冷却电动机的系统和方法
公开(公告)号：US07948125B2
公开(公告)日：2011-05-24
申请号：US12188410
申请日：2008-08-08
申请人： George R. Woody , Brooks S. Mann , Terence G. Ward
发明人： George R. Woody , Brooks S. Mann , Terence G. Ward
IPC分类号： H02K9/00 , H02K5/10
CPC分类号： H02K9/19 , B60K1/02 , B60K6/365 , B60K6/445 , B60K2001/003 , Y02T10/6239
摘要： A cooling system is provided for an electric motor and comprises a rotor assembly, an intake assembly, and a first reservoir. The rotor assembly is coupled to and rotatable within a housing, and comprises a rotor having a first and second ends having a first plurality of veins extending therebetween, each vein having an inlet and an outlet. The rotor assembly also comprises a first manifold coupled to and rotatable with the first end of the rotor in fluid communication with the inlets of the first plurality of veins. The intake assembly is coupled to the housing and is in fluid communication with the first manifold. The first reservoir is configured to contain a motor coolant and is coupled to the housing for collecting the motor coolant from the outlets of the first plurality of veins, and for providing a source of motor coolant to the intake assembly.
摘要翻译：为电动机提供冷却系统，包括转子组件，进气组件和第一储存器。转子组件联接到壳体内并在壳体内可旋转，并且包括具有第一和第二端部的转子，第一和第二端部具有在其间延伸的第一多个静脉，每个静脉具有入口和出口。转子组件还包括联接到转子的第一端并与其旋转的第一歧管，其与第一多个静脉的入口流体连通。进气组件联接到壳体并与第一歧管流体连通。第一储存器构造成包含马达冷却剂并且联接到壳体，用于从第一多个静脉的出口收集马达冷却剂，并且用于向进气组件提供马达冷却剂源。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式